JPWO2013118539A1 - 骨伝導イヤホン - Google Patents
骨伝導イヤホン Download PDFInfo
- Publication number
- JPWO2013118539A1 JPWO2013118539A1 JP2013557444A JP2013557444A JPWO2013118539A1 JP WO2013118539 A1 JPWO2013118539 A1 JP WO2013118539A1 JP 2013557444 A JP2013557444 A JP 2013557444A JP 2013557444 A JP2013557444 A JP 2013557444A JP WO2013118539 A1 JPWO2013118539 A1 JP WO2013118539A1
- Authority
- JP
- Japan
- Prior art keywords
- bone conduction
- microphone
- speaker
- storage space
- earphone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/46—Special adaptations for use as contact microphones, e.g. on musical instrument, on stethoscope
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1016—Earpieces of the intra-aural type
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
- H04R25/604—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers
- H04R25/606—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers acting directly on the eardrum, the ossicles or the skull, e.g. mastoid, tooth, maxillary or mandibular bone, or mechanically stimulating the cochlea, e.g. at the oval window
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/023—Screens for loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2400/00—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2410/00—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
- H04R2460/13—Hearing devices using bone conduction transducers
Abstract
Description
1a コード導入口
2 イヤホンケース
3 イヤプラグ
4 マイク収納スペース
5 スピーカ収納スペース
6 感知カバー
7 空間部
8 外面壁
9 細管
10 仕切板
11 仕切板
12 骨伝導マイクロホン
13 骨伝導スピーカ
14 空間部
15 小型基板
Claims (8)
- コード導入部を有する後面カバーと、骨伝導マイクロホンと骨伝導スピーカとを収納して前記後面カバーに組み付けられるイヤホンケースとから成り、
前記イヤホンケースは、先端側に配置される前記骨伝導マイクロホンを収納するためのマイク収納スペースと、前記カバー側に配置される前記骨伝導スピーカを収納するためのスピーカ収納スペースとを有する硬質樹脂製イヤプラグと、前記マイク収納スペース設置部分に被装される前記イヤプラグよりも軟質資材製の感知カバーとから成り、
前記骨伝導マイクロホンによる骨導音のピックアップが前記感知カバーを介して行われることを特徴とする骨伝導イヤホン。 - 前記感知カバーは先端部下部に空間部を有し、その空間部の外壁面において骨導音を感知する、請求項1に記載の骨伝導イヤホン。
- 前記空間部を形成する外壁面は膨出状態となるように形成される、請求項2に記載の骨伝導イヤホン。
- 前記イヤプラグに、長さ方向に延びて前記マイク収納スペースと前記空間部とを連通して音響特性をコントロールする細管を設けた、請求項2又は3に記載の骨伝導イヤホン。
- 前記スピーカ収納スペース内前後に仕切板を対設し、前記骨伝導スピーカを前記仕切板のいずれか一方に、その振動部が当該仕切板に当接するように設置した、請求項1に記載の骨伝導イヤホン。
- 前記骨伝導スピーカは、予め小型ケース内に組み込まれた状態で前記スピーカ収納スペース内に装填する、請求項1に記載の骨伝導イヤホン。
- 前記後面カバーの空間内に配線用の小型基板を配置した請求項1に記載の骨伝導イヤホン。
- 前記後面カバーの空間内に防水用資材を充填した、請求項7に記載の骨伝導イヤホン。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012027463 | 2012-02-10 | ||
JP2012027463 | 2012-02-10 | ||
PCT/JP2013/050547 WO2013118539A1 (ja) | 2012-02-10 | 2013-01-15 | 骨伝導イヤホン |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2013118539A1 true JPWO2013118539A1 (ja) | 2015-05-11 |
JP6054317B2 JP6054317B2 (ja) | 2016-12-27 |
Family
ID=48947308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013557444A Expired - Fee Related JP6054317B2 (ja) | 2012-02-10 | 2013-01-15 | 骨伝導イヤホン |
