US20080105404A1 - Heat dissipating system having a heat dissipating cavity body - Google Patents
Heat dissipating system having a heat dissipating cavity body Download PDFInfo
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- US20080105404A1 US20080105404A1 US11/798,435 US79843507A US2008105404A1 US 20080105404 A1 US20080105404 A1 US 20080105404A1 US 79843507 A US79843507 A US 79843507A US 2008105404 A1 US2008105404 A1 US 2008105404A1
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- heat dissipating
- heat
- bottom wall
- cavity body
- working fluid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
- F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to heat dissipation, more particularly to a heat dissipating system having a heat dissipating cavity body.
- a conventional heat sink 1 includes a substantially large contact surface 11 in contact with a heat source 2 , and a plurality of heat dissipating fins 12 .
- the contact surface 11 absorbs heat generated by the heat source 2 , and the heat is dissipated through the heat dissipating fins 12 which exchange heat with external cold air by natural convection.
- the contact parts of the heat sink 1 and the heat source 2 are rigid, and since errors in surface flatness of the contact surfaces inevitably occur, a small gap is typically formed between the contact surface 11 of the heat sink 1 and the heat source 2 . As such, the contact surface 11 of the heat sink 1 cannot contact tightly the heat source 2 , thereby affecting the heat dissipating efficiency of the heat sink 1 . Further, since the heat dissipating purpose of the heat sink 1 is achieved by increasing the heat dissipating area thereof, the volume of the conventional heat sink 1 is thus very large. Moreover, because the area of heat conduction is limited, the temperature of the conventional heat sink 1 increases after a long period of use, thereby adversely affecting the heat dissipating effect.
- the object of the present invention is to provide a heat dissipating system having a heat dissipating cavity body so as to enhance the heat dissipating effect and efficiency of the heat dissipating system.
- a heat dissipating system comprises a heat dissipating cavity body defining a receiving space and having a bottom wall adapted to contact a heat source, a working fluid disposed in the receiving space and adapted to absorb heat generated by the heat source, and a heat exchange unit for exchanging heat with the working fluid.
- the bottom wall is made of a thin metal plate, and is flexible to deform so that when the bottom wall is pressed against the heat source, the bottom wall conforms to and contacts tightly a contact surface of the heat source.
- a heat dissipating cavity body is adapted to contact a heat source, and comprises top and bottom walls, and a surrounding wall connected between the top and bottom walls to define a receiving space which is adapted to contain a working fluid.
- the bottom wall is made of a thin metal plate, and is flexible to deform so that when the bottom wall is pressed against the heat source, the bottom wall conforms to and contacts tightly a contact surface of the heat source.
- FIG. 1 is a perspective view of a conventional heat sink shown prior to being attached to a heat source;
- FIG. 2 is a schematic front view of the first preferred embodiment of a heat dissipating system according to the present invention
- FIG. 3 is a schematic side view of the first preferred embodiment
- FIG. 4 is an enlarged fragmentary sectional view of a heat dissipating cavity body of the first preferred embodiment
- FIG. 5 is a fragmentary sectional view of a condenser of the first preferred embodiment
- FIG. 6 is an enlarged sectional view of a heat dissipating cavity body of a heat dissipating system according to the second preferred embodiment of the present invention.
- FIG. 7 is a partly sectional view of a heat dissipating system according to the third preferred embodiment of the present invention.
- the first preferred embodiment of a heat dissipating system is adapted to be installed in a computer module 6 , and is shown to comprise a heat dissipating cavity body 3 and a heat exchange unit 4 .
- the heat dissipating cavity body 3 in this embodiment, is adapted to be disposed in a lower chamber of the computer module 6 , and is made of a thin metal plate having a thickness of below 0.5 mm. As shown in FIG. 4 , the heat dissipating cavity body 3 has top and bottom walls 33 , 34 , and a surrounding wall 32 connected between the top and bottom walls 33 , 34 to define a receiving space 31 .
- the bottom wall 34 is convexed downwardly in a normal state, and is adapted to contact a heat source 61 of the computer module 6 .
- the surrounding wall 32 is pleated. In FIG. 2 , the top and bottom walls 33 , 34 (only the top wall 33 is visible) are placed vertically.
- the heat exchange unit 4 includes a condenser 41 , a thermoelectric cooler 42 , a heat sink 43 , and a fan 44 .
- the condenser 41 has a vapor-receiving section 411 formed on a top end thereof, a liquid-receiving section 412 formed on a bottom end thereof, and a plurality of channels 413 connected between the vapor-receiving and liquid-receiving sections 411 , 412 .
