JPWO2012043151A1 - 印刷用凸版及びそれを用いた有機el素子の製造方法 - Google Patents
印刷用凸版及びそれを用いた有機el素子の製造方法 Download PDFInfo
- Publication number
- JPWO2012043151A1 JPWO2012043151A1 JP2012536301A JP2012536301A JPWO2012043151A1 JP WO2012043151 A1 JPWO2012043151 A1 JP WO2012043151A1 JP 2012536301 A JP2012536301 A JP 2012536301A JP 2012536301 A JP2012536301 A JP 2012536301A JP WO2012043151 A1 JPWO2012043151 A1 JP WO2012043151A1
- Authority
- JP
- Japan
- Prior art keywords
- printing
- light emitting
- organic
- ink
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007639 printing Methods 0.000 title claims abstract description 187
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 130
- 239000000463 material Substances 0.000 claims abstract description 85
- 239000000758 substrate Substances 0.000 claims abstract description 85
- 238000005192 partition Methods 0.000 claims abstract description 21
- 239000002904 solvent Substances 0.000 claims description 15
- 230000007547 defect Effects 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 146
- 239000000976 ink Substances 0.000 description 98
- 229920005989 resin Polymers 0.000 description 46
- 239000011347 resin Substances 0.000 description 46
- 239000010408 film Substances 0.000 description 35
- 238000007774 anilox coating Methods 0.000 description 23
- 239000010409 thin film Substances 0.000 description 21
- -1 Polyethylene Polymers 0.000 description 19
- 238000000576 coating method Methods 0.000 description 18
- 239000002585 base Substances 0.000 description 17
- 230000005525 hole transport Effects 0.000 description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 239000011159 matrix material Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 238000007789 sealing Methods 0.000 description 13
- 238000000206 photolithography Methods 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 11
- 239000011521 glass Substances 0.000 description 11
- 239000007924 injection Substances 0.000 description 11
- 238000002347 injection Methods 0.000 description 11
- 238000007740 vapor deposition Methods 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 238000004528 spin coating Methods 0.000 description 8
- 239000004952 Polyamide Substances 0.000 description 7
- 230000018109 developmental process Effects 0.000 description 7
- 229920002647 polyamide Polymers 0.000 description 7
- 239000003566 sealing material Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000004840 adhesive resin Substances 0.000 description 6
- 229920006223 adhesive resin Polymers 0.000 description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 238000007644 letterpress printing Methods 0.000 description 6
- 238000000059 patterning Methods 0.000 description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000004695 Polyether sulfone Substances 0.000 description 5
