JPWO2013081095A1 - 基板処理装置、及び、搬送装置 - Google Patents
基板処理装置、及び、搬送装置 Download PDFInfo
- Publication number
- JPWO2013081095A1 JPWO2013081095A1 JP2013547228A JP2013547228A JPWO2013081095A1 JP WO2013081095 A1 JPWO2013081095 A1 JP WO2013081095A1 JP 2013547228 A JP2013547228 A JP 2013547228A JP 2013547228 A JP2013547228 A JP 2013547228A JP WO2013081095 A1 JPWO2013081095 A1 JP WO2013081095A1
- Authority
- JP
- Japan
- Prior art keywords
- glass substrates
- processing chamber
- cassette
- glass substrate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 274
- 239000011521 glass Substances 0.000 claims abstract description 227
- 238000006243 chemical reaction Methods 0.000 claims abstract description 51
- 238000010438 heat treatment Methods 0.000 claims abstract description 25
- 239000011669 selenium Substances 0.000 claims abstract description 14
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 9
- 229910052711 selenium Inorganic materials 0.000 claims abstract description 9
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011593 sulfur Substances 0.000 claims abstract description 7
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 7
- CDZGJSREWGPJMG-UHFFFAOYSA-N copper gallium Chemical compound [Cu].[Ga] CDZGJSREWGPJMG-UHFFFAOYSA-N 0.000 claims abstract description 4
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000007789 gas Substances 0.000 description 80
- 239000007769 metal material Substances 0.000 description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 17
- 239000011248 coating agent Substances 0.000 description 15
- 238000000576 coating method Methods 0.000 description 15
- 239000010453 quartz Substances 0.000 description 15
- 230000003028 elevating effect Effects 0.000 description 14
- 229910001220 stainless steel Inorganic materials 0.000 description 14
- 239000010935 stainless steel Substances 0.000 description 14
- 230000001965 increasing effect Effects 0.000 description 12
- 239000010949 copper Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000004088 simulation Methods 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 230000031700 light absorption Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 150000003346 selenoethers Chemical class 0.000 description 3
- 238000005987 sulfurization reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 210000003746 feather Anatomy 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 229910000058 selane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
- H01L31/0749—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type including a AIBIIICVI compound, e.g. CdS/CulnSe2 [CIS] heterojunction solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02568—Chalcogenide semiconducting materials not being oxides, e.g. ternary compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Energy (AREA)
- Chemical Vapour Deposition (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