- the thermoelectric cooler 42 is controlled through a circuit, and has a cold side 421 in contact with the liquid-receiving section 412 , and a hot side 422 opposite to the cold side 421 .
- the cold side 421 has a cooling function so as to keep the liquid-receiving section 412 at a constant temperature.
- the heat sink 43 is disposed proximate to the condenser 41 , and has an L-shaped configuration.
- the heat sink 43 has a horizontal plate 431 in contact with the hot side 422 of the thermoelectric cooler 42 , a vertical plate 432 connected to an end periphery of the horizontal plate 431 and parallel to the condenser 41 , and a plurality of fins 433 provided on the vertical plate 432 .
- the fan 44 is disposed proximate to the condenser 41 and the heat sink 43 , and directs a current of cold air toward the condenser 41 and the heat sink 43 , as best shown in FIG. 3 .
- a tubing unit 5 interconnects the heat dissipating cavity body 3 and the condenser 41 , and includes a vapor-flowing tube 51 connected fluidly to the cavity body 3 and the vapor-receiving section 411 of the condenser 41 , and a liquid-flowing tube 52 connected fluidly to the cavity body 3 and the liquid-receiving section 412 of the condenser 41 .
- the vapor-flowing and liquid-flowing tubes 51 , 52 , the condenser 41 , and the cavity body 3 form a closed circulating loop.
- a working fluid 30 is condensable and is injected into the heat dissipating system of the present invention after the vapor-flowing and liquid-flowing tubes 51 , 52 , the cavity body 3 , and the condenser 41 are evacuated, so that the working fluid 30 circulates in a vacuum environment.
- the working fluid 30 is a coolant that is in a liquid state at room temperature.
- the working fluid 30 may be a super-thermal-conductive liquid.
- the bottom wall 34 of the heat dissipating cavity body 3 is placed in contact with the heat source 61 of the computer module 6 . Because the cavity body 3 is made of a thin metal plate, the bottom wall 34 and the pleated surrounding wall 32 are flexible to deform easily when acted upon by an external force. As such, when the bottom wall 34 is pressed against the heat source 61 , the bottom wall 34 conforms to and contacts tightly a contact surface of the heat source 61 , thereby enhancing tight contact between the cavity body 3 and the heat source 61 .
- the working fluid 30 is in a liquid state and is contained in the receiving space 31 of the cavity body 3 .
- the liquid-state working fluid 30 in the cavity body 3 absorbs heat generated by the heat source 61 through heat conduction, and is vaporized.
- the pressure inside the cavity body 3 increases as the working fluid 30 is vaporized, and the vaporized working fluid 30 is pressurized to flow upward by natural convection through the vapor-flowing tube 51 from a high-density region, which is the cavity body 3 , into a low-density region, which is the vapor-receiving section 411 of the condenser 41 .
- the fan 44 blows cold air toward the condenser 41 and the heat sink 43 so that the condenser 41 and the heat sink 43 exchange heat with the cold air.
- the vaporized working fluid 30 from the vapor-flowing tube 51 is condensed in the condenser 41 , and flows downward through the channels 413 by gravity into the liquid-receiving section 412 of the condenser 4 .
- the temperature of the working fluid 30 in a condensed state and in the liquid-receiving section 412 of the condenser 41 continues to drop to a preset value, and the hot side 422 of the thermoelectric cooler 42 transfers the heat from the condensed working fluid 30 to the heat sink 43 , which dissipates the heat.
- the cooled condensed working fluid 30 in the liquid-receiving section 412 then flows back into the receiving space 31 of the cavity body 3 through the liquid-flowing tube 52 by gravity so as to repeat the aforementioned steps.
- heat is effectively dissipated.
- a heat dissipating system according to the second preferred embodiment of the present invention is shown to be similar to the first preferred embodiment.
- the heat dissipating cavity body 7 is made of a thin metal plate.
- the bottom wall 74 of the heat dissipating cavity body 7 is flat. When the bottom wall 74 is pressed against the contact surface of the heat source 61 , the bottom wall 74 similarly conforms to and contacts tightly the contact surface of the heat source 61 .
- a heat dissipating system according to the third preferred embodiment of the present invention is shown to be similar to the first preferred embodiment.
- the receiving space 31 ′ of the heat dissipating cavity body 3 ′ is tightly closed, and is non-communicated with the condenser 41 and the tubing unit 5 ′.
- the top wall 33 ′ has an inner surface formed with a plurality of protrusions 331 and depressions 332 so as to increase a surface area of the inner surface of the top wall 33 ′.
