JPWO2012176369A1 - 窒化ガリウム系半導体発光素子、光源および凹凸構造形成方法 - Google Patents
窒化ガリウム系半導体発光素子、光源および凹凸構造形成方法 Download PDFInfo
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Abstract
Description
まず、図4Aおよび図4B参照して、本発明による窒化ガリウム系半導体発光素子の第一の実施形態を説明する。
図12、図13及び図14を参照しながら、本発明の第2の実施形態を説明する。
本発明の実施形態に係る上記の発光素子は、そのまま光源として使用されても良い。しかし、本実施形態に係る発光素子は、波長変換のための蛍光物質を備える樹脂などと組み合わせれば、波長帯域の拡大した光源(例えば白色光源)として好適に使用され得る。
42 表面層
44 コロイド結晶層
50 光取り出し面
60 凹凸構造
71 基板
72 n型窒化物半導体層
73 窒化物半導体活性層
74 p型窒化物半導体層
75 n型電極
76 p型電極
77 窒化物半導体発光素子
81 アンドープGaN層
91 p-AlGaN層
Claims (22)
- 窒化ガリウム系半導体から形成され、偏光光を生成する活性層を含む半導体積層構造と、
前記半導体積層構造に接触し、前記活性層にキャリアを注入する電極構造と、
を備え、
前記半導体積層構造は、c面以外の結晶面の少なくとも一部に凹凸構造が形成された光取り出し面を有し、
前記凹凸構造は、前記結晶面上に配置され、前記光取り出し面の法線方向に対して軸対象ではない形状の凸部を有し、
前記凹凸構造における粗さ曲線要素の平均長さ(RSm)が150nm以上800nm以下である、窒化ガリウム系半導体発光素子。 - 前記凸部は、前記偏光光の偏光方向に対して0度を超え90度未満の面を有する、請求項1に記載の窒化ガリウム系半導体発光素子。
- 前記凹凸構造は、不規則な形状を有する凸部を含んでいる、請求項1または2に記載の窒化ガリウム系半導体発光素子。
- 前記凹凸構造は、前記結晶面上の不規則な位置に形成された凸部を含んでいる、請求項1から3の何れかに記載の窒化ガリウム系半導体発光素子。
- 前記半導体積層構造は、前記光取り出し面を有する窒化ガリウム系半導体基板を含む請求項1から4の何れかに記載の窒化ガリウム系半導体発光素子。
- 前記凹凸構造における前記凸部の個数密度は、1個/μm2以上50個/μm2以下の範囲にある請求項1から5の何れかに記載の窒化ガリウム系半導体発光素子。
- 前記半導体積層構造は、
前記基板上に形成され、前記活性層を挟み込む窒化ガリウム系半導体からなる第1伝導領域および第2伝導領域と、
前記第1伝導領域に接する第1の電極と、
前記第2伝導領域に接する第2の電極と、
を備え、
前記活性層から出射した光は、主として前記光取り出し面から外部に取り出される、請求項5に記載の窒化ガリウム系半導体発光素子。 - 前記凹凸構造における粗さ曲線要素の平均長さ(RSm)は、150nm以上400nm以下である、請求項1から7の何れかに記載の窒化ガリウム系半導体発光素子。
- 前記凹凸構造における算術平均粗さ(Ra)は、10nm以上800nm以下である、請求項1から8の何れかに記載の窒化ガリウム系半導体発光素子。
- 前記凹凸構造を構成する前記凸部の形状は三角錐状、概略三角錐状、又はこれらの組み合わせである、請求項1から9の何れかに記載の窒化ガリウム系半導体発光素子。
- 前記凹凸構造の少なくとも一部の凸部の頂上部分に、前記凹凸構造の他の部分の材料とは異なる材料が存在する、請求項1から10の何れか一つに記載の窒化ガリウム系半導体発光素子。
- 前記c面以外の結晶面とは、c面から18度以上90度以下傾いた面である、請求項1から11に記載の窒化ガリウム系半導体発光素子。
- 前記c面以外の結晶面とは、m面、a面、+r面または−r面である、請求項1から12に記載の窒化ガリウム系半導体発光素子。
- 前記基板はm面GaN基板である、請求項5または7に記載の窒化ガリウム系半導体発光素子。
- 請求項1から14の何れかに記載の窒化ガリウム系半導体発光素子と、
前記活性層から出た光の波長を変換する蛍光物質を含む波長変換部と、
を備えた光源。 - c面以外の結晶面を表面に有する窒化ガリウム系半導体を用意する工程(S0)と、
前記工程S0の後に、前記表面に対して改質をする工程(S1)と、
前記工程S1の後に、前記改質された表面に複数の粒子を配置する工程(S2)と、
前記工程S2の後に、ドライエッチングによって前記表面をエッチングし、前記窒化ガリウム系半導体のc面以外の結晶面の少なくとも一部の領域に凹凸構造を形成する工程(S3)と、
を含み、
前記凹凸構造における粗さ曲線要素の平均長さ(RSm)は、150nm以上800nm以下である、凹凸構造形成方法。 - 前記工程S2は、
前記複数の粒子を含有する溶液に前記窒化ガリウム系半導体を浸す工程(S2A)と、
前記工程S2Aの後に、前記窒化ガリウム系半導体を前記溶液から引き上げる工程(S2B)と、
を含む、請求項16に記載の凹凸構造形成方法。 - 前記工程S2で使用される溶液は親水性である、請求項16または17に記載の凹凸構造形成方法。
- 前記工程S2で使用される溶液は、水、メタノール、エタノール、フェノール、エチレングリコール、および酢酸からなる群から選択した少なくとも一つである、請求項16から18の何れかに記載の凹凸構造形成方法。
- 前記工程S1は、前記c面以外の結晶面を、酸素原子を含む雰囲気中に暴露し、前記c面以外の結晶面を酸化する工程を含む、請求項16から19の何れかに記載の凹凸構造形成方法。
- 前記工程S2で使用される前記複数の粒子の少なくとも表面は親水性を有している、請求項16から20の何れかに記載の凹凸構造形成方法。
- 前記工程S2で使用される前記複数の粒子は、SiO2、TiO2、ZnO、Au、Ag、ポリスチレン、ベンゾグアナミン・メラミン・ホルムアルデヒド縮合物およびポリメタクリル酸メチル系架橋物からなる群から選択した少なくとも一つから形成されている、請求項16から21の何れかに記載の凹凸構造形成方法。
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JP2007273746A (ja) | 2006-03-31 | 2007-10-18 | Sumitomo Chemical Co Ltd | 固体表面の微細加工方法および発光素子 |
JP5564162B2 (ja) | 2006-09-29 | 2014-07-30 | フューチャー ライト リミテッド ライアビリティ カンパニー | 発光ダイオード装置 |
JP5129527B2 (ja) * | 2006-10-02 | 2013-01-30 | 株式会社リコー | 結晶製造方法及び基板製造方法 |
JP5082752B2 (ja) * | 2006-12-21 | 2012-11-28 | 日亜化学工業株式会社 | 半導体発光素子用基板の製造方法及びそれを用いた半導体発光素子 |
KR100921466B1 (ko) | 2007-08-30 | 2009-10-13 | 엘지전자 주식회사 | 질화물계 발광 소자 및 그 제조방법 |
JP5130481B2 (ja) * | 2007-10-05 | 2013-01-30 | 王子ホールディングス株式会社 | 透明材料付半導体発光素子 |
JP2009225787A (ja) | 2008-02-28 | 2009-10-08 | Nagahama Bio-Laboratories Inc | 未同定の一塩基置換型ポリヌクレオチドの同定方法及びプライマー対 |
US8053264B2 (en) | 2008-05-12 | 2011-11-08 | The Regents Of The University Of California | Photoelectrochemical etching of P-type semiconductor heterostructures |
US8247822B2 (en) * | 2008-09-11 | 2012-08-21 | Huga Optotech Inc. | Semiconductor light-emitting device |
JP5284472B2 (ja) | 2009-07-22 | 2013-09-11 | パナソニック株式会社 | 発光ダイオード |
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2012
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US20130248877A1 (en) | 2013-09-26 |
WO2012176369A1 (ja) | 2012-12-27 |
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