JPWO2013157462A1 - 収納容器、収納容器のシャッター開閉ユニット、及びこれらを用いたウエハストッカー - Google Patents
収納容器、収納容器のシャッター開閉ユニット、及びこれらを用いたウエハストッカーInfo
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- JPWO2013157462A1 JPWO2013157462A1 JP2014511183A JP2014511183A JPWO2013157462A1 JP WO2013157462 A1 JPWO2013157462 A1 JP WO2013157462A1 JP 2014511183 A JP2014511183 A JP 2014511183A JP 2014511183 A JP2014511183 A JP 2014511183A JP WO2013157462 A1 JPWO2013157462 A1 JP WO2013157462A1
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- 238000003860 storage Methods 0.000 title claims abstract description 245
- 230000007246 mechanism Effects 0.000 claims description 39
- 238000012546 transfer Methods 0.000 claims description 36
- 230000003287 optical effect Effects 0.000 claims description 30
- 238000001514 detection method Methods 0.000 claims description 8
- 230000001105 regulatory effect Effects 0.000 claims description 8
- 125000006850 spacer group Chemical group 0.000 claims description 7
- 230000032258 transport Effects 0.000 claims 2
- 239000012466 permeate Substances 0.000 claims 1
- 239000000428 dust Substances 0.000 abstract description 27
- 235000012431 wafers Nutrition 0.000 description 230
- 239000000758 substrate Substances 0.000 description 100
- 239000007789 gas Substances 0.000 description 58
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 27
- 239000001301 oxygen Substances 0.000 description 27
- 229910052760 oxygen Inorganic materials 0.000 description 27
- 238000000034 method Methods 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 15
- 230000008569 process Effects 0.000 description 14
- 239000011261 inert gas Substances 0.000 description 13
- 238000012360 testing method Methods 0.000 description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 11
- 238000012545 processing Methods 0.000 description 11
- 230000001965 increasing effect Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000009792 diffusion process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- 230000003028 elevating effect Effects 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 238000013507 mapping Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05F—DEVICES FOR MOVING WINGS INTO OPEN OR CLOSED POSITION; CHECKS FOR WINGS; WING FITTINGS NOT OTHERWISE PROVIDED FOR, CONCERNED WITH THE FUNCTIONING OF THE WING
- E05F15/00—Power-operated mechanisms for wings
- E05F15/40—Safety devices, e.g. detection of obstructions or end positions
- E05F15/42—Detection using safety edges
- E05F15/47—Detection using safety edges responsive to changes in fluid pressure
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05F—DEVICES FOR MOVING WINGS INTO OPEN OR CLOSED POSITION; CHECKS FOR WINGS; WING FITTINGS NOT OTHERWISE PROVIDED FOR, CONCERNED WITH THE FUNCTIONING OF THE WING
- E05F15/00—Power-operated mechanisms for wings
- E05F15/50—Power-operated mechanisms for wings using fluid-pressure actuators
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05F—DEVICES FOR MOVING WINGS INTO OPEN OR CLOSED POSITION; CHECKS FOR WINGS; WING FITTINGS NOT OTHERWISE PROVIDED FOR, CONCERNED WITH THE FUNCTIONING OF THE WING
- E05F15/00—Power-operated mechanisms for wings
- E05F15/60—Power-operated mechanisms for wings using electrical actuators
- E05F15/603—Power-operated mechanisms for wings using electrical actuators using rotary electromotors
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05F—DEVICES FOR MOVING WINGS INTO OPEN OR CLOSED POSITION; CHECKS FOR WINGS; WING FITTINGS NOT OTHERWISE PROVIDED FOR, CONCERNED WITH THE FUNCTIONING OF THE WING
- E05F15/00—Power-operated mechanisms for wings
- E05F15/70—Power-operated mechanisms for wings with automatic actuation
- E05F15/77—Power-operated mechanisms for wings with automatic actuation using wireless control
- E05F15/78—Power-operated mechanisms for wings with automatic actuation using wireless control using light beams
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
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- Computer Networks & Wireless Communication (AREA)
- Mechanical Engineering (AREA)
- Fluid Mechanics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
載置されたFOUP38の開口部分に対向する位置には水平多関節型ロボット58を搭載したウエハ搬送部48が配置されている。ウエハ搬送部48の左右両脇にはシャッター開閉ユニット25が配置されていて、このシャッター開閉ユニット25に対応する位置にそれぞれ貯蔵ユニット63が配置されている。
3 棚板
4 スペーサ
5 ウエハ支持部分
6 上プレート
7 下プレート
8 組立体
9 カバー
10 本体開口部
11 ノズル
11a 導入管
11b 噴出口
11c 拡散抑止部材
15 遮蔽板
18 位置決めシャフト(位置規制部材)
20 位置決め部材
21 位置決めピン
23 位置決めブロック
24 フィンガ
25 シャッター開閉ユニット
26 フック
27 シャッター支持機構
28 昇降駆動部
46 第1実施形態のウエハストッカー
48 ウエハ搬送部
49 オープナ
50 アライナ
54 円筒座標型ロボット
56 第2実施形態のウエハストッカー
63 貯蔵ユニット
72 第3実施形態のウエハストッカー
80 支持制御手段
81 ストッカー制御部
S シャッター部
Claims (14)
- 一方の面に開口部を有しており、内部に板状被収納物を支持可能に鉛直方向に一定の間隔で配置された複数の棚板と、前記複数の棚板の間に配置されて上下に隣接する前記棚板の間隔を維持するスペーサ部とを有する本体部と、
前記本体部の前記開口部以外の側面及び上下を覆うカバー部材と、
前記複数の棚板に対応して前記開口部を覆う複数の遮蔽板を有し、前記遮蔽板を前記棚板とは分離して上下動させることにより前記本体部に支持収納されている被収容物へのアクセスを可能にするシャッター部とを備え、
前記本体部は内部に清浄な気体を供給するノズル部を有し、前記シャッター部は前記ノズル部から供給された前記気体を、前記本体部の内圧を維持しつつ適量外部に流出可能に前記本体部に対し微小な隙間を空けて配置されていることを特徴とする収納容器。 - 前記棚板は、前記被収納物を保持するロボットフィンガがアクセス可能な間隔をもって配置されていることを特徴とする請求項1に記載の収納容器。
- 前記シャッターの各前記遮蔽板は前記棚板の配置された間隔と同じ高さ寸法を有し、個別に上下移動可能に積み重ねて配置されていることを特徴とする請求項1もしくは請求項2に記載の収納容器。
- 前記シャッターの前記各遮蔽板は位置規制部材によって規制された面内を上下移動可能であることを特徴とする請求項1から請求項3に記載の収納容器。
- 前記本体部は、前記棚板に支持された被搬送物の有無を検出する光センサから照射される光が透過可能な検出窓を有することを特徴とする請求項1から請求項4に記載の収納容器。
- 前記ノズルから前記本体部内に供給される前記気体は、前記各遮蔽板の開放時と閉鎖時とで流量を切り替えることができることを特徴とする請求項1から請求項5に記載の収納容器。
- 前記シャッターと前記本体部との隙間は、ラビリンス構造を形成していることを特徴とする、請求項1から請求項6に記載の収納容器。
- 前記本体部は、上面と下面に位置決め部材を有し、鉛直方向に積み重ねて配置可能であることを特徴とする請求項1から請求項7に記載の収納容器。
- 請求項1から請求項8に記載の収納容器が有する前記シャッターを開閉するシャッター開閉ユニットであって、前記シャッター開閉ユニットは、前記遮蔽板に設けられた切り欠き部に係合可能なフックと、シャッター支持機構と、前記シャッター支持機構を前記収納容器の積み重ねられた方向に対し平行に昇降移動させる昇降駆動部とを有することを特徴とするシャッター開閉ユニット。
- 前記光センサは投光部と受光部との一対からなり、前記シャッターシャッター支持機構に取り付けられていることを特徴とする請求項9に記載のシャッター開閉ユニット。
- クリーンブースと、前記クリーンブースの外面に接合されたFOUPオープナと、前記クリーンブース内に上下方向に1つまたは2つ以上積み重ねて配置された前記収納容器と、前記シャッター開閉ユニットと、前記FOUPと前記収納容器との間でウエハを搬送するウエハ搬送部と、ストッカー制御部とを備えることを特徴とするウエハストッカー。
- 前記ストッカー制御部は、前記シャッター開閉ユニットの前記シャッターを開閉する動作に応じて前記収納容器内部に供給する気体の流量を調節する機能を有することを特徴とする請求項11に記載のウエハストッカー。
- 前記収納容器を上下方向に積み重ねて構成される収納棚と、前記収納棚を等間隔に複数配置する貯蔵ユニットと、前記貯蔵ユニットを回転動作させる回転駆動部と、前記貯蔵ユニットに隣接する位置に配置されるシャッター開閉ユニットと、前記FOUPと前記収納容器との間で前記ウエハを搬送する前記ウエハ搬送部とを備えることを特徴とする請求項11もしくは請求項12に記載のウエハストッカー。
- 前記貯蔵ユニットは、前記収納棚を等間隔に複数載置する円形状の載置テーブルを備えることを特徴とする請求項11から請求項13に記載のウエハストッカー。
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