JPWO2013172004A1 - 冷却装置の接続構造、冷却装置、および冷却装置の接続方法 - Google Patents
冷却装置の接続構造、冷却装置、および冷却装置の接続方法 Download PDFInfo
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- 238000001816 cooling Methods 0.000 title claims abstract description 118
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 238000003825 pressing Methods 0.000 claims description 57
- 239000003507 refrigerant Substances 0.000 claims description 39
- 230000005489 elastic deformation Effects 0.000 claims description 6
- 230000008859 change Effects 0.000 abstract description 44
- 239000012071 phase Substances 0.000 description 49
- 238000009835 boiling Methods 0.000 description 14
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- 239000004065 semiconductor Substances 0.000 description 10
- 239000007788 liquid Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000005855 radiation Effects 0.000 description 7
- 230000009471 action Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
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- 238000009834 vaporization Methods 0.000 description 4
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- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
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- 238000007789 sealing Methods 0.000 description 3
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000005514 two-phase flow Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/08—Fastening; Joining by clamping or clipping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
図1は、本発明の第1の実施形態に係る冷却装置の接続構造100を示す断面図である。冷却装置の接続構造100は、開口部111を備えた接続板110、弾性変形し得る薄板状の押圧板120、第1の固着部130、および第2の固着部140を有する。第1の固着部130は、押圧板120が、冷却装置を構成する受熱部210を覆って配置した状態で、押圧板120と接続板110を固定する。第2の固着部140は、基板310上に装着された発熱体320と受熱部210が当接して開口部111に配置された状態で、接続板110と基板310を固定する。
次に、本発明の第2の実施形態について説明する。図2A、図2Bは、本発明の第2の実施形態による冷却装置1000の構成を示す図であり、図2Aは斜視図、図2Bは側面図である。冷却装置1000は、冷媒を貯蔵し、発熱体からの熱量を受熱する受熱部210、開口部を備えた接続板110、弾性変形し得る薄板状の押圧板120、第1の固着部130、および第2の固着部140を有する。ここで第1の固着部130は図1に示したように、押圧板120が受熱部210を覆って配置した状態で、押圧板120と接続板110を固定する。また第2の固着部140は、基板上に装着された発熱体と受熱部210が当接して開口部に配置された状態で、接続板110と基板310を固定する。
次に、本発明の第3の実施形態について説明する。図3A、図3Bは、本発明の第3の実施形態による冷却装置を用いた電子機器2000の構成を示す図であり、図3Aは斜視図、図3Bは側面図である。冷却装置を用いた電子機器2000は、基板310、基板上310に搭載された発熱体320、受熱部210、放熱部220、および受熱部210と放熱部220を接続する配管230を有する。受熱部210は冷媒を貯蔵し、発熱体320からの熱量を受熱する。放熱部220は受熱部210で気化した気相冷媒を凝縮液化させて放熱を行う。
110 接続板
111 開口部
120 押圧板
130 第1の固着部
140 第2の固着部
141 締結部
142 バネ部
210 受熱部
220 放熱部
222 固定板
230 配管
231 第1の配管
232 第2の配管
310 基板
320 発熱体
1000 冷却装置
2000 冷却装置を用いた電子機器
Claims (10)
- 開口部を備えた接続板と、
弾性変形し得る薄板状の押圧板と、
前記押圧板が、冷却装置を構成する受熱手段を覆って配置した状態で、前記押圧板と前記接続板を固定する第1の固着手段と、
基板上に装着された発熱体と前記受熱手段が当接して前記開口部に配置された状態で、前記接続板と前記基板を固定する第2の固着手段、とを有する
冷却装置の接続構造。 - 冷媒を貯蔵し、発熱体からの熱量を受熱する受熱手段と、
開口部を備えた接続板と、
弾性変形し得る薄板状の押圧板と、
前記押圧板が前記受熱手段を覆って配置した状態で、前記押圧板と前記接続板を固定する第1の固着手段と、
基板上に装着された前記発熱体と前記受熱手段が当接して前記開口部に配置された状態で、前記接続板と前記基板を固定する第2の固着手段、とを有する
冷却装置。 - 請求項2に記載した冷却装置において、
前記受熱手段で気化した気相冷媒を凝縮液化させて放熱を行う放熱手段と、