- the cold side 421 of the thermoelectric cooler 42 is directly in contact with the top wall 33 ′ of the cavity body 3 ′.
- the tubing unit 5 ′ further includes an intermediate tube 53 connected fluidly between the vapor-flowing and liquid-flowing tubes 51 , 52 and in contact with the hot side 422 of the thermoelectric cooler 42 .
- the working fluid 30 is further disposed in the condenser 41 and the tubing unit 5 ′.
- the liquid-state working fluid 30 in the receiving space 31 ′ absorbs heat generated by the heat source 61 , it will vaporize upwardly toward the top wall 33 ′.
- the vaporized working fluid 30 then exchanges heat with the cavity body 3 ′.
- the vaporized working fluid 30 condenses, and flows downwardly to the bottom wall 34 ′ so as to repeat the aforementioned vaporization and condensation processes.
- the hot side 422 of the thermoelectric cooler 42 transfers heat resulting from condensation of the vaporized working fluid 30 in the cavity body 3 ′ to the intermediate tube 53 so as to vaporize the liquid-state working fluid 30 in the intermediate tube 53 .
- the vaporized working fluid 30 in the intermediate tube 53 then flows upward by natural convection to the vapor-receiving section 411 of the exchanges heat with the condenser 41 , condenses, flows downward through the channels 413 by gravity into the liquid-receiving section 412 of the condenser 41 , and back into the intermediate tube 53 through the liquid-flowing tube 52 so as to repeat the aforementioned steps.
- heat dissipation is similarly and efficiently achieved using the third preferred embodiment.
- the fan 44 may be attached to one side of the condenser 41 depending on the size of the condenser 41 . As such, the heat dissipating effect and efficiency of the condenser 41 may be enhanced. Further, in the first or second preferred embodiment, the tubing unit 5 may interconnect in series or in parallel a plurality of the heat dissipating cavity bodies 3 , which in turn, are adapted to contact respectively heat sources of the computer module 6 .
- the heat dissipating system of the present invention may also be applicable to an engine or a machine of a car, or any other article that needs heat dissipation.
- the bottom wall 34 , 74 , 34 ′ thereof can contact tightly the contact surface of the heat source 61 so that the heat dissipating effect and efficiency during heat conduction are enhanced.
- the working fluid 30 of the present invention while in a liquid state, can effectively absorb heat from the heat source 61 through heat conduction, and is then vaporized so as to exchange heat with the heat exchange unit 4 . Further, through flowing of the working fluid 30 in a liquid state from a high place to a low place by gravity, and through flowing of the working fluid 30 in a vapor state from a high-density region to a low-density region by natural convection, the working fluid 30 can undergo a self-circulating effect, so that the system of the present invention not only reduces noise to a minimum (by not requiring a separate pump), but also can enhance the heat dissipating effect and efficiency thereof.
- the working fluid 30 of the present invention makes use of a coolant or a super-thermal-conductive liquid, so that no freezing of the working fluid 30 is likely to occur when the system is used in cold temperature environments of below 0° C. Hence, the heat dissipation process can be carried out smoothly. Further, even if there is a leak in the system, the working fluid 30 will turn immediately into vapor so as not to damage electronic circuitry and/or elements of the heat dissipating system.
Abstract
A heat dissipating system includes a heat dissipating cavity body defining a receiving space and having a bottom wall adapted to contact a heat source, a working fluid disposed in the receiving space and adapted to absorb heat generated by the heat source, and a heat exchange unit for exchanging heat with the working fluid. The bottom wall is made of a thin metal plate, and is flexible to deform so that when the bottom wall is pressed against the heat source, the bottom wall conforms to and contacts tightly a contact surface of the heat source.
Description
- This application claims priority of Taiwanese Application No. 095141390, filed on Nov. 8, 2006.
- 1. Field of the Invention
- The invention relates to heat dissipation, more particularly to a heat dissipating system having a heat dissipating cavity body.
- 2. Description of the Related Art
- Referring to
FIG. 1 , aconventional heat sink 1 includes a substantiallylarge contact surface 11 in contact with aheat source 2, and a plurality ofheat dissipating fins 12. Thecontact surface 11 absorbs heat generated by theheat source 2, and the heat is dissipated through theheat dissipating fins 12 which exchange heat with external cold air by natural convection. - Since the contact parts of the
heat sink 1 and theheat source 2 are rigid, and since errors in surface flatness of the contact surfaces inevitably occur, a small gap is typically formed between thecontact surface 11 of theheat sink 1 and theheat source 2. As such, thecontact surface 11 of theheat sink 1 cannot contact tightly theheat source 2, thereby affecting the heat dissipating efficiency of theheat sink 1. Further, since the heat dissipating purpose of theheat sink 1 is achieved by increasing the heat dissipating area thereof, the volume of theconventional heat sink 1 is thus very large. Moreover, because the area of heat conduction is limited, the temperature of theconventional heat sink 1 increases after a long period of use, thereby adversely affecting the heat dissipating effect. - Therefore, the object of the present invention is to provide a heat dissipating system having a heat dissipating cavity body so as to enhance the heat dissipating effect and efficiency of the heat dissipating system.
- According to one aspect of this invention, a heat dissipating system comprises a heat dissipating cavity body defining a receiving space and having a bottom wall adapted to contact a heat source, a working fluid disposed in the receiving space and adapted to absorb heat generated by the heat source, and a heat exchange unit for exchanging heat with the working fluid. The bottom wall is made of a thin metal plate, and is flexible to deform so that when the bottom wall is pressed against the heat source, the bottom wall conforms to and contacts tightly a contact surface of the heat source.
- According to another aspect of this invention, a heat dissipating cavity body is adapted to contact a heat source, and comprises top and bottom walls, and a surrounding wall connected between the top and bottom walls to define a receiving space which is adapted to contain a working fluid. The bottom wall is made of a thin metal plate, and is flexible to deform so that when the bottom wall is pressed against the heat source, the bottom wall conforms to and contacts tightly a contact surface of the heat source.
- Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings, of which:
-
FIG. 1 is a perspective view of a conventional heat sink shown prior to being attached to a heat source; -
FIG. 2 is a schematic front view of the first preferred embodiment of a heat dissipating system according to the present invention; -
FIG. 3 is a schematic side view of the first preferred embodiment; -
FIG. 4 is an enlarged fragmentary sectional view of a heat dissipating cavity body of the first preferred embodiment; -
FIG. 5 is a fragmentary sectional view of a condenser of the first preferred embodiment; -
FIG. 6 is an enlarged sectional view of a heat dissipating cavity body of a heat dissipating system according to the second preferred embodiment of the present invention; and -
FIG. 7 is a partly sectional view of a heat dissipating system according to the third preferred embodiment of the present invention. - Before the present invention is described in greater detail with reference to the following preferred embodiments, it should be noted that like elements are denoted by the same reference numerals throughout the disclosure.
- Referring to
FIGS. 2 to 5 , the first preferred embodiment of a heat dissipating system according to the present invention is adapted to be installed in acomputer module 6, and is shown to comprise a heat dissipatingcavity body 3 and aheat exchange unit 4. - The heat dissipating
cavity body 3, in this embodiment, is adapted to be disposed in a lower chamber of thecomputer module 6, and is made of a thin metal plate having a thickness of below 0.5 mm. As shown inFIG. 4 , the heat dissipatingcavity body 3 has top andbottom walls wall 32 connected between the top andbottom walls receiving space 31. Thebottom wall 34 is convexed downwardly in a normal state, and is adapted to contact aheat source 61 of thecomputer module 6. The surroundingwall 32 is pleated. InFIG. 2 , the top andbottom walls 33, 34 (only thetop wall 33 is visible) are placed vertically. - The
heat exchange unit 4 includes acondenser 41, athermoelectric cooler 42, aheat sink 43, and afan 44. Thecondenser 41 has a vapor-receivingsection 411 formed on a top end thereof, a liquid-receivingsection 412 formed on a bottom end thereof, and a plurality ofchannels 413 connected between the vapor-receiving and liquid-receivingsections thermoelectric cooler 42 is controlled through a circuit, and has acold side 421 in contact with the liquid-receivingsection 412, and ahot side 422 opposite to thecold side 421. Thecold side 421 has a cooling function so as to keep the liquid-receivingsection 412 at a constant temperature. - The
heat sink 43 is disposed proximate to thecondenser 41, and has an L-shaped configuration. Theheat sink 43 has ahorizontal plate 431 in contact with thehot side 422 of thethermoelectric cooler 42, avertical plate 432 connected to an end periphery of thehorizontal plate 431 and parallel to thecondenser 41, and a plurality offins 433 provided on thevertical plate 432. Thefan 44 is disposed proximate to thecondenser 41 and theheat sink 43, and directs a current of cold air toward thecondenser 41 and theheat sink 43, as best shown inFIG. 3 . - A
tubing unit 5, in this embodiment, interconnects the heat dissipatingcavity body 3 and thecondenser 41, and includes a vapor-flowingtube 51 connected fluidly to thecavity body 3 and the vapor-receivingsection 411 of thecondenser 41, and a liquid-flowingtube 52 connected fluidly to thecavity body 3 and the liquid-receivingsection 412 of thecondenser 41. As such, the vapor-flowing and liquid-flowingtubes condenser 41, and thecavity body 3 form a closed circulating loop. - A working
fluid 30 is condensable and is injected into the heat dissipating system of the present invention after the vapor-flowing and liquid-flowingtubes cavity body 3, and thecondenser 41 are evacuated, so that the workingfluid 30 circulates in a vacuum environment. In this embodiment, the workingfluid 30 is a coolant that is in a liquid state at room temperature. Alternatively, the workingfluid 30 may be a super-thermal-conductive liquid. - During assembly, the
