JPWO2014106944A1 - 合金材料の研磨方法及び合金材料の製造方法 - Google Patents
合金材料の研磨方法及び合金材料の製造方法 Download PDFInfo
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- JPWO2014106944A1 JPWO2014106944A1 JP2014555457A JP2014555457A JPWO2014106944A1 JP WO2014106944 A1 JPWO2014106944 A1 JP WO2014106944A1 JP 2014555457 A JP2014555457 A JP 2014555457A JP 2014555457 A JP2014555457 A JP 2014555457A JP WO2014106944 A1 JPWO2014106944 A1 JP WO2014106944A1
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- 229920003303 ion-exchange polymer Polymers 0.000 description 1
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- 239000011133 lead Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
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- 239000007769 metal material Substances 0.000 description 1
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- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- RMIODHQZRUFFFF-UHFFFAOYSA-N methoxyacetic acid Chemical compound COCC(O)=O RMIODHQZRUFFFF-UHFFFAOYSA-N 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 150000002918 oxazolines Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000007591 painting process Methods 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001282 polysaccharide Polymers 0.000 description 1
- 239000005017 polysaccharide Substances 0.000 description 1
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- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- MWNQXXOSWHCCOZ-UHFFFAOYSA-L sodium;oxido carbonate Chemical compound [Na+].[O-]OC([O-])=O MWNQXXOSWHCCOZ-UHFFFAOYSA-L 0.000 description 1
- 239000001593 sorbitan monooleate Substances 0.000 description 1
- 235000011069 sorbitan monooleate Nutrition 0.000 description 1
- 229940035049 sorbitan monooleate Drugs 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- UJJLJRQIPMGXEZ-UHFFFAOYSA-N tetrahydro-2-furoic acid Chemical compound OC(=O)C1CCCO1 UJJLJRQIPMGXEZ-UHFFFAOYSA-N 0.000 description 1
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical class C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 1
- 150000003536 tetrazoles Chemical class 0.000 description 1
- UAXOELSVPTZZQG-UHFFFAOYSA-N tiglic acid Natural products CC(C)=C(C)C(O)=O UAXOELSVPTZZQG-UHFFFAOYSA-N 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- AQLJVWUFPCUVLO-UHFFFAOYSA-N urea hydrogen peroxide Chemical compound OO.NC(N)=O AQLJVWUFPCUVLO-UHFFFAOYSA-N 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/06—Alloys based on aluminium with magnesium as the next major constituent
- C22C21/08—Alloys based on aluminium with magnesium as the next major constituent with silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/20—Acidic compositions for etching aluminium or alloys thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
平均粒子径が78nmの表面修飾されていないコロイダルシリカを水で希釈し、さらに酸化剤を加えることにより、組成1〜4の研磨用組成物を調製した。組成5の研磨用組成物は酸化剤を加えずに調製した。各研磨用組成物について、コロイダルシリカの濃度と平均粒子径、酸化剤の種類と濃度、並びにpHを表2に示す。
各研磨用組成物を用いた研磨の前後に合金の重量を測定した。研磨前後の重量の差から研磨速度を算出した。その結果を下記表3の「研磨速度」の欄に示す。
研磨後の合金材料の研磨面における表面粗さを示す「Ra」を、JIS B0601:2001に記載の方法に基づき、表面形状測定機(商品名:ZYGO New View 5000 5032、Zygo社製)を用い、測定範囲を1.4mm×1.1mmに設定して測定した。「Ra」は、粗さ曲線の高さ方向の振幅の平均を示すパラメータであって、一定視野内での合金材料表面の高さの算術平均を示す。測定結果を下記表3の「表面粗さRa」の欄に示す。
半透明のプラスチックボトルに各例で使用する研磨用組成物を充填し、25℃の雰囲気下で7日間保存した。その後、研磨用組成物が入ったプラスチックボトルの外観より、内容物の変化の有無を目視で確認した。変化がなければ保管安定性が良好(○)であると評価し、沈殿又は凝集等の何らかの変化があった場合には保管安定性が不良(×)であると評価した。結果を下記表3の「安定性」の欄に示す。
Claims (10)
- 主成分及び前記主成分とはビッカース硬度(HV)が5以上異なる副成分の元素を0.5質量%以上含む合金材料の研磨方法であって、
砥粒及びオキソ酸系酸化剤を含有する研磨用組成物を使用して前記合金材料の表面を研磨することを特徴とする合金材料の研磨方法。 - 前記合金材料の主成分がアルミニウム、チタン、鉄、ニッケル、及び銅から選ばれる少なくとも1種である請求項1に記載の合金材料の研磨方法。
- 前記合金材料の主成分がアルミニウムであり、副成分の元素が、ケイ素、マグネシウム、鉄、銅、及び亜鉛から選ばれる少なくとも1種である請求項1又は2に記載の合金材料の研磨方法。
- 前記オキソ酸系酸化剤が硝酸、亜硝酸、次亜塩素酸、シュウ酸、及びそれらの塩から選ばれる少なくとも1種である請求項1〜3のいずれか1項に記載の合金材料の研磨方法。
- 前記オキソ酸系酸化剤が硝酸及びその塩から選ばれる少なくとも一種である請求項1〜3のいずれか1項に記載の合金材料の研磨方法。
- 前記砥粒がコロイダルシリカである請求項1〜5のいずれか1項に記載の合金材料の研磨方法。
- 前記研磨用組成物を使用して前記合金材料を研磨する前に、予備研磨用組成物を用いて前記合金材料を予備研磨する工程を含む、請求項1〜6のいずれか1項に記載の合金材料の研磨方法。
- 請求項1〜7のいずれか1項に記載の合金材料の研磨方法を用いて合金材料を研磨する工程を含む、合金材料の製造方法。
- 請求項8に記載の製造方法を用いて製造される合金材料。
- 請求項1〜7のいずれか1項に記載の合金材料の研磨方法に用いられる研磨用組成物であって、
砥粒及びオキソ酸系酸化剤を含有することを特徴とする研磨用組成物。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013000060 | 2013-01-04 | ||
JP2013000060 | 2013-01-04 | ||
PCT/JP2013/084981 WO2014106944A1 (ja) | 2013-01-04 | 2013-12-26 | 合金材料の研磨方法及び合金材料の製造方法 |
Publications (2)
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EP (1) | EP2942152A4 (ja) |
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CN106574170A (zh) * | 2014-08-07 | 2017-04-19 | 福吉米株式会社 | 钛合金材料研磨用组合物 |
KR102509973B1 (ko) * | 2021-05-07 | 2023-03-14 | 에스케이엔펄스 주식회사 | 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법 |
CN115928074B (zh) * | 2022-12-12 | 2024-08-23 | 昆明理工大学 | 一种Al-Mg-Si合金晶界腐蚀液 |
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- 2013-12-26 KR KR1020157020486A patent/KR20150103169A/ko not_active Application Discontinuation
- 2013-12-26 WO PCT/JP2013/084981 patent/WO2014106944A1/ja active Application Filing
- 2013-12-26 JP JP2014555457A patent/JP6622963B2/ja active Active
- 2013-12-26 EP EP13869930.1A patent/EP2942152A4/en not_active Withdrawn
- 2013-12-26 CN CN201380069121.5A patent/CN104903052A/zh active Pending
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US20150360340A1 (en) | 2015-12-17 |
CN104903052A (zh) | 2015-09-09 |
JP6622963B2 (ja) | 2019-12-18 |
EP2942152A4 (en) | 2016-09-07 |
EP2942152A1 (en) | 2015-11-11 |
KR20150103169A (ko) | 2015-09-09 |
WO2014106944A1 (ja) | 2014-07-10 |
TW201433414A (zh) | 2014-09-01 |
TWI614093B (zh) | 2018-02-11 |
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