前記放熱手段と前記受熱手段を接続する配管をさらに備え、
前記放熱手段は、前記接続板上に配置している
冷却装置。 - 請求項2または3に記載した冷却装置において、
前記配管は、前記受熱手段の上部と前記放熱手段の上部を接続する第1の配管と、前記受熱手段の側面と前記放熱手段の下部を接続する第2の配管を含む
冷却装置。 - 請求項2から4のいずれか一項に記載した冷却装置において、
前記押圧板は、一部を切り欠いた切欠部を備える
冷却装置。 - 請求項2から5のいずれか一項に記載した冷却装置において、
前記第2の固着手段は、締結手段とバネ部を備える
冷却装置。 - 基板と、
前記基板上に搭載された発熱体と、
冷媒を貯蔵し、前記発熱体からの熱量を受熱する受熱手段と、
開口部を備えた接続板と、
弾性変形し得る薄板状の押圧板と、
前記押圧板が前記受熱手段を覆って配置した状態で、前記押圧板と前記接続板を固定する第1の固着手段と、
前記発熱体と前記受熱手段が前記開口部に配置された状態で、前記接続板と前記基板を固定する第2の固着手段と、
前記受熱手段で気化した気相冷媒を凝縮液化させて放熱を行う放熱手段と、
前記放熱手段と前記受熱手段を接続する配管、とを有し、
前記第1の固着手段は、前記受熱手段と前記発熱体が当接密着した状態で、前記押圧板と前記接続板を固定し、
前記第2の固着手段は、前記受熱手段と前記発熱体が当接密着した状態で、前記接続板と前記基板を固定する
冷却装置を用いた電子機器。 - 開口部を備えた接続板を形成し、
冷却装置を構成する受熱部を前記開口部に配置し、
弾性変形し得る薄板状の押圧板を、前記受熱部を覆うように配置し、
前記押圧板と前記接続板を接続し、
前記接続板を、発熱体を装着した基板上に、前記発熱体が前記開口部に収容されるように配置する
冷却装置の接続方法。 - 請求項8に記載した冷却装置の接続方法において、
前記受熱部と前記発熱体を当接密着させた状態で、前記押圧板と前記接続板を固定し、かつ前記接続板と前記基板を固定する
冷却装置の接続方法。 - 請求項8または9に記載した冷却装置の接続方法において、
前記受熱部で気化した気相冷媒を凝縮液化させて放熱を行う放熱部を、前記接続板上に配置し、
前記放熱部と前記受熱部を配管で接続する
冷却装置の接続方法。
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JP2014515490A JP6156368B2 (ja) | 2012-05-16 | 2013-05-10 | 冷却装置の接続構造、冷却装置、および冷却装置の接続方法 |
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PCT/JP2013/003001 WO2013172004A1 (ja) | 2012-05-16 | 2013-05-10 | 冷却装置の接続構造、冷却装置、および冷却装置の接続方法 |
JP2014515490A JP6156368B2 (ja) | 2012-05-16 | 2013-05-10 | 冷却装置の接続構造、冷却装置、および冷却装置の接続方法 |
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US (1) | US9456528B2 (ja) |
EP (1) | EP2851948B1 (ja) |
JP (1) | JP6156368B2 (ja) |
KR (1) | KR20140147132A (ja) |
CN (1) | CN104303293B (ja) |
IN (1) | IN2014DN09146A (ja) |
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JPWO2014192279A1 (ja) * | 2013-05-29 | 2017-02-23 | 日本電気株式会社 | 冷却装置およびその製造方法 |
US9435590B2 (en) | 2014-04-07 | 2016-09-06 | Microsoft Technology Licensing, Llc | Thin heat transfer device for thermal management |
US9818671B2 (en) * | 2015-02-10 | 2017-11-14 | Dynatron Corporation | Liquid-cooled heat sink for electronic devices |
TWM512730U (zh) * | 2015-08-20 | 2015-11-21 | Cooler Master Co Ltd | 水冷式散熱裝置 |
CN107771011A (zh) * | 2017-09-28 | 2018-03-06 | 深圳市英威腾电气股份有限公司 | 一种柔性相变散热装置 |
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- 2013-05-10 JP JP2014515490A patent/JP6156368B2/ja active Active
- 2013-05-10 CN CN201380025522.0A patent/CN104303293B/zh active Active
- 2013-05-10 US US14/401,282 patent/US9456528B2/en active Active
- 2013-05-10 EP EP13790140.1A patent/EP2851948B1/en active Active
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IN2014DN09146A (ja) | 2015-05-22 |
JP6156368B2 (ja) | 2017-07-05 |
US9456528B2 (en) | 2016-09-27 |
CN104303293A (zh) | 2015-01-21 |
US20150131229A1 (en) | 2015-05-14 |
EP2851948B1 (en) | 2017-05-10 |
WO2013172004A1 (ja) | 2013-11-21 |
EP2851948A1 (en) | 2015-03-25 |
KR20140147132A (ko) | 2014-12-29 |
EP2851948A4 (en) | 2015-12-23 |
CN104303293B (zh) | 2017-05-10 |
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