bottom wall 34 of the heat dissipatingcavity body 3 is placed in contact with theheat source 61 of thecomputer module 6. Because thecavity body 3 is made of a thin metal plate, thebottom wall 34 and the pleated surroundingwall 32 are flexible to deform easily when acted upon by an external force. As such, when thebottom wall 34 is pressed against theheat source 61, thebottom wall 34 conforms to and contacts tightly a contact surface of theheat source 61, thereby enhancing tight contact between thecavity body 3 and theheat source 61. - Initially, the working
fluid 30 is in a liquid state and is contained in thereceiving space 31 of thecavity body 3. After thecomputer module 6 is switched on, the liquid-state working fluid 30 in thecavity body 3 absorbs heat generated by theheat source 61 through heat conduction, and is vaporized. The pressure inside thecavity body 3 increases as the workingfluid 30 is vaporized, and the vaporized workingfluid 30 is pressurized to flow upward by natural convection through the vapor-flowingtube 51 from a high-density region, which is thecavity body 3, into a low-density region, which is the vapor-receivingsection 411 of thecondenser 41. At this time, thefan 44 blows cold air toward thecondenser 41 and the heat sink 43 so that thecondenser 41 and the heat sink 43 exchange heat with the cold air. The vaporized workingfluid 30 from the vapor-flowingtube 51 is condensed in thecondenser 41, and flows downward through thechannels 413 by gravity into the liquid-receivingsection 412 of thecondenser 4. - Through the cooling function of the
cold side 421 of thethermoelectric cooler 42, the temperature of the workingfluid 30 in a condensed state and in the liquid-receivingsection 412 of thecondenser 41 continues to drop to a preset value, and thehot side 422 of thethermoelectric cooler 42 transfers the heat from the condensed workingfluid 30 to theheat sink 43, which dissipates the heat. The cooled condensed workingfluid 30 in the liquid-receivingsection 412 then flows back into thereceiving space 31 of thecavity body 3 through the liquid-flowingtube 52 by gravity so as to repeat the aforementioned steps. Hence, by circulating the workingfluid 30 through thecondenser 41, thecavity body 3, and the vapor-flowing and liquid-flowingtubes - Referring to
FIG. 6 , a heat dissipating system according to the second preferred embodiment of the present invention is shown to be similar to the first preferred embodiment. The heat dissipatingcavity body 7 is made of a thin metal plate. However, in this embodiment, thebottom wall 74 of the heat dissipatingcavity body 7 is flat. When thebottom wall 74 is pressed against the contact surface of theheat source 61, thebottom wall 74 similarly conforms to and contacts tightly the contact surface of theheat source 61. - Referring to
FIG. 7 , a heat dissipating system according to the third preferred embodiment of the present invention is shown to be similar to the first preferred embodiment. However, in this embodiment, the receivingspace 31′ of the heat dissipatingcavity body 3′ is tightly closed, and is non-communicated with thecondenser 41 and thetubing unit 5′. Thetop wall 33′ has an inner surface formed with a plurality ofprotrusions 331 anddepressions 332 so as to increase a surface area of the inner surface of thetop wall 33′. Thecold side 421 of thethermoelectric cooler 42 is directly in contact with thetop wall 33′ of thecavity body 3′. Thetubing unit 5′ further includes anintermediate tube 53 connected fluidly between the vapor-flowing and liquid-flowingtubes hot side 422 of thethermoelectric cooler 42. The workingfluid 30 is further disposed in thecondenser 41 and thetubing unit 5′. - When the liquid-
state working fluid 30 in the receivingspace 31′ absorbs heat generated by theheat source 61, it will vaporize upwardly toward thetop wall 33′. The vaporized workingfluid 30 then exchanges heat with thecavity body 3′. Through the cooling function of thecold side 421 of thethermoelectric cooler 42, the vaporized workingfluid 30 condenses, and flows downwardly to thebottom wall 34′ so as to repeat the aforementioned vaporization and condensation processes. - The
hot side 422 of thethermoelectric cooler 42, on the other hand, transfers heat resulting from condensation of the vaporized workingfluid 30 in thecavity body 3′ to theintermediate tube 53 so as to vaporize the liquid-state working fluid 30 in theintermediate tube 53. The vaporized workingfluid 30 in theintermediate tube 53 then flows upward by natural convection to the vapor-receivingsection 411 of the exchanges heat with thecondenser 41, condenses, flows downward through thechannels 413 by gravity into the liquid-receivingsection 412 of thecondenser 41, and back into theintermediate tube 53 through the liquid-flowingtube 52 so as to repeat the aforementioned steps. Hence, heat dissipation is similarly and efficiently achieved using the third preferred embodiment. - It should be noted that the
fan 44 may be attached to one side of thecondenser 41 depending on the size of thecondenser 41. As such, the heat dissipating effect and efficiency of thecondenser 41 may be enhanced. Further, in the first or second preferred embodiment, thetubing unit 5 may interconnect in series or in parallel a plurality of the heat dissipatingcavity bodies 3, which in turn, are adapted to contact respectively heat sources of thecomputer module 6. - The heat dissipating system of the present invention may also be applicable to an engine or a machine of a car, or any other article that needs heat dissipation.
