JPWO2017068839A1 - 水晶振動子及びその温度制御方法、並びに水晶発振器 - Google Patents
水晶振動子及びその温度制御方法、並びに水晶発振器 Download PDFInfo
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- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
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- Crystallography & Structural Chemistry (AREA)
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Abstract
Description
図1〜図3を参照しつつ、本発明の第1の実施形態に係る圧電振動子(Piezoelectric Resonator Unit)を説明する。ここで、図1は、圧電振動子の分解斜視図であり、図2は図1のII−II線断面図である。なお、図2において、圧電振動素子(Piezoelectric Resonator)の各種電極の図示は省略している。
図5及び図6を参照しつつ、本発明の第2の実施形態に係る圧電振動子を説明する。ここで、図5は、圧電振動子の分解斜視図であり、図6は図5のVI−VI線断面図である。本実施形態においては、圧電振動素子のパッケージングの態様が第1の実施形態と異なっている。なお、以下の説明においては第1の実施形態の内容と異なる点を説明する。
2 水晶振動子(圧電振動子)
10 圧電振動素子
20 キャップ(リッド部材)
23 内部空間
30 基板(ベース部材)
32a 第1面(搭載面)
32b 第2面
36a 導電保持部材
36b 導電保持部材
38 熱伝導経路
38a 熱伝導部
54a 発振回路
54b 温度センサ
54c 加熱素子
54d 制御回路
60 圧電発振器
50 集積回路素子(電子部品)
70 熱伝導経路
72 第1熱伝導部
74 第2熱伝導部
80 回路基板
90 圧電発振器
102 水晶片
104 枠体
110 水晶振動素子
114a 第1励振電極
114b 第2励振電極
118a 連結部
118b 連結部
Claims (11)
- 搭載面を有するベース部材と、
前記ベース部材の前記搭載面に搭載された圧電振動素子と、
前記圧電振動素子を内部空間に密封封止するように前記ベース部材の前記搭載面に接合されたリッド部材と、
前記圧電振動素子の温度を検知する温度センサと前記圧電振動素子に対して放熱する加熱素子とにそれぞれ接続される、熱伝導経路と
を備え、
前記熱伝導経路は、前記内部空間に配置された熱伝導部を有する、圧電振動子。 - 前記熱伝導部は、前記ベース部材の前記搭載面に配置された、請求項1記載の圧電振動子。
- 前記圧電振動素子は、導電性保持部材を介して前記ベース部材に搭載され、
前記熱伝導部は、前記導電性保持部材を避けて前記圧電振動素子の一部と重なる部分に形成された、請求項1又は2記載の圧電振動子。 - 前記圧電振動素子は水晶振動素子である、請求項1から3のいずれか一項に記載の圧電振動子。
- 前記ベース部材及び前記リッド部材はそれぞれ水晶からなる、請求項4記載の圧電振動子。
- 前記水晶振動素子は、
主面を有する水晶片と、
前記水晶片の主面に形成された励振電極と、
前記水晶片に連結部によって連結されるとともに当該水晶片の外周を囲む枠体と
を含む、請求項5記載の圧電振動子。 - 前記熱伝導部は、前記枠体に形成された、請求項6記載の圧電振動子。
- 前記熱伝導部は、前記連結部に形成された、請求項6記載の圧電振動子。
- 前記熱伝導部は、前記水晶片に形成された、請求項6記載の圧電振動子。
- 請求項1から9のいずれか一項に記載の圧電振動子と、
前記圧電振動素子に電気的に接続された発振回路と、
前記温度センサと、
前記加熱素子と、
前記温度センサ及び前記加熱素子を制御する制御回路と
を備えた、圧電発振器。 - 請求項1から9のいずれか一項に記載の圧電振動子の温度制御方法であって、
(a)前記温度センサによって、前記熱伝導経路の前記熱伝導部を介して前記圧電振動素子の温度を検知すること、
(b)前記(a)において検知した温度に基づいて、前記加熱素子による前記熱伝導経路の前記熱伝導部への供給熱量を決定すること、及び、
(c)前記(b)において決定した供給熱量に基づいて、前記加熱素子によって、前記熱伝導経路の前記熱伝導部を介して前記圧電振動素子に対して放熱することを含む、圧電振動子の温度制御方法。
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PCT/JP2016/073535 WO2017068839A1 (ja) | 2015-10-20 | 2016-08-10 | 圧電振動子及びその温度制御方法、並びに圧電発振器 |
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CN110089028B (zh) * | 2016-12-27 | 2023-01-17 | 株式会社村田制作所 | 谐振装置 |
JP2020123804A (ja) * | 2019-01-30 | 2020-08-13 | セイコーエプソン株式会社 | 発振器、発振器の製造方法、電子機器および移動体 |
JP7161709B2 (ja) * | 2019-03-29 | 2022-10-27 | 株式会社村田製作所 | 電子装置及びその製造方法 |
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CN114223133A (zh) * | 2020-03-30 | 2022-03-22 | 株式会社大真空 | 恒温槽型压电振荡器 |
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US6976295B2 (en) * | 1997-07-29 | 2005-12-20 | Seiko Epson Corporation | Method of manufacturing a piezoelectric device |
US7034441B2 (en) * | 2002-11-13 | 2006-04-25 | Nihon Dempa Kogyo Co., Ltd | Surface mount crystal unit and surface mount crystal oscillator |
JP2010035078A (ja) * | 2008-07-31 | 2010-02-12 | Kyocera Kinseki Corp | 圧電発振器 |
JP4695175B2 (ja) * | 2008-11-14 | 2011-06-08 | 日本電波工業株式会社 | 恒温型の水晶発振器 |
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JP2014146944A (ja) * | 2013-01-29 | 2014-08-14 | Nippon Dempa Kogyo Co Ltd | 水晶振動子、振動子パッケージ及び発振器 |
JP2015089095A (ja) | 2013-02-04 | 2015-05-07 | 日本電波工業株式会社 | 表面実装型の低背発振器 |
JP6182360B2 (ja) * | 2013-06-05 | 2017-08-16 | 日本電波工業株式会社 | 水晶デバイス |
JP5888347B2 (ja) * | 2014-01-21 | 2016-03-22 | 株式会社大真空 | 圧電振動デバイス |
JP6323652B2 (ja) | 2013-12-24 | 2018-05-16 | セイコーエプソン株式会社 | 発熱体、振動デバイス、電子機器及び移動体 |
US10666194B2 (en) * | 2016-07-07 | 2020-05-26 | Nihon Dempa Kogyo Co., Ltd. | Oven-controlled crystal oscillator |
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2016
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CN108141178A (zh) | 2018-06-08 |
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