銅−インジウム、銅−ガリウム、又は、銅−インジウム−ガリウムのいずれか一つからなる積層膜が形成された複数のガラス基板を収納する処理室と、
前記処理室を構成するように形成される反応管と、
前記処理室内に搬入自在に構成され、前記複数のガラス基板を互いの主面が所定の間隔を保ってそれぞれ対向するよう配列させると共に、配列させた前記複数のガラス基板のうち両端のガラス基板の外側の主面をそれぞれ覆う一対の側壁が設けられるカセットと、
前記処理室内にセレン元素含有ガス又は硫黄元素含有ガスを導入するガス供給管と、
前記処理室内の雰囲気を排気する排気管と、
前記反応管を囲うように設けられた加熱部と、
前記複数のガラス基板の各主面において、前記複数のガラス基板の短辺方向に前記処理室内の雰囲気を強制対流させるファンと、を具備する基板処理装置が提供される。
複数のガラス基板を保持するカセットを処理室内に搬送する搬送装置であって、
前記カセットを支持する支持部と、
前記支持部に固定される車輪部と、
前記支持部及び前記車輪部を一体的に動作させるアームと、を具備する搬送装置が提供される。
以下、図面を参照しつつ本発明の第1の実施形態を説明する。図1は、本実施形態に係るセレン化処理を行う基板処理装置に組み込まれる処理炉10の側面断面図を示している。また、図2は、図1の紙面左側から見た処理炉10の断面図を示している。
次に、図1及び図2に示される処理炉10の他の実施形態を図11を用いて説明する。図11では、図1及び図2と同一の機能を有する部材には同一番号を付してある。また、ここでは、第1の実施形態と相違する点について主に説明する。
以上、本発明の実施形態を図面を用いて説明してきたが、本発明の趣旨を逸脱しない限り、様々な変更が可能である。
最後に、本発明の好ましい主な態様を以下に付記する。
前記処理室を構成するように形成される反応管と、
前記処理室内に搬入自在に構成され、前記複数のガラス基板を互いの主面が所定の間隔を保ってそれぞれ対向するよう配列させると共に、配列させた前記複数のガラス基板のうち両端のガラス基板の外側の主面をそれぞれ覆う一対の側壁が設けられるカセットと、
前記処理室内にセレン元素含有ガス又は硫黄元素含有ガスを導入するガス供給管と、
前記処理室内の雰囲気を排気する排気管と、
前記反応管を囲うように設けられた加熱部と、
前記複数のガラス基板の各主面において、前記複数のガラス基板の短辺方向に前記処理室内の雰囲気を強制対流させるファンと、を具備する基板処理装置。
Claims (5)
- 銅−インジウム、銅−ガリウム、又は、銅−インジウム−ガリウムのいずれか一つからなる積層膜が形成された複数のガラス基板を収納する処理室と、
前記処理室を構成するように形成される反応管と、
前記処理室内に搬入自在に構成され、前記複数のガラス基板を互いの主面が所定の間隔を保ってそれぞれ対向するよう配列させると共に、配列させた前記複数のガラス基板のうち両端のガラス基板の外側の主面をそれぞれ覆う一対の側壁が設けられるカセットと、
前記処理室内にセレン元素含有ガス又は硫黄元素含有ガスを導入するガス供給管と、
前記処理室内の雰囲気を排気する排気管と、
前記反応管を囲うように設けられた加熱部と、
前記複数のガラス基板の各主面において、前記複数のガラス基板の短辺方向に前記処理室内の雰囲気を強制対流させるファンと、を具備する基板処理装置。 - 請求項1に記載の基板処理装置であって、
前記両端のガラス基板の外側の主面と、前記カセットが備える前記一対の側壁の内側面と、の間の距離が、前記複数のガラス基板の主面間の距離とそれぞれ等しくなるよう構成されている基板処理装置。 - 請求項1に記載の基板処理装置であって、
前記ファンは、前記基板の長辺方向に沿って複数配置される基板処理装置。 - 請求項1に記載の基板処理装置であって、
前記複数のガラス基板の長辺方向に延在し、前記複数のガラス基板を挟むように設けられた一対のインナーウォールを更に具備する基板処理装置。 - 複数のガラス基板を保持するカセットを処理室内に搬送する搬送装置であって、
前記カセットを支持する支持部と、
前記支持部に固定される車輪部と、
前記支持部及び前記車輪部を一体的に動作させるアームと、を具備する搬送装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013547228A JP5853291B2 (ja) | 2011-12-01 | 2012-11-30 | 基板処理装置、及び、搬送装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011263720 | 2011-12-01 | ||
JP2011263720 | 2011-12-01 | ||
JP2013547228A JP5853291B2 (ja) | 2011-12-01 | 2012-11-30 | 基板処理装置、及び、搬送装置 |
PCT/JP2012/081046 WO2013081095A1 (ja) | 2011-12-01 | 2012-11-30 | 基板処理装置、及び、搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2013081095A1 true JPWO2013081095A1 (ja) | 2015-04-27 |
JP5853291B2 JP5853291B2 (ja) | 2016-02-09 |
Family
ID=48535543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013547228A Expired - Fee Related JP5853291B2 (ja) | 2011-12-01 | 2012-11-30 | 基板処理装置、及び、搬送装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5853291B2 (ja) |
KR (1) | KR20140095557A (ja) |
CN (1) | CN104067378A (ja) |
WO (1) | WO2013081095A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5985459B2 (ja) * | 2013-08-12 | 2016-09-06 | 本田技研工業株式会社 | 太陽電池の製造方法 |
CN105556651B (zh) * | 2013-09-10 | 2018-09-25 | 泰拉半导体株式会社 | 热处理装置以及具备该热处理装置的热处理系统 |
