SG11201701130TA - Mounting device and measurement method - Google Patents
Mounting device and measurement methodInfo
- Publication number
- SG11201701130TA SG11201701130TA SG11201701130TA SG11201701130TA SG11201701130TA SG 11201701130T A SG11201701130T A SG 11201701130TA SG 11201701130T A SG11201701130T A SG 11201701130TA SG 11201701130T A SG11201701130T A SG 11201701130TA SG 11201701130T A SG11201701130T A SG 11201701130TA
- Authority
- SG
- Singapore
- Prior art keywords
- measurement method
- mounting device
- mounting
- measurement
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/24—Measuring arrangements characterised by the use of mechanical techniques for measuring angles or tapers; for testing the alignment of axes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014165019 | 2014-08-13 | ||
PCT/JP2014/076313 WO2016024364A1 (ja) | 2014-08-13 | 2014-10-01 | 実装装置および測定方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201701130TA true SG11201701130TA (en) | 2017-03-30 |
Family
ID=55304006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201701130TA SG11201701130TA (en) | 2014-08-13 | 2014-10-01 | Mounting device and measurement method |
Country Status (7)
Country | Link |
---|---|
US (1) | US10492351B2 (ja) |
JP (1) | JP6422499B2 (ja) |
KR (1) | KR101972363B1 (ja) |
CN (1) | CN107079619B (ja) |
SG (1) | SG11201701130TA (ja) |
TW (1) | TWI602479B (ja) |
WO (1) | WO2016024364A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016024364A1 (ja) * | 2014-08-13 | 2016-02-18 | 株式会社新川 | 実装装置および測定方法 |
JP7033878B2 (ja) * | 2017-10-16 | 2022-03-11 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
KR102038355B1 (ko) * | 2018-04-24 | 2019-10-30 | 스테코 주식회사 | 틀어짐이 방지되는 이너리드 본딩 장치 |
DE102018115144A1 (de) * | 2018-06-23 | 2019-12-24 | Besi Switzerland Ag | Stellantrieb für einen Bondkopf |
US20220039304A1 (en) * | 2018-09-27 | 2022-02-03 | Fuji Corporation | Component supply apparatus |
US11121113B2 (en) * | 2020-01-16 | 2021-09-14 | Asm Technology Singapore Pte Ltd | Bonding apparatus incorporating variable force distribution |
US20230197670A1 (en) * | 2020-05-19 | 2023-06-22 | Shinkawa Ltd. | Bonding device and adjustment method for bonding head |
CN114364940A (zh) * | 2020-07-30 | 2022-04-15 | 株式会社新川 | 安装装置以及安装装置中的平行度检测方法 |
CN114981938A (zh) * | 2020-12-14 | 2022-08-30 | 株式会社新川 | 半导体装置的制造装置及制造方法 |
KR20230074260A (ko) * | 2021-02-22 | 2023-05-26 | 가부시키가이샤 신가와 | 실장 장치 및 실장 장치에서의 평행도 검출 방법 |
JP2024058157A (ja) * | 2022-10-14 | 2024-04-25 | 株式会社新川 | 半導体装置の製造装置および部材の吸引方法 |
CN116387209B (zh) * | 2023-06-06 | 2023-09-05 | 北京中科同志科技股份有限公司 | 芯片封装系统及芯片封装方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0476931A (ja) * | 1990-07-18 | 1992-03-11 | Sumitomo Electric Ind Ltd | 半導体素子実装装置 |
US5454170A (en) * | 1994-03-02 | 1995-10-03 | Vlsi Technology Inc. | Robot to pedestal alignment head |
JP3295529B2 (ja) * | 1994-05-06 | 2002-06-24 | 松下電器産業株式会社 | Ic部品実装方法及び装置 |
JP2000091360A (ja) * | 1998-09-10 | 2000-03-31 | Sanyo Electric Co Ltd | ボンディング装置及びボンディングヘッドの平面出し方法 |
JP3367435B2 (ja) * | 1998-11-24 | 2003-01-14 | 住友電装株式会社 | 電子部品の高さおよび傾き検知治具および電子部品の高さおよび傾き検知方法 |
JP2000301421A (ja) * | 1999-04-21 | 2000-10-31 | Sony Corp | 電子部品実装機における部品吸着装置及び部品吸着方法 |
JP4768147B2 (ja) * | 2001-04-27 | 2011-09-07 | Nec液晶テクノロジー株式会社 | 液晶表示装置の製造装置 |
DE10217028C1 (de) * | 2002-04-11 | 2003-11-20 | Nanophotonics Ag | Meßmodul für Waferfertigungsanlagen |
US6870382B2 (en) * | 2002-05-03 | 2005-03-22 | Texas Instruments Incorporated | System and method for evaluating the planarity and parallelism of an array of probe tips |
CH696615A5 (de) * | 2003-09-22 | 2007-08-15 | Esec Trading Sa | Verfahren für die Justierung des Bondkopfs eines Die Bonders. |
TW200628029A (en) * | 2004-12-06 | 2006-08-01 | Matsushita Electric Ind Co Ltd | Component mounting apparatus and component mounting method |
JP4748118B2 (ja) * | 2007-06-14 | 2011-08-17 | パナソニック株式会社 | 電子部品実装用装置および電子部品実装用装置における基板下受け方法 |
US7567885B2 (en) * | 2007-08-23 | 2009-07-28 | Sokudo Co., Ltd. | Method and system for determining object height |
CN101877939A (zh) * | 2009-04-29 | 2010-11-03 | 元港 | 电路板固定夹具 |
KR101387295B1 (ko) * | 2012-05-14 | 2014-04-18 | 삼성전기주식회사 | 카메라 모듈의 제조 장치 및 방법 |
KR101332082B1 (ko) * | 2012-06-18 | 2013-11-22 | 삼성전기주식회사 | 카메라 모듈의 제조장치 |
JP2014017328A (ja) * | 2012-07-06 | 2014-01-30 | Tdk Corp | 実装装置および測定方法 |
JP5999809B2 (ja) * | 2012-07-20 | 2016-09-28 | 富士機械製造株式会社 | 部品実装機 |
JP5997990B2 (ja) * | 2012-09-13 | 2016-09-28 | ヤマハ発動機株式会社 | 電子部品用実装装置および電子部品用実装装置の使用方法 |
US9146090B2 (en) * | 2013-11-14 | 2015-09-29 | Globalfoundries Inc. | Nozzle alignment tool for a fluid dispensing apparatus |
WO2016024364A1 (ja) * | 2014-08-13 | 2016-02-18 | 株式会社新川 | 実装装置および測定方法 |
US10269758B2 (en) * | 2015-12-24 | 2019-04-23 | Intel Corporation | Systems and processes for measuring thickness values of semiconductor substrates |
KR102425309B1 (ko) * | 2016-10-12 | 2022-07-26 | 삼성전자주식회사 | 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더 |
US10050008B1 (en) * | 2017-01-24 | 2018-08-14 | Asm Technology Singapore Pte Ltd | Method and system for automatic bond arm alignment |
-
2014
- 2014-10-01 WO PCT/JP2014/076313 patent/WO2016024364A1/ja active Application Filing
- 2014-10-01 JP JP2016542493A patent/JP6422499B2/ja active Active
- 2014-10-01 CN CN201480082135.5A patent/CN107079619B/zh active Active
- 2014-10-01 SG SG11201701130TA patent/SG11201701130TA/en unknown
- 2014-10-01 KR KR1020177006672A patent/KR101972363B1/ko active IP Right Grant
- 2014-10-15 TW TW103135595A patent/TWI602479B/zh active
-
2017
- 2017-02-13 US US15/430,562 patent/US10492351B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10492351B2 (en) | 2019-11-26 |
US20170156244A1 (en) | 2017-06-01 |
WO2016024364A1 (ja) | 2016-02-18 |
JPWO2016024364A1 (ja) | 2017-06-15 |
JP6422499B2 (ja) | 2018-11-14 |
CN107079619B (zh) | 2020-07-17 |
TW201607389A (zh) | 2016-02-16 |
TWI602479B (zh) | 2017-10-11 |
KR101972363B1 (ko) | 2019-08-16 |
KR20170041864A (ko) | 2017-04-17 |
CN107079619A (zh) | 2017-08-18 |
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