JPWO2016135938A1 - フラックス - Google Patents
フラックス Download PDFInfo
- Publication number
- JPWO2016135938A1 JPWO2016135938A1 JP2017501786A JP2017501786A JPWO2016135938A1 JP WO2016135938 A1 JPWO2016135938 A1 JP WO2016135938A1 JP 2017501786 A JP2017501786 A JP 2017501786A JP 2017501786 A JP2017501786 A JP 2017501786A JP WO2016135938 A1 JPWO2016135938 A1 JP WO2016135938A1
- Authority
- JP
- Japan
- Prior art keywords
- added
- acid
- flux
- mass
- alkanolamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004907 flux Effects 0.000 title claims abstract description 53
- 150000007524 organic acids Chemical class 0.000 claims abstract description 18
- 239000002253 acid Substances 0.000 claims abstract description 15
- -1 amine compound Chemical class 0.000 claims abstract description 14
- 150000003839 salts Chemical class 0.000 claims abstract description 13
- 239000002904 solvent Substances 0.000 claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- ZVVSSOQAYNYNPP-UHFFFAOYSA-N olaflur Chemical class F.F.CCCCCCCCCCCCCCCCCCN(CCO)CCCN(CCO)CCO ZVVSSOQAYNYNPP-UHFFFAOYSA-N 0.000 claims description 19
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 10
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 10
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 10
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- 229920000178 Acrylic resin Polymers 0.000 claims description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 5
- 150000002148 esters Chemical class 0.000 claims description 5
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 4
- 229910015900 BF3 Inorganic materials 0.000 claims description 4
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 claims description 4
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Substances FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 claims description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 claims description 4
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 claims description 4
- CWKVFRNCODQPDB-UHFFFAOYSA-N 1-(2-aminoethylamino)propan-2-ol Chemical compound CC(O)CNCCN CWKVFRNCODQPDB-UHFFFAOYSA-N 0.000 claims description 2
- NXNQLKPBPWLUSX-UHFFFAOYSA-N 1-[2-(2-hydroxypropylamino)ethylamino]propan-2-ol Chemical compound CC(O)CNCCNCC(C)O NXNQLKPBPWLUSX-UHFFFAOYSA-N 0.000 claims description 2
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 2
- KTLIZDDPOZZHCD-UHFFFAOYSA-N 3-(2-aminoethylamino)propan-1-ol Chemical compound NCCNCCCO KTLIZDDPOZZHCD-UHFFFAOYSA-N 0.000 claims description 2
- ZFQWBNSJGLZLCX-UHFFFAOYSA-N 3-[2-(3-hydroxypropylamino)ethylamino]propan-1-ol Chemical compound OCCCNCCNCCCO ZFQWBNSJGLZLCX-UHFFFAOYSA-N 0.000 claims description 2
- ORAJHYSVXOYBCP-UHFFFAOYSA-N 3-[2-[bis(3-hydroxypropyl)amino]ethyl-(3-hydroxypropyl)amino]propan-1-ol Chemical compound OCCCN(CCCO)CCN(CCCO)CCCO ORAJHYSVXOYBCP-UHFFFAOYSA-N 0.000 claims description 2
- 235000021314 Palmitic acid Nutrition 0.000 claims description 2
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 claims description 2
- 235000021355 Stearic acid Nutrition 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 claims description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 2
- LVTYICIALWPMFW-UHFFFAOYSA-N diisopropanolamine Chemical compound CC(O)CNCC(C)O LVTYICIALWPMFW-UHFFFAOYSA-N 0.000 claims description 2
- 229940043276 diisopropanolamine Drugs 0.000 claims description 2
- 150000002357 guanidines Chemical class 0.000 claims description 2
- 150000002460 imidazoles Chemical class 0.000 claims description 2