CN110366774B (zh) * | 2018-01-12 | 2023-06-02 | 株式会社爱发科 | 真空装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006186114A (ja) * | 2004-12-28 | 2006-07-13 | Showa Shell Sekiyu Kk | Cis系薄膜太陽電池の光吸収層の作製方法 |
WO2010055669A1 (ja) * | 2008-11-12 | 2010-05-20 | 株式会社アルバック | 電極回路、成膜装置、電極ユニットおよび成膜方法 |
WO2010060646A1 (de) * | 2008-11-28 | 2010-06-03 | Volker Probst | Verfahren zum herstellen von halbleiterschichten bzw. von mit elementarem selen und/oder schwefel behandelten beschichteten substraten, insbesondere flächigen substraten |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2144026B1 (de) * | 2008-06-20 | 2016-04-13 | Volker Probst | Prozessvorrichtung und verfahren zum prozessieren von gestapelten prozessgütern |
-
2012
- 2012-11-30 JP JP2013547228A patent/JP5853291B2/ja not_active Expired - Fee Related
- 2012-11-30 KR KR1020147015940A patent/KR20140095557A/ko not_active IP Right Cessation
- 2012-11-30 CN CN201280067091.XA patent/CN104067378A/zh active Pending
- 2012-11-30 WO PCT/JP2012/081046 patent/WO2013081095A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006186114A (ja) * | 2004-12-28 | 2006-07-13 | Showa Shell Sekiyu Kk | Cis系薄膜太陽電池の光吸収層の作製方法 |
WO2010055669A1 (ja) * | 2008-11-12 | 2010-05-20 | 株式会社アルバック | 電極回路、成膜装置、電極ユニットおよび成膜方法 |
WO2010060646A1 (de) * | 2008-11-28 | 2010-06-03 | Volker Probst | Verfahren zum herstellen von halbleiterschichten bzw. von mit elementarem selen und/oder schwefel behandelten beschichteten substraten, insbesondere flächigen substraten |
Also Published As
Publication number | Publication date |
---|---|
KR20140095557A (ko) | 2014-08-01 |
WO2013081095A1 (ja) | 2013-06-06 |
CN104067378A (zh) | 2014-09-24 |
JP5853291B2 (ja) | 2016-02-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5698059B2 (ja) | 基板処理装置、及び、太陽電池の製造方法 | |
JP5090097B2 (ja) | 基板処理装置、半導体装置の製造方法及び基板処理方法 | |
KR101663918B1 (ko) | 감소된 챔버 공간을 형성하는 공정 박스 및 다층체의 위치 결정 방법 | |
WO2001041202A1 (fr) | Dispositif et procede de traitement thermique | |
KR101500820B1 (ko) | 다층체의 가공을 위한 장치, 시스템 및 방법 | |
JP5853291B2 (ja) | 基板処理装置、及び、搬送装置 | |
US9926626B2 (en) | System and method for processing substrates | |
JP6257616B2 (ja) | コーティングされた基板を処理するための、プロセスボックス、装置及び方法 | |
JP2010034283A (ja) | 基板処理装置 | |
JP2012222157A (ja) | 基板処理装置、及び、太陽電池の製造方法 | |
WO2013099894A1 (ja) | 基板処理装置及びそれを用いた基板処理方法 | |
JP5517372B2 (ja) | 真空処理装置 | |
JP2013051281A (ja) | 基板処理装置 | |
JP6116685B2 (ja) | 対象物を熱処理するための装置と方法 | |
JP2013159545A (ja) | 基板処理装置及び太陽電池用基板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150303 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150507 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20151013 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20151112 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20151112 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20151118 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5853291 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |