IN2014DN09146A - - Google Patents

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Publication number
IN2014DN09146A
IN2014DN09146A IN9146DEN2014A IN2014DN09146A IN 2014DN09146 A IN2014DN09146 A IN 2014DN09146A IN 9146DEN2014 A IN9146DEN2014 A IN 9146DEN2014A IN 2014DN09146 A IN2014DN09146 A IN 2014DN09146A
Authority
IN
India
Prior art keywords
cooling
pressing plate
connecting plate
fixes
substrate
Prior art date
Application number
Inventor
Arihiro Matsunaga
Minoru Yoshikawa
Hitoshi Sakamoto
Akira Shoujiguchi
Masaki Chiba
Kenichi Inaba
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Publication of IN2014DN09146A publication Critical patent/IN2014DN09146A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/08—Fastening; Joining by clamping or clipping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Since in cooling apparatuses using phase change systems thermal resistance between the cooling apparatuses and heat generating bodies to be cooled increases when trying to obtain high thermal transport performance and sufficient cooling performance is not obtained this structure for connecting a cooling apparatus has: a connecting plate that is provided with an opening; a thin pressing plate that can be elastically deformed; a first fixing unit which fixes the pressing plate and the connecting plate in a state wherein the pressing plate is disposed by covering a heat receiving section that constitutes the cooling apparatus; and a second fixing unit which fixes the connecting plate and a substrate in a state wherein a heat generating body mounted on the substrate and the heat receiving section are disposed in the opening by being in contact with each other.
IN9146DEN2014 2012-05-16 2013-05-10 IN2014DN09146A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012112498 2012-05-16
PCT/JP2013/003001 WO2013172004A1 (en) 2012-05-16 2013-05-10 Structure for connecting cooling apparatus, cooling apparatus, and method for connecting cooling apparatus

Publications (1)

Publication Number Publication Date
IN2014DN09146A true IN2014DN09146A (en) 2015-05-22

Family

ID=49583433

Family Applications (1)

Application Number Title Priority Date Filing Date
IN9146DEN2014 IN2014DN09146A (en) 2012-05-16 2013-05-10

Country Status (7)

Country Link
US (1) US9456528B2 (en)
EP (1) EP2851948B1 (en)
JP (1) JP6156368B2 (en)
KR (1) KR20140147132A (en)
CN (1) CN104303293B (en)
IN (1) IN2014DN09146A (en)
WO (1) WO2013172004A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014192279A1 (en) * 2013-05-29 2017-02-23 日本電気株式会社 Cooling device and manufacturing method thereof
US9435590B2 (en) 2014-04-07 2016-09-06 Microsoft Technology Licensing, Llc Thin heat transfer device for thermal management
US9818671B2 (en) * 2015-02-10 2017-11-14 Dynatron Corporation Liquid-cooled heat sink for electronic devices
TWM512730U (en) * 2015-08-20 2015-11-21 Cooler Master Co Ltd Water-cooling radiator
CN107771011A (en) * 2017-09-28 2018-03-06 深圳市英威腾电气股份有限公司 A kind of flexible phase-change heat radiating device

Family Cites Families (24)

* Cited by examiner, † Cited by third party
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JP2001119182A (en) * 1999-10-19 2001-04-27 Nec Corp Fixing structure for heat sink
US6222734B1 (en) 1999-11-29 2001-04-24 Intel Corporation Clamping heat sinks to circuit boards over processors
JP3881488B2 (en) * 1999-12-13 2007-02-14 株式会社東芝 Circuit module cooling device and electronic apparatus having the cooling device
JP2002118216A (en) * 2000-10-11 2002-04-19 Kenichi Shimizu Electronic cooling device
US6549418B1 (en) * 2001-09-26 2003-04-15 Hewlett Packard Development Company, L.P. Land grid array integrated circuit device module
US6930884B2 (en) * 2003-06-11 2005-08-16 Hewlett-Packard Development Company, L.P. Land grid array assembly using a compressive liquid
US7323358B1 (en) * 2003-08-13 2008-01-29 Hewlett-Packard Development Company, L.P. Method and system for sizing a load plate
JP4551729B2 (en) 2004-09-30 2010-09-29 株式会社東芝 Cooling device and electronic device having cooling device
JP2006125718A (en) * 2004-10-28 2006-05-18 Sony Corp Heat transport device, and electronic device
JP2007034699A (en) * 2005-07-27 2007-02-08 Toshiba Corp Electronic equipment
US7714423B2 (en) * 2005-09-30 2010-05-11 Apple Inc. Mid-plane arrangement for components in a computer system
JP4862385B2 (en) * 2005-12-15 2012-01-25 パナソニック株式会社 Electronics
US7463496B2 (en) * 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
JP4799296B2 (en) * 2006-06-30 2011-10-26 株式会社東芝 Electronics
JP5223212B2 (en) 2007-03-09 2013-06-26 日本電気株式会社 Electronic component mounting structure with heat sink
CN201113135Y (en) * 2007-10-23 2008-09-10 富士康(昆山)电脑接插件有限公司 Electric connector component
JP4922903B2 (en) 2007-11-27 2012-04-25 株式会社日立製作所 Cooling device for electronic equipment
JP5210997B2 (en) 2009-08-28 2013-06-12 株式会社日立製作所 COOLING SYSTEM AND ELECTRONIC DEVICE USING THE SAME
US8305761B2 (en) * 2009-11-17 2012-11-06 Apple Inc. Heat removal in compact computing systems
JP4745439B2 (en) 2009-11-20 2011-08-10 株式会社東芝 Electronics
TW201125480A (en) 2010-01-11 2011-07-16 Wistron Corp Heat dissipating device and heat dissipating system
US9072199B2 (en) * 2010-12-27 2015-06-30 Src, Inc. Thermal transfer component, apparatus and method including thermally conductive frame penetrated by thermally conductive plug
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Also Published As

Publication number Publication date
JP6156368B2 (en) 2017-07-05
US9456528B2 (en) 2016-09-27
CN104303293A (en) 2015-01-21
US20150131229A1 (en) 2015-05-14
EP2851948B1 (en) 2017-05-10
WO2013172004A1 (en) 2013-11-21
JPWO2013172004A1 (en) 2016-01-12
EP2851948A1 (en) 2015-03-25
KR20140147132A (en) 2014-12-29
EP2851948A4 (en) 2015-12-23
CN104303293B (en) 2017-05-10

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