- From the aforementioned description, the advantages of the heat dissipating system of the present invention may be summarized as follows:
- 1. Since the heat dissipating
cavity body bottom wall heat source 61 so that the heat dissipating effect and efficiency during heat conduction are enhanced. - 2. The working
fluid 30 of the present invention, while in a liquid state, can effectively absorb heat from theheat source 61 through heat conduction, and is then vaporized so as to exchange heat with theheat exchange unit 4. Further, through flowing of the workingfluid 30 in a liquid state from a high place to a low place by gravity, and through flowing of the workingfluid 30 in a vapor state from a high-density region to a low-density region by natural convection, the workingfluid 30 can undergo a self-circulating effect, so that the system of the present invention not only reduces noise to a minimum (by not requiring a separate pump), but also can enhance the heat dissipating effect and efficiency thereof. - 3. The working
fluid 30 of the present invention makes use of a coolant or a super-thermal-conductive liquid, so that no freezing of the workingfluid 30 is likely to occur when the system is used in cold temperature environments of below 0° C. Hence, the heat dissipation process can be carried out smoothly. Further, even if there is a leak in the system, the workingfluid 30 will turn immediately into vapor so as not to damage electronic circuitry and/or elements of the heat dissipating system. - While the present invention has been described in connection with what are considered the most practical and preferred embodiments, it is understood that this invention is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.
Claims (16)
1. A heat dissipating system, comprising:
a heat dissipating cavity body defining a receiving space and having a bottom wall adapted to contact a heat source;
a working fluid disposed in said receiving space and adapted to absorb heat generated by the heat source; and
a heat exchange unit for exchanging heat with said working fluid;
wherein said bottom wall is made of a thin metal plate and is flexible to deform so that when said bottom wall is pressed against the heat source, said bottom wall conforms to and contacts tightly a contact surface of the heat source.
2. The heat dissipating system of claim 1 , wherein said bottom wall has a thickness of below 0.5 mm.
3. The heat dissipating system of claim 1 , wherein said bottom wall is convexed downwardly and toward the heat source.
4. The heat dissipating system of claim 1 , wherein said bottom wall is flat.
5. The heat dissipating system of claim 1 , wherein said heat dissipating cavity body further has a pleated surrounding wall connected to said bottom wall.
6. The heat dissipating system of claim 1 , wherein said heat dissipating cavity body further has a top wall, said heat exchange unit including a thermoelectric cooler that has a cold side in contact with said top wall, and a hot side opposite to said cold side, said working fluid being a condensable fluid movable upward toward said top wall when vaporized and movable downward toward said bottom wall when condensed.
7. The heat dissipating system of claim 6 , wherein said top wall has a non-planar inner surface.
8. The heat dissipating system of claim 7 , wherein said inner surface of said top wall is formed with a plurality of protrusions and depressions.
9. The heat dissipating system of claim 6 , wherein said heat exchange unit further includes a condenser, and a tubing unit in contact with said hot side of said thermoelectric cooler and connected fluidly to said condenser, said condenser and said tubing unit being non-communicated with said heat dissipating cavity body, said working fluid being further disposed in said condenser and said tubing unit.