Country Status (6)
Country | Link |
---|---|
US (1) | US9451357B2 (ja) |
EP (1) | EP2739065B1 (ja) |
JP (1) | JP6054317B2 (ja) |
CN (1) | CN103703792B (ja) |
TW (1) | TWI519174B (ja) |
WO (1) | WO2013118539A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107484054B (zh) * | 2017-08-18 | 2023-08-25 | 深圳市韶音科技有限公司 | 一种骨传导耳机 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101469908B1 (ko) * | 2013-08-21 | 2014-12-08 | 크레신 주식회사 | 이어폰 |
US20160165334A1 (en) * | 2014-12-03 | 2016-06-09 | Knowles Electronics, Llc | Hearing device with self-cleaning tubing |
KR101694706B1 (ko) * | 2015-05-18 | 2017-01-23 | 해보라 주식회사 | 이어셋 |
US9401158B1 (en) | 2015-09-14 | 2016-07-26 | Knowles Electronics, Llc | Microphone signal fusion |
CN105554627A (zh) * | 2015-12-23 | 2016-05-04 | 苏州百丰电子有限公司 | 一种阵列式防水微孔耳套 |
US9779716B2 (en) | 2015-12-30 | 2017-10-03 | Knowles Electronics, Llc | Occlusion reduction and active noise reduction based on seal quality |
US9830930B2 (en) | 2015-12-30 | 2017-11-28 | Knowles Electronics, Llc | Voice-enhanced awareness mode |
US9812149B2 (en) | 2016-01-28 | 2017-11-07 | Knowles Electronics, Llc | Methods and systems for providing consistency in noise reduction during speech and non-speech periods |
CN106028201A (zh) * | 2016-07-19 | 2016-10-12 | 珠海声浪科技有限公司 | 骨导耳机及其制造方法 |
GB2559313A (en) * | 2016-11-11 | 2018-08-08 | Flare Audio Tech Limited | Earphone |
US11601742B2 (en) * | 2016-11-28 | 2023-03-07 | Innovere Medical Inc. | Systems, methods and devices for communication in noisy environments |
CN107801114B (zh) * | 2017-02-10 | 2023-06-16 | 深圳市启元数码科技有限公司 | 一种防水骨传导耳机及其防水密封方法 |
JP6816880B2 (ja) * | 2017-03-03 | 2021-01-20 | ヤシマ電気株式会社 | 骨伝導型イヤホン |
JP6894081B2 (ja) * | 2018-11-05 | 2021-06-23 | 幸男 中川 | 語学学習装置 |
US10477307B1 (en) * | 2019-01-04 | 2019-11-12 | Harman International Industries, Incorporated | Waterproof headphone structure |
CN209693016U (zh) * | 2019-08-12 | 2019-11-26 | 东莞泉声电子有限公司 | 骨导式蓝牙耳机及其与充电座的组合 |
CN111935588B (zh) * | 2020-09-21 | 2021-03-05 | 江西联创电声有限公司 | 一种骨传导真无线耳机 |
CN112511948B (zh) * | 2021-02-08 | 2021-06-11 | 江西联创宏声电子股份有限公司 | 耳机 |
WO2023181626A1 (ja) * | 2022-03-24 | 2023-09-28 | 株式会社パナソニックシステムネットワークス開発研究所 | 通話装置 |
JP7459214B2 (ja) | 2022-03-24 | 2024-04-01 | 株式会社パナソニックシステムネットワークス開発研究所 | 通話装置 |
GB2618091A (en) * | 2022-04-26 | 2023-11-01 | Advanced Communication Solutions | Earpiece |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5561197A (en) * | 1978-11-01 | 1980-05-08 | Pioneer Electronic Corp | Electric-acoustic mutual converter |
JPS62290295A (ja) * | 1986-06-09 | 1987-12-17 | Sony Corp | 防水型イヤホン |
JP2000166959A (ja) * | 1998-12-04 | 2000-06-20 | Temuko Japan:Kk | 骨導スピ−カ |
JP2004165895A (ja) * | 2002-11-12 | 2004-06-10 | Nippon Telegr & Teleph Corp <Ntt> | 電気音響変換装置 |