- 239000004372 Polyvinyl alcohol Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 238000007611 bar coating method Methods 0.000 description 5
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229920006393 polyether sulfone Polymers 0.000 description 5
- 229920005591 polysilicon Polymers 0.000 description 5
- 229920002451 polyvinyl alcohol Polymers 0.000 description 5
- 239000005060 rubber Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000007646 gravure printing Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 238000007645 offset printing Methods 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229920002098 polyfluorene Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 229920002689 polyvinyl acetate Polymers 0.000 description 3
- 239000011118 polyvinyl acetate Substances 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- QLZJUIZVJLSNDD-UHFFFAOYSA-N 2-(2-methylidenebutanoyloxy)ethyl 2-methylidenebutanoate Chemical compound CCC(=C)C(=O)OCCOC(=O)C(=C)CC QLZJUIZVJLSNDD-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- PWATWSYOIIXYMA-UHFFFAOYSA-N Pentylbenzene Chemical compound CCCCCC1=CC=CC=C1 PWATWSYOIIXYMA-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- VPUGDVKSAQVFFS-UHFFFAOYSA-N coronene Chemical compound C1=C(C2=C34)C=CC3=CC=C(C=C3)C4=C4C3=CC=C(C=C3)C4=C2C3=C1 VPUGDVKSAQVFFS-UHFFFAOYSA-N 0.000 description 2
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical compound C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 2
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- UOHMMEJUHBCKEE-UHFFFAOYSA-N prehnitene Chemical compound CC1=CC=C(C)C(C)=C1C UOHMMEJUHBCKEE-UHFFFAOYSA-N 0.000 description 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 229910052706 scandium Inorganic materials 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229930192474 thiophene Natural products 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- JCXLYAWYOTYWKM-UHFFFAOYSA-N (2,3,4-triphenylcyclopenta-1,3-dien-1-yl)benzene Chemical compound C1C(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)C(C=2C=CC=CC=2)=C1C1=CC=CC=C1 JCXLYAWYOTYWKM-UHFFFAOYSA-N 0.000 description 1
- VUMCUSHVMYIRMB-UHFFFAOYSA-N 1,3,5-tri(propan-2-yl)benzene Chemical compound CC(C)C1=CC(C(C)C)=CC(C(C)C)=C1 VUMCUSHVMYIRMB-UHFFFAOYSA-N 0.000 description 1
- WJYMPXJVHNDZHD-UHFFFAOYSA-N 1,3,5-triethylbenzene Chemical compound CCC1=CC(CC)=CC(CC)=C1 WJYMPXJVHNDZHD-UHFFFAOYSA-N 0.000 description 1
- KLCLIOISYBHYDZ-UHFFFAOYSA-N 1,4,4-triphenylbuta-1,3-dienylbenzene Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)=CC=C(C=1C=CC=CC=1)C1=CC=CC=C1 KLCLIOISYBHYDZ-UHFFFAOYSA-N 0.000 description 1
- AXHVNJGQOJFMHT-UHFFFAOYSA-N 1-tert-butyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C(C)(C)C AXHVNJGQOJFMHT-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- MUNFOTHAFHGRIM-UHFFFAOYSA-N 2,5-dinaphthalen-1-yl-1,3,4-oxadiazole Chemical compound C1=CC=C2C(C3=NN=C(O3)C=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 MUNFOTHAFHGRIM-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- MGADZUXDNSDTHW-UHFFFAOYSA-N 2H-pyran Chemical compound C1OC=CC=C1 MGADZUXDNSDTHW-UHFFFAOYSA-N 0.000 description 1