10. A heat dissipating cavity body adapted to contact a heat source, said heat dissipating cavity body comprising:
top and bottom walls; and
a surrounding wall connected between said top and bottom walls to define a receiving space which is adapted to contain a working fluid;
wherein said bottom wall is made of a thin metal plate and is flexible to deform so that when said bottom wall is pressed against the heat source, said bottom wall conforms to and contacts tightly a contact surface of the heat source.
11. The heat dissipating cavity body of claim 10 , wherein said bottom wall has a thickness of below 0.5 mm.
12. The heat dissipating cavity body of claim 10 , wherein said bottom wall is convexed downwardly and toward the heat source.
13. The heat dissipating cavity body of claim 10 , wherein said bottom wall is flat.
14. The heat dissipating cavity body of claim 10 , wherein said surrounding wall is pleated.
15. The heat dissipating cavity body of claim 10 , wherein said top wall has a non-planar inner surface.
16. The heat dissipating cavity body of claim 15 , wherein said inner surface of said top wall is formed with a plurality of protrusions and depressions.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095141390A TW200821528A (en) | 2006-11-08 | 2006-11-08 | Phase-transformation heat dissipation device with heat dissipation chamber |
TW095141390 | 2006-11-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080105404A1 true US20080105404A1 (en) | 2008-05-08 |
Family
ID=39358744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/798,435 Abandoned US20080105404A1 (en) | 2006-11-08 | 2007-05-14 | Heat dissipating system having a heat dissipating cavity body |
Country Status (3)
Country | Link |
---|---|
US (1) | US20080105404A1 (en) |
KR (1) | KR20080041979A (en) |
TW (1) | TW200821528A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130047630A1 (en) * | 2011-08-23 | 2013-02-28 | B/E Aerospace, Inc. | Vehicle refrigerator having a liquid line subcooled vapor cycle system |
US20130247905A1 (en) * | 2010-12-03 | 2013-09-26 | Intersurgical Ag | Breathing systems |
EP2818968A4 (en) * | 2012-02-23 | 2015-10-21 | Zheming Zhou | Low-noise computer heat dissipation device |
CN109612315A (en) * | 2019-01-29 | 2019-04-12 | 株洲智热技术有限公司 | Phase-change heat radiating device |
US20190271489A1 (en) * | 2018-03-01 | 2019-09-05 | Laird Technologies, Inc. | Compressor chiller systems including thermoelectric modules, and corresponding control methods |
WO2020191473A1 (en) * | 2019-03-28 | 2020-10-01 | Huawei Technologies Co., Ltd. | Heat transfer structure and electronic assembly comprising such a heat transfer structure |
US20210302076A1 (en) * | 2020-03-30 | 2021-09-30 | John Schumann | System and method for an energy recovery condenser |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109673137B (en) * | 2019-01-09 | 2024-03-15 | 深圳兴奇宏科技有限公司 | Heat radiation unit |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3221508A (en) * | 1965-01-28 | 1965-12-07 | John B Roes | Flexible cold side for thermoelectric module |
US4476685A (en) * | 1981-05-11 | 1984-10-16 | Extracorporeal Medical Specialties, Inc. | Apparatus for heating or cooling fluids |
US4951740A (en) * | 1988-06-27 | 1990-08-28 | Texas A & M University System | Bellows heat pipe for thermal control of electronic components |
US4997032A (en) * | 1987-09-25 | 1991-03-05 | Minnesota Mining And Manufacturing Company | Thermal transfer bag |
US5661637A (en) * | 1995-01-25 | 1997-08-26 | Aavid Engineering, Inc. | Thermal management system having a thermally conductive sheet and a liquid transporting material |
US6230788B1 (en) * | 1997-07-08 | 2001-05-15 | Dso National Laboratories | Heat sink |
US6241005B1 (en) * | 1999-03-30 | 2001-06-05 | Veeco Instruments, Inc. | Thermal interface member |
US6282913B1 (en) * | 1999-06-11 | 2001-09-04 | Mitsubishi Denki Kabushiki Kaisha | Water vaporization type cooling apparatus for heat-generating unit |
US20030121645A1 (en) * | 2001-12-28 | 2003-07-03 | Tien-Lai Wang | Heat dissipater for a central processing unit |