WO2005091670A1 (ja) * | 2004-03-19 | 2005-09-29 | Temco Japan Co., Ltd. | 骨伝導デバイスユニット並びにそれを用いた携帯電話機及びヘッドセット |
WO2009072237A1 (ja) * | 2007-11-13 | 2009-06-11 | Temco Japan Co., Ltd. | 骨伝導スピーカマイクロホン |
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JPH071682U (ja) * | 1993-06-02 | 1995-01-10 | アルプス電気株式会社 | 音声ピックアップ付イヤホン |
JPH071682A (ja) | 1993-06-22 | 1995-01-06 | Asahi Chem Ind Co Ltd | 耐候性の改良された帯電防止性アクリル系樹脂積層シート |
JPH09172479A (ja) * | 1995-12-20 | 1997-06-30 | Yokoi Kikaku:Kk | 送受話器およびそれを用いた通話装置 |
JP5356734B2 (ja) * | 2008-06-20 | 2013-12-04 | 日本ゴア株式会社 | 音響部品及びその製造方法 |
CN101355823A (zh) * | 2008-09-18 | 2009-01-28 | 陈奚平 | 采用骨传导扬声器的耳塞式耳机 |
US8483418B2 (en) * | 2008-10-09 | 2013-07-09 | Phonak Ag | System for picking-up a user's voice |
US8213645B2 (en) * | 2009-03-27 | 2012-07-03 | Motorola Mobility, Inc. | Bone conduction assembly for communication headsets |
US8705787B2 (en) * | 2009-12-09 | 2014-04-22 | Nextlink Ipr Ab | Custom in-ear headset |
CN102123188A (zh) * | 2011-03-03 | 2011-07-13 | 曾超宁 | 移动电话耳麦装置 |
US9025795B2 (en) * | 2011-11-10 | 2015-05-05 | Aue Institute, Ltd. | Opening type bone conduction earphone |
-
2013
- 2013-01-15 EP EP13747114.0A patent/EP2739065B1/en not_active Not-in-force
- 2013-01-15 US US14/125,096 patent/US9451357B2/en active Active
- 2013-01-15 JP JP2013557444A patent/JP6054317B2/ja not_active Expired - Fee Related
- 2013-01-15 WO PCT/JP2013/050547 patent/WO2013118539A1/ja active Application Filing
- 2013-01-15 CN CN201380002392.9A patent/CN103703792B/zh not_active Expired - Fee Related
- 2013-01-23 TW TW102102486A patent/TWI519174B/zh not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5561197A (en) * | 1978-11-01 | 1980-05-08 | Pioneer Electronic Corp | Electric-acoustic mutual converter |
JPS62290295A (ja) * | 1986-06-09 | 1987-12-17 | Sony Corp | 防水型イヤホン |
JP2000166959A (ja) * | 1998-12-04 | 2000-06-20 | Temuko Japan:Kk | 骨導スピ−カ |
JP2004165895A (ja) * | 2002-11-12 | 2004-06-10 | Nippon Telegr & Teleph Corp <Ntt> | 電気音響変換装置 |
WO2005091670A1 (ja) * | 2004-03-19 | 2005-09-29 | Temco Japan Co., Ltd. | 骨伝導デバイスユニット並びにそれを用いた携帯電話機及びヘッドセット |
WO2009072237A1 (ja) * | 2007-11-13 | 2009-06-11 | Temco Japan Co., Ltd. | 骨伝導スピーカマイクロホン |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107484054B (zh) * | 2017-08-18 | 2023-08-25 | 深圳市韶音科技有限公司 | 一种骨传导耳机 |
Also Published As
Publication number | Publication date |
---|---|
TWI519174B (zh) | 2016-01-21 |
EP2739065A1 (en) | 2014-06-04 |
EP2739065A4 (en) | 2015-04-29 |
TW201338565A (zh) | 2013-09-16 |
WO2013118539A1 (ja) | 2013-08-15 |
CN103703792B (zh) | 2016-10-05 |
CN103703792A (zh) | 2014-04-02 |
US9451357B2 (en) | 2016-09-20 |
US20140348346A1 (en) | 2014-11-27 |
EP2739065B1 (en) | 2018-01-31 |
JP6054317B2 (ja) | 2016-12-27 |
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