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 2
- 150000003222 pyridines Chemical class 0.000 claims description 2
- 239000008117 stearic acid Substances 0.000 claims description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 24
- 238000000576 coating method Methods 0.000 abstract description 24
- 238000005260 corrosion Methods 0.000 abstract description 23
- 230000007797 corrosion Effects 0.000 abstract description 23
- 239000011347 resin Substances 0.000 abstract description 17
- 229920005989 resin Polymers 0.000 abstract description 17
- 239000012190 activator Substances 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 description 18
- 229910052782 aluminium Inorganic materials 0.000 description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 17
- 229910000679 solder Inorganic materials 0.000 description 15
- 229910000838 Al alloy Inorganic materials 0.000 description 9
- 229920002635 polyurethane Polymers 0.000 description 8
- 239000004814 polyurethane Substances 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002585 base Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 229910020938 Sn-Ni Inorganic materials 0.000 description 2
- 229910008937 Sn—Ni Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 150000004668 long chain fatty acids Chemical class 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001414 amino alcohols Chemical class 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3603—Halide salts
- B23K35/3605—Fluorides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Paints Or Removers (AREA)
Abstract
Description
(a)はんだ付け性
直径がφ0.55mmのポリウレタン被覆アルミニウム線を、被覆を除去せずにSn−NiめっきCuピンに巻き付けて試験片を作成した。この試験片を、370℃で溶融させたはんだに5秒間漬けて、被覆を溶かして除去した。
銅板にフラックスを塗布し、温度40℃、相対湿度95%の環境で96時間放置した。
(a)はんだ付け性
◎:良好にはんだ付けされている
○:小さいがぬれ広がる
△:付いてはいるが広がっていない
×:はんだが付いていない
(b)腐食性
○:腐食が見られなかった
△:一部に腐食が見られた
×:腐食が見られた
Claims (5)
- アルカノールアミンが10〜20質量%、アミンフッ化物塩及び/またはアミン三フッ化ホウ素錯体が5〜10質量%、アルカノールアミンを中和し、水に溶けにくい塩を生成する有機酸が10〜20質量%、溶剤が50〜75質量%添加された
ことを特徴とするフラックス。 - 水に不溶なアクリル樹脂、あるいは、酸価が30以下のロジンエステルが、0〜5質量%添加された
ことを特徴とする請求項1に記載のフラックス。 - アルカノールアミンとしてエタノールアミン、3−アミノ−1−プロパノール、1−アミノ−2−プロパノール、ジエタノールアミン、ジイソプロパノールアミン、トリエタノールアミン、トリイソプロパノールアミン、N−(2−ヒドロキシプロピル)エチレンジアミン、N−(3−ヒドロキシプロピル)エチレンジアミン、N,N'−ビス(2−ヒドロキシプロピル)エチレンジアミン、N,N'−ビス(3−ヒドロキシプロピル)エチレンジアミン、N,N,N',N'−テトラキス(2−ヒドロキシプロピル)エチレンジアミン、N,N,N',N'−テトラキス(3−ヒドロキシプロピル)エチレンジアミンが添加される
ことを特徴とする請求項1または請求項2に記載のフラックス。 - アミンフッ化物塩としてピリジン誘導体、イミダゾール誘導体、グアニジン誘導体、エチルアミン、ピペコリンの何れかのアミン化合物と、フッ化水素酸、ホウフッ化水素酸、ヘキサフルオロケイ酸の何れかの酸によって生成される塩が添加される
ことを特徴とする請求項1または請求項2に記載のフラックス。 - 有機酸としてパルミチン酸、ステアリン酸、アラキジン酸が添加される
ことを特徴とする請求項1または請求項2に記載のフラックス。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/055782 WO2016135938A1 (ja) | 2015-02-27 | 2015-02-27 | フラックス |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016135938A1 true JPWO2016135938A1 (ja) | 2017-07-13 |
JP6176417B2 JP6176417B2 (ja) | 2017-08-09 |
Family
ID=56787986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017501786A Active JP6176417B2 (ja) | 2015-02-27 | 2015-02-27 | フラックス |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3263272B1 (ja) |
JP (1) | JP6176417B2 (ja) |
CN (1) | CN107249812B (ja) |
WO (1) | WO2016135938A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108687463B (zh) * | 2017-03-30 | 2021-09-21 | 株式会社田村制作所 | 预涂层用焊料组合物、印刷布线基板的制造方法、焊料组合物及电子基板的制造方法 |
JP6628759B2 (ja) * | 2017-03-30 | 2020-01-15 | 株式会社タムラ製作所 | プリコート用はんだ組成物およびプリント配線基板の製造方法 |
JP6583391B2 (ja) | 2017-11-14 | 2019-10-02 | 千住金属工業株式会社 | フラックス、やに入りはんだおよびフラックスコートペレット |
JP6390989B1 (ja) * | 2017-11-24 | 2018-09-19 | 千住金属工業株式会社 | フラックス及びソルダペースト |
JP6536730B1 (ja) * | 2018-08-10 | 2019-07-03 | 千住金属工業株式会社 | フラックス及びはんだペースト |
US20230201945A1 (en) * | 2018-11-20 | 2023-06-29 | Averatek Corporation | Printable surface treatment for aluminum bonding |
WO2020203794A1 (ja) * | 2019-03-29 | 2020-10-08 | 千住金属工業株式会社 | はんだ付け用樹脂組成物、はんだ組成物及びやに入りはんだ、フラックス及びソルダペースト |
CN110328467B (zh) * | 2019-07-06 | 2021-10-29 | 浙江强力控股有限公司 | 一种助焊剂及其制备方法 |
JP6928294B1 (ja) * | 2020-10-02 | 2021-09-01 | 千住金属工業株式会社 | ソルダペースト |
JP7239865B1 (ja) * | 2022-08-26 | 2023-03-15 | 千住金属工業株式会社 | フラックス及び接合体の製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06155078A (ja) * | 1992-07-10 | 1994-06-03 | Sony Corp | はんだ付け用フラックス |
WO2013187363A1 (ja) * | 2012-06-11 | 2013-12-19 | 千住金属工業株式会社 | フラックス組成物、液状フラックス、やに入りはんだ及びソルダペースト |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2107362A (en) * | 1981-10-16 | 1983-04-27 | Multicore Solders Ltd | Liquid fluxes for use in soldering |
JP3732725B2 (ja) * | 2000-08-09 | 2006-01-11 | 石川金属株式会社 | フラックス |
CN101214594A (zh) * | 2007-12-28 | 2008-07-09 | 潘惠凯 | 一种环保型无铅焊料水基助焊剂及其制备方法 |
CN101992366A (zh) * | 2010-11-19 | 2011-03-30 | 东莞市普赛特电子科技有限公司 | 酸性弱腐蚀小的无卤水溶性助焊剂 |
CN102357748A (zh) * | 2011-10-18 | 2012-02-22 | 苏州之侨新材料科技有限公司 | 一种无铅焊料用无卤素无松香抗菌型免清洗助焊剂 |
JP6196036B2 (ja) * | 2012-12-26 | 2017-09-13 | ハリマ化成株式会社 | フラックスおよびはんだペースト |
-
2015
- 2015-02-27 CN CN201580076805.7A patent/CN107249812B/zh active Active
- 2015-02-27 JP JP2017501786A patent/JP6176417B2/ja active Active
- 2015-02-27 EP EP15883232.9A patent/EP3263272B1/en not_active Not-in-force
- 2015-02-27 WO PCT/JP2015/055782 patent/WO2016135938A1/ja active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06155078A (ja) * | 1992-07-10 | 1994-06-03 | Sony Corp | はんだ付け用フラックス |
WO2013187363A1 (ja) * | 2012-06-11 | 2013-12-19 | 千住金属工業株式会社 | フラックス組成物、液状フラックス、やに入りはんだ及びソルダペースト |
Also Published As
Publication number | Publication date |
---|---|
CN107249812B (zh) | 2018-11-02 |
WO2016135938A1 (ja) | 2016-09-01 |
CN107249812A (zh) | 2017-10-13 |
EP3263272B1 (en) | 2020-04-01 |
EP3263272A4 (en) | 2018-10-10 |
JP6176417B2 (ja) | 2017-08-09 |
EP3263272A1 (en) | 2018-01-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6176417B2 (ja) | フラックス | |
JP5435186B1 (ja) | フラックス組成物、液状フラックス、やに入りはんだ及びソルダペースト | |
JP5452020B2 (ja) | 鉛フリーハンダフラックス除去用洗浄剤組成物、鉛フリーハンダフラックス除去用すすぎ剤、及び鉛フリーハンダフラックスの除去方法 | |
JP6243792B2 (ja) | はんだが固化された回路基板の製造方法、電子部品が搭載された回路基板の製造方法、及び、フラックス用洗浄剤組成物 | |
JP6222412B1 (ja) | フラックス | |
JP2004501765A (ja) | カチオン性界面活性剤を含むろう接用フラックス | |
JP6426741B2 (ja) | アルミニウムへの接合 | |
JP2008062252A (ja) | はんだ付け用フラックスおよびはんだペースト組成物 | |
KR101935758B1 (ko) | 플럭스 | |
JP5209825B2 (ja) | はんだ付け用フラックスおよびはんだペースト組成物 | |
CN114434047B (zh) | 一种铟基钎料低温焊接用助焊剂及其制备方法 | |
JPWO2002038328A1 (ja) | 水溶性フラックス組成物及びハンダ付部品の製造方法 | |
JP2019042788A (ja) | フラックス | |
WO2019098169A1 (ja) | フラックス、やに入りはんだおよびフラックスコートペレット | |
KR101671525B1 (ko) | 땜납용 플럭스 조성물 | |
JP5604374B2 (ja) | はんだ付け用フラックスおよびはんだペースト組成物 | |
KR20130071985A (ko) | 땜납 플럭스 제거용 세정제 조성물 | |
JP2019042811A (ja) | フラックス | |
JP2009248189A (ja) | 半田コテ先チップ侵食防止剤 | |
KR20130071984A (ko) | 땜납 플럭스 제거용 세정제 조성물 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170417 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170417 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20170417 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20170425 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170613 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170626 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6176417 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |