JPWO2016024364A1 - 実装装置および測定方法 - Google Patents
実装装置および測定方法 Download PDFInfo
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- JPWO2016024364A1 JPWO2016024364A1 JP2016542493A JP2016542493A JPWO2016024364A1 JP WO2016024364 A1 JPWO2016024364 A1 JP WO2016024364A1 JP 2016542493 A JP2016542493 A JP 2016542493A JP 2016542493 A JP2016542493 A JP 2016542493A JP WO2016024364 A1 JPWO2016024364 A1 JP WO2016024364A1
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- Prior art keywords
- holding surface
- mounting
- mounting tool
- measurement jig
- inclination
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- 238000000034 method Methods 0.000 title claims description 29
- 238000005259 measurement Methods 0.000 claims abstract description 121
- 230000007246 mechanism Effects 0.000 claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 238000001514 detection method Methods 0.000 claims abstract description 13
- 239000004065 semiconductor Substances 0.000 description 32
- 238000007689 inspection Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 8
- 239000000428 dust Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000009429 electrical wiring Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/24—Measuring arrangements characterised by the use of mechanical techniques for measuring angles or tapers; for testing the alignment of axes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
Abstract
Description
Claims (6)
- 電子部品を基板に実装する実装装置であって、
前記電子部品を先端面である保持面で保持する実装ツールと、
前記実装ツールを前記基板に対して相対的に移動させる移動機構と、
前記保持面に保持された平板状の測定ジグと、
前記ジグの傾きを測定する角度検出機構と、
前記実装装置の駆動を制御する制御部と、
を備え、
前記制御部は、前記保持面の検査のときに、前記実装ツールに前記測定ジグを保持させるとともに、前記角度検出機構に前記測定ジグの傾きを測定させる実装装置。 - 請求項1に記載の実装装置であって、
前記角度検出機構は、
前記保持面に向かって突出し、固定された接触ピンと、
前記保持面に保持された前記測定ジグの表面の複数個所に前記接触ピンを順次接触させた際の前記実装ツールの相対的な位置情報に基づいて、前記測定ジグの傾きを演算する演算部と、
を含む実装装置。 - 請求項1または2に記載の実装装置であって、
前記制御部は、前記測定された傾きに基づいて、前記保持面の傾きを調整する実装装置。 - 請求項1または2に記載の実装装置であって、
前記実装ツールは、当該実装ツールの姿勢をロックまたはロック解除するツール支持機構をさらに備えており、
前記制御部は、前記ツール支持機構による前記実装ツールの姿勢ロックを解除した状態で、前記測定ジグを介して前記保持面の一部を、前記接触ピンに押しつけることで、前記保持面の傾きを調整する実装装置。 - 請求項1から4のいずれか1項に記載の実装装置であって、
前記測定ジグは、前記保持面全体を覆うサイズである実装装置。 - 電子部品を基板に実装する実装装置を用いて、前記電子部品を保持する実装ツールの保持面の状態を測定する測定方法であって、
前記電子部品を先端面である前記保持面で保持する実装ツールと、前記保持面に保持された平板状の測定ジグの傾きを測定する角度検出機構と、を含む前記実装装置を準備する工程と、
前記実装ツールの前記保持面で、前記平板状の前記測定ジグを保持する工程と、
前記実装装置に搭載された前記角度検出機構を用いて前記測定ジグの傾きを測定する工程と、
前記保持された前記測定ジグの傾きに基づいて前記保持面の良否を判断する工程と、
を含む測定方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014165019 | 2014-08-13 | ||
JP2014165019 | 2014-08-13 | ||
PCT/JP2014/076313 WO2016024364A1 (ja) | 2014-08-13 | 2014-10-01 | 実装装置および測定方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016024364A1 true JPWO2016024364A1 (ja) | 2017-06-15 |
JP6422499B2 JP6422499B2 (ja) | 2018-11-14 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016542493A Active JP6422499B2 (ja) | 2014-08-13 | 2014-10-01 | 実装装置および測定方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10492351B2 (ja) |
JP (1) | JP6422499B2 (ja) |
KR (1) | KR101972363B1 (ja) |
CN (1) | CN107079619B (ja) |
SG (1) | SG11201701130TA (ja) |
TW (1) | TWI602479B (ja) |
WO (1) | WO2016024364A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101972363B1 (ko) * | 2014-08-13 | 2019-08-16 | 가부시키가이샤 신가와 | 실장 장치 및 측정 방법 |
JP7033878B2 (ja) * | 2017-10-16 | 2022-03-11 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
KR102038355B1 (ko) * | 2018-04-24 | 2019-10-30 | 스테코 주식회사 | 틀어짐이 방지되는 이너리드 본딩 장치 |
DE102018115144A1 (de) * | 2018-06-23 | 2019-12-24 | Besi Switzerland Ag | Stellantrieb für einen Bondkopf |
EP3860329B1 (en) * | 2018-09-27 | 2024-01-10 | Fuji Corporation | Component supply apparatus |
US11121113B2 (en) * | 2020-01-16 | 2021-09-14 | Asm Technology Singapore Pte Ltd | Bonding apparatus incorporating variable force distribution |
CN115668468A (zh) * | 2020-05-19 | 2023-01-31 | 株式会社新川 | 接合装置以及接合头调整方法 |
US20220412733A1 (en) * | 2020-07-30 | 2022-12-29 | Shinkawa Ltd. | Mounting apparatus and parallelism detection method in mounting apparatus |
CN114981938A (zh) * | 2020-12-14 | 2022-08-30 | 株式会社新川 | 半导体装置的制造装置及制造方法 |
WO2022176183A1 (ja) * | 2021-02-22 | 2022-08-25 | 株式会社新川 | 実装装置及び実装装置における平行度検出方法 |
WO2024079975A1 (ja) * | 2022-10-14 | 2024-04-18 | 株式会社新川 | 半導体装置の製造装置および部材の吸引方法 |
CN116387209B (zh) * | 2023-06-06 | 2023-09-05 | 北京中科同志科技股份有限公司 | 芯片封装系统及芯片封装方法 |
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-
2014
- 2014-10-01 KR KR1020177006672A patent/KR101972363B1/ko active IP Right Grant
- 2014-10-01 SG SG11201701130TA patent/SG11201701130TA/en unknown
- 2014-10-01 CN CN201480082135.5A patent/CN107079619B/zh active Active
- 2014-10-01 WO PCT/JP2014/076313 patent/WO2016024364A1/ja active Application Filing
- 2014-10-01 JP JP2016542493A patent/JP6422499B2/ja active Active
- 2014-10-15 TW TW103135595A patent/TWI602479B/zh active
-
2017
- 2017-02-13 US US15/430,562 patent/US10492351B2/en active Active
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JPH07303000A (ja) * | 1994-05-06 | 1995-11-14 | Matsushita Electric Ind Co Ltd | Ic部品実装方法及び装置 |
JP2000301421A (ja) * | 1999-04-21 | 2000-10-31 | Sony Corp | 電子部品実装機における部品吸着装置及び部品吸着方法 |
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Also Published As
Publication number | Publication date |
---|---|
US20170156244A1 (en) | 2017-06-01 |
JP6422499B2 (ja) | 2018-11-14 |
US10492351B2 (en) | 2019-11-26 |
CN107079619B (zh) | 2020-07-17 |
SG11201701130TA (en) | 2017-03-30 |
KR20170041864A (ko) | 2017-04-17 |
CN107079619A (zh) | 2017-08-18 |
KR101972363B1 (ko) | 2019-08-16 |
WO2016024364A1 (ja) | 2016-02-18 |
TWI602479B (zh) | 2017-10-11 |
TW201607389A (zh) | 2016-02-16 |
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