US6690578B2 (en) * | 2000-02-02 | 2004-02-10 | Rittal Gmbh & Co. Kg | Cooling device |
US6755026B2 (en) * | 2002-10-24 | 2004-06-29 | Tech Medical Devices Inc. | Thermoelectric system to directly regulate the temperature of intravenous solutions and bodily fluids |
-
2006
- 2006-11-08 TW TW095141390A patent/TW200821528A/en unknown
-
2007
- 2007-05-14 US US11/798,435 patent/US20080105404A1/en not_active Abandoned
- 2007-06-26 KR KR1020070063287A patent/KR20080041979A/en not_active Application Discontinuation
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3221508A (en) * | 1965-01-28 | 1965-12-07 | John B Roes | Flexible cold side for thermoelectric module |
US4476685A (en) * | 1981-05-11 | 1984-10-16 | Extracorporeal Medical Specialties, Inc. | Apparatus for heating or cooling fluids |
US4997032A (en) * | 1987-09-25 | 1991-03-05 | Minnesota Mining And Manufacturing Company | Thermal transfer bag |
US4951740A (en) * | 1988-06-27 | 1990-08-28 | Texas A & M University System | Bellows heat pipe for thermal control of electronic components |
US5661637A (en) * | 1995-01-25 | 1997-08-26 | Aavid Engineering, Inc. | Thermal management system having a thermally conductive sheet and a liquid transporting material |
US6230788B1 (en) * | 1997-07-08 | 2001-05-15 | Dso National Laboratories | Heat sink |
US6241005B1 (en) * | 1999-03-30 | 2001-06-05 | Veeco Instruments, Inc. | Thermal interface member |
US6282913B1 (en) * | 1999-06-11 | 2001-09-04 | Mitsubishi Denki Kabushiki Kaisha | Water vaporization type cooling apparatus for heat-generating unit |
US6690578B2 (en) * | 2000-02-02 | 2004-02-10 | Rittal Gmbh & Co. Kg | Cooling device |
US20030121645A1 (en) * | 2001-12-28 | 2003-07-03 | Tien-Lai Wang | Heat dissipater for a central processing unit |
US6755026B2 (en) * | 2002-10-24 | 2004-06-29 | Tech Medical Devices Inc. | Thermoelectric system to directly regulate the temperature of intravenous solutions and bodily fluids |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130247905A1 (en) * | 2010-12-03 | 2013-09-26 | Intersurgical Ag | Breathing systems |
US10029059B2 (en) * | 2010-12-03 | 2018-07-24 | Intersurgical Ag | Breathing systems |
US10888683B2 (en) | 2010-12-03 | 2021-01-12 | Intersurgical Ag | Relating to breathing systems |
US20130047630A1 (en) * | 2011-08-23 | 2013-02-28 | B/E Aerospace, Inc. | Vehicle refrigerator having a liquid line subcooled vapor cycle system |
US9134053B2 (en) * | 2011-08-23 | 2015-09-15 | B/E Aerospace, Inc. | Vehicle refrigerator having a liquid line subcooled vapor cycle system |
EP2818968A4 (en) * | 2012-02-23 | 2015-10-21 | Zheming Zhou | Low-noise computer heat dissipation device |
US10816244B2 (en) * | 2018-03-01 | 2020-10-27 | Laird Thermal Systems, Inc. | Compressor chiller systems including thermoelectric modules, and corresponding control methods |
US20190271489A1 (en) * | 2018-03-01 | 2019-09-05 | Laird Technologies, Inc. | Compressor chiller systems including thermoelectric modules, and corresponding control methods |
US11530850B2 (en) | 2018-03-01 | 2022-12-20 | Laird Thermal Systems, Inc. | Compressor chiller systems including thermoelectric modules, and corresponding control methods |
CN109612315A (en) * | 2019-01-29 | 2019-04-12 | 株洲智热技术有限公司 | Phase-change heat radiating device |
EP3907455A4 (en) * | 2019-01-29 | 2022-02-16 | Smarth Technology Ltd. | Phase change heat radiating device |
JP2022518854A (en) * | 2019-01-29 | 2022-03-16 | 株洲智▲熱▼技▲術▼有限公司 | Phase transition radiator |
TWI801696B (en) * | 2019-01-29 | 2023-05-11 | 大陸商株洲智熱技術有限公司 | Phase change cooling device |
JP7413387B2 (en) | 2019-01-29 | 2024-01-15 | 株洲智▲熱▼技▲術▼有限公司 | Phase change heat dissipation device |
WO2020191473A1 (en) * | 2019-03-28 | 2020-10-01 | Huawei Technologies Co., Ltd. | Heat transfer structure and electronic assembly comprising such a heat transfer structure |
US20210302076A1 (en) * | 2020-03-30 | 2021-09-30 | John Schumann | System and method for an energy recovery condenser |
Also Published As
Publication number | Publication date |
---|---|
KR20080041979A (en) | 2008-05-14 |
TW200821528A (en) | 2008-05-16 |
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