- OGGKVJMNFFSDEV-UHFFFAOYSA-N 3-methyl-n-[4-[4-(n-(3-methylphenyl)anilino)phenyl]phenyl]-n-phenylaniline Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 OGGKVJMNFFSDEV-UHFFFAOYSA-N 0.000 description 1
- ZOKIJILZFXPFTO-UHFFFAOYSA-N 4-methyl-n-[4-[1-[4-(4-methyl-n-(4-methylphenyl)anilino)phenyl]cyclohexyl]phenyl]-n-(4-methylphenyl)aniline Chemical compound C1=CC(C)=CC=C1N(C=1C=CC(=CC=1)C1(CCCCC1)C=1C=CC(=CC=1)N(C=1C=CC(C)=CC=1)C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 ZOKIJILZFXPFTO-UHFFFAOYSA-N 0.000 description 1
- NWUAFVKGPOBCOA-UHFFFAOYSA-N 8-hydroxy-2-methylquinoline-5-carbonitrile Chemical compound N#CC1=CC=C(O)C2=NC(C)=CC=C21 NWUAFVKGPOBCOA-UHFFFAOYSA-N 0.000 description 1
- 229910017073 AlLi Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OOQAPGNOZVHVDM-UHFFFAOYSA-N CC(C)(C)[Cu](C(C)(C)C)(C(C)(C)C)C(C)(C)C Chemical compound CC(C)(C)[Cu](C(C)(C)C)(C(C)(C)C)C(C)(C)C OOQAPGNOZVHVDM-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 229920000286 Poly(2-decyloxy-1,4-phenylene) Polymers 0.000 description 1
- 229920000291 Poly(9,9-dioctylfluorene) Polymers 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- 239000004373 Pullulan Substances 0.000 description 1
- 229920001218 Pullulan Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 229910000611 Zinc aluminium Inorganic materials 0.000 description 1
- MUBKMWFYVHYZAI-UHFFFAOYSA-N [Al].[Cu].[Zn] Chemical compound [Al].[Cu].[Zn] MUBKMWFYVHYZAI-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- IYKJEILNJZQJPU-UHFFFAOYSA-N acetic acid;butanedioic acid Chemical compound CC(O)=O.OC(=O)CCC(O)=O IYKJEILNJZQJPU-UHFFFAOYSA-N 0.000 description 1
- 229920005822 acrylic binder Polymers 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229920000109 alkoxy-substituted poly(p-phenylene vinylene) Polymers 0.000 description 1
- HXFVOUUOTHJFPX-UHFFFAOYSA-N alumane;zinc Chemical compound [AlH3].[Zn] HXFVOUUOTHJFPX-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- IMALFSHRMABADU-UHFFFAOYSA-K aluminum 4-(4-cyanophenyl)phenolate 2-methyl-5-(trifluoromethyl)quinolin-8-olate Chemical compound [Al+3].C(#N)C1=CC=C(C=C1)C1=CC=C(C=C1)[O-].CC1=NC2=C(C=CC(=C2C=C1)C(F)(F)F)[O-].CC1=NC2=C(C=CC(=C2C=C1)C(F)(F)F)[O-] IMALFSHRMABADU-UHFFFAOYSA-K 0.000 description 1
- ANAJSSMBLXCCSM-UHFFFAOYSA-K aluminum;4-(4-cyanophenyl)phenolate Chemical compound [Al+3].C1=CC([O-])=CC=C1C1=CC=C(C#N)C=C1.C1=CC([O-])=CC=C1C1=CC=C(C#N)C=C1.C1=CC([O-])=CC=C1C1=CC=C(C#N)C=C1 ANAJSSMBLXCCSM-UHFFFAOYSA-K 0.000 description 1
- 150000005010 aminoquinolines Chemical class 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- XJHABGPPCLHLLV-UHFFFAOYSA-N benzo[de]isoquinoline-1,3-dione Chemical compound C1=CC(C(=O)NC2=O)=C3C2=CC=CC3=C1 XJHABGPPCLHLLV-UHFFFAOYSA-N 0.000 description 1
- 150000001572 beryllium Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 125000000319 biphenyl-4-yl group Chemical group [H]C1=C([H])C([H])=C([H])C([H])=C1C1=C([H])C([H])=C([*])C([H])=C1[H] 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 238000009500 colour coating Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- OPHUWKNKFYBPDR-UHFFFAOYSA-N copper lithium Chemical compound [Li].[Cu] OPHUWKNKFYBPDR-UHFFFAOYSA-N 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 229960000956 coumarin Drugs 0.000 description 1
- 235000001671 coumarin Nutrition 0.000 description 1
- HHNHBFLGXIUXCM-GFCCVEGCSA-N cyclohexylbenzene Chemical compound [CH]1CCCC[C@@H]1C1=CC=CC=C1 HHNHBFLGXIUXCM-GFCCVEGCSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 208000028659 discharge Diseases 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- NJWNEWQMQCGRDO-UHFFFAOYSA-N indium zinc Chemical compound [Zn].[In] NJWNEWQMQCGRDO-UHFFFAOYSA-N 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 229910001512 metal fluoride Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 1
- 229920005615 natural polymer Polymers 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- AHLBNYSZXLDEJQ-FWEHEUNISA-N orlistat Chemical compound CCCCCCCCCCC[C@H](OC(=O)[C@H](CC(C)C)NC=O)C[C@@H]1OC(=O)[C@H]1CCCCCC AHLBNYSZXLDEJQ-FWEHEUNISA-N 0.000 description 1
- 150000004866 oxadiazoles Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 235000019423 pullulan Nutrition 0.000 description 1
- RQGPLDBZHMVWCH-UHFFFAOYSA-N pyrrolo[3,2-b]pyrrole Chemical class C1=NC2=CC=NC2=C1 RQGPLDBZHMVWCH-UHFFFAOYSA-N 0.000 description 1
- QRDZFPUVLYEQTA-UHFFFAOYSA-N quinoline-8-carboxylic acid Chemical compound C1=CN=C2C(C(=O)O)=CC=CC2=C1 QRDZFPUVLYEQTA-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- YYMBJDOZVAITBP-UHFFFAOYSA-N rubrene Chemical compound C1=CC=CC=C1C(C1=C(C=2C=CC=CC=2)C2=CC=CC=C2C(C=2C=CC=CC=2)=C11)=C(C=CC=C2)C2=C1C1=CC=CC=C1 YYMBJDOZVAITBP-UHFFFAOYSA-N 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229920001959 vinylidene polymer Polymers 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 239000003021 water soluble solvent Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/12—Printing plates or foils; Materials therefor non-metallic other than stone, e.g. printing plates or foils comprising inorganic materials in an organic matrix
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
Description
ただし、印刷条件によって上記の問題が生じない場合には、凸パターン203の高さが10μm未満でもかまわない。
発光補助層としては正孔輸送層、正孔注入層、電子輸送層、電子注入層、電荷発生層が挙げられる。図10では発光補助層である正孔輸送層3と有機発光層(41、42、43)との積層構造からなる構成を示している。第一電極2上に正孔輸送層3が設けられ、正孔輸送層3上に赤色(R)有機発光層41、緑色(G)有機発光層42、青色(B)有機発光層43がそれぞれ設けられている。
また、ガラスキャップ等の封止体の代わりに有機発光媒体層や電極を外部の酸素や水分の浸入から保護するためにパッシベーション層や外部応力から保護する保護層、あるいはその両方の機能備えた封止基材を備えてもよい。
これらの活性層は、例えば、アモルファスシリコンをプラズマCVD法により積層し、イオンドーピングする方法、SiH4ガスを用いてLPCVD法によりアモルファスシリコンを形成し、固相成長法によりアモルファスシリコンを結晶化してポリシリコンを得た後、イオン打ち込み法によりイオンドーピングする方法、Si2H6ガスを用いてLPCVD法により、また、SiH4ガスを用いてPECVD法によりアモルファスシリコンを形成し、エキシマレーザー等のレーザーによりアニールし、アモルファスシリコンを結晶化してポリシリコンを得た後、イオンドーピング法によりイオンドーピングする方法(低温プロセス)、減圧CVD法又はLPCVD法によりポリシリコンを積層し、1000℃以上で熱酸化してゲート絶縁膜を形成し、その上にn+ポリシリコンのゲート電極114を形成し、その後、イオン打ち込み法によりイオンドーピングする方法(高温プロセス)等が挙げられる。
PPV前駆体、PPP前駆体などの高分子前駆体が挙げられる。また、その他既存の発光材料を用いることもできる。
(感光性樹脂凸版104の作製)厚さ250μmの42ニッケル材を基材204とし、この基材204の上に黒色顔料を混錬したアクリルバインダー樹脂溶液を乾燥膜厚が10μmになるように塗布して乾燥し、反射防止層を形成した。
実施例2として、作製した凸パターン203の幅は25μmであり、それを二つ10μm間隔で隣接し、60μmの凸パターン群205を形成したこと、画素サイズは80μm×150μmであること、使用した有機発光インキの粘度が120mPa・sであること、印刷工程において20枚の基板を連続に印刷を行った以外は、実施例1と同様に素子を作製した。
比較例1として、感光性樹脂凸版104の凸パターン203を幅90μmで形成し、さらにその他の凸パターンを隣接させなかったこと以外は、実施例1と同様に素子を作製した。
比較例2として、感光性樹脂凸版104の凸パターン203の高さが9μmであること以外は、実施例1と同様に素子を作製した。
比較例3として、感光性樹脂凸版104の凸パターン群205中の凸パターン203の隣接間距離が50μmであること以外は、実施例1と同様に素子を作製した。
比較例4として、幅60μmの凸パターン203を1つのみ形成し、凸パターン群205を形成しなかったこと以外は、実施例2と同様に素子を作製した。
比較例1から比較例4と実施例との比較から分かるように、本発明品である実施例1および実施例2では、いずれも印刷不良のない良好な印刷パターンが形成でき、且つ、発光ムラのない良好な結果が得られた。
2・・・・・第一電極
3・・・・・正孔輸送層
41・・・・赤色有機発光層
42・・・・緑色有機発光層
43・・・・青色有機発光層
5・・・・・第二電極
7・・・・・隔壁
8・・・・・ガラスキャップ
9・・・・・接着剤
10・・・・被転写パターン
101・・・インキ補充装置
102・・・ドクター
103・・・アニロックスロール
104・・・印刷用凸版
105・・・版胴
106・・・被印刷基板
107・・・ステージ
108・・・インキ
108a・・インキパターン
111・・・支持体
112・・・活性層
113・・・ゲート絶縁膜
114・・・ゲート電極
116・・・ドレイン電極
117・・・平坦化層
118・・・コンタクトホール
120・・・TFT
201・・・被転写基板
202・・・インキ
203・・・凸パターン
204・・・基材
205・・・凸パターン群
206・・・凹部
207・・・転写部
Claims (6)
- 基板上に画素電極と、前記画素電極上に隔壁によって画定される画素領域と、前記画素領域に少なくとも有機発光材料からなる発光層を有した発光媒体層と、前記画素電極に対向する対向電極とからなる有機EL素子の製造方法であって、
発光媒体材料と溶剤とを含むインキを凸版印刷法により前記画素領域に転写して前記発光媒体層を形成する工程を備え、
該凸版印刷法に用いられるインキが、一つの前記画素領域内において二つ以上の隣接する凸パターンから転写され、流動して一体化することにより形成することを特徴とする有機EL素子の製造方法。 - 前記インキの粘度が5mPa・s以上120mPa・s以下であることを特徴とする請求項1に記載の有機EL素子の製造方法。
- 請求項1または2に記載の有機EL素子の製造方法に用いられる印刷用凸版であって、少なくとも、版基材と、前記版基材上に形成された二つ以上の隣接する凸パターンと、前記凸パターンからなる凸パターン群と、からなることを特徴とする印刷用凸版。
- 前記凸パターンの高さが10μm以上であることを特徴とする請求項3に記載の印刷用凸版。
- 前記複数の隣接する凸パターン同士の間の距離が10μm以上40μm以下であることを特徴とする請求項3又は4に記載の印刷用凸版。
- 前記凸パターン群の幅が60μm以上500μm以下であることを特徴とする請求項3乃至5のいずれかに記載の印刷用凸版。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012536301A JP5870926B2 (ja) | 2010-09-27 | 2011-09-05 | 印刷用凸版及びそれを用いた有機el素子の製造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010215499 | 2010-09-27 | ||
JP2010215499 | 2010-09-27 | ||
JP2012536301A JP5870926B2 (ja) | 2010-09-27 | 2011-09-05 | 印刷用凸版及びそれを用いた有機el素子の製造方法 |
PCT/JP2011/070132 WO2012043151A1 (ja) | 2010-09-27 | 2011-09-05 | 印刷用凸版及びそれを用いた有機el素子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2012043151A1 true JPWO2012043151A1 (ja) | 2014-02-06 |
JP5870926B2 JP5870926B2 (ja) | 2016-03-01 |
Family
ID=45892624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012536301A Expired - Fee Related JP5870926B2 (ja) | 2010-09-27 | 2011-09-05 | 印刷用凸版及びそれを用いた有機el素子の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8932098B2 (ja) |
JP (1) | JP5870926B2 (ja) |
KR (1) | KR20130111547A (ja) |
CN (1) | CN103120022B (ja) |
TW (1) | TWI539642B (ja) |
WO (1) | WO2012043151A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140100793A (ko) * | 2013-02-07 | 2014-08-18 | 삼성전자주식회사 | 자체발광 디스플레이 패널 및 이를 가지는 디스플레이장치 |
EP3366456A4 (en) * | 2015-10-22 | 2019-05-29 | National Institute of Advanced Industrial Science and Technology | SURFACE STRUCTURE FOR PRINTING BASE MATERIAL AND METHOD FOR THE PRODUCTION THEREOF |
CN106129001B (zh) * | 2016-08-09 | 2018-11-20 | 上海交通大学 | 一种阵列背板电路及其制备方法 |
CN110611057B (zh) * | 2019-10-17 | 2020-12-25 | 山西穿越光电科技有限责任公司 | 一种卷对卷转印oled柔性显示发光层的方法 |
CN111477656B (zh) * | 2020-03-16 | 2023-01-31 | 福建华佳彩有限公司 | 一种amoled面板的胶层的加工方法 |
KR20230041889A (ko) * | 2021-09-17 | 2023-03-27 | 주식회사 한솔케미칼 | 발광층 잉크 조성물 및 이를 이용한 전계 발광 소자 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3036436B2 (ja) | 1996-06-19 | 2000-04-24 | セイコーエプソン株式会社 | アクティブマトリックス型有機el表示体の製造方法 |
JP2001093668A (ja) | 1999-09-22 | 2001-04-06 | Canon Inc | 有機発光材料、それを用いた表示体及びその製造方法 |
JP2001155858A (ja) | 1999-11-24 | 2001-06-08 | Sharp Corp | 有機el素子の製造方法 |
TWI276366B (en) * | 2002-07-09 | 2007-03-11 | Semiconductor Energy Lab | Production apparatus and method of producing a light-emitting device by using the same apparatus |
JP2004237545A (ja) * | 2003-02-05 | 2004-08-26 | Komuratekku:Kk | 層形成用凸版 |
JP2006252787A (ja) * | 2005-03-08 | 2006-09-21 | Toppan Printing Co Ltd | 有機el素子製造方法および有機el素子 |
JP4961694B2 (ja) * | 2005-08-01 | 2012-06-27 | 凸版印刷株式会社 | 有機el素子の製造方法 |
JP4872288B2 (ja) * | 2005-09-22 | 2012-02-08 | 凸版印刷株式会社 | 有機el素子及びその製造方法 |
US20090322210A1 (en) * | 2005-09-27 | 2009-12-31 | Masahiro Yokoo | Organic electroluminescent element substrate, and organic electroluminescent element and the manufacturing method |
JP2007115464A (ja) * | 2005-10-19 | 2007-05-10 | Toppan Printing Co Ltd | 表示素子の製造方法 |
TWI427682B (zh) * | 2006-07-04 | 2014-02-21 | Semiconductor Energy Lab | 顯示裝置的製造方法 |
JP2010137420A (ja) * | 2008-12-10 | 2010-06-24 | Asahi Kasei Corp | エレクトロニクス用の印刷用凸版 |
JP5195439B2 (ja) * | 2009-01-07 | 2013-05-08 | ソニー株式会社 | 印刷方法および表示装置の製造方法 |
JP5625448B2 (ja) * | 2010-03-31 | 2014-11-19 | 凸版印刷株式会社 | 有機el素子,有機el画像表示装置の製造方法 |
-
2011
- 2011-09-05 WO PCT/JP2011/070132 patent/WO2012043151A1/ja active Application Filing
- 2011-09-05 JP JP2012536301A patent/JP5870926B2/ja not_active Expired - Fee Related
- 2011-09-05 KR KR1020137007640A patent/KR20130111547A/ko not_active Application Discontinuation
- 2011-09-05 CN CN201180046325.8A patent/CN103120022B/zh not_active Expired - Fee Related
- 2011-09-26 TW TW100134491A patent/TWI539642B/zh not_active IP Right Cessation
-
2013
- 2013-02-08 US US13/763,364 patent/US8932098B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2012043151A1 (ja) | 2012-04-05 |
US8932098B2 (en) | 2015-01-13 |
KR20130111547A (ko) | 2013-10-10 |
CN103120022B (zh) | 2016-03-09 |
US20130189896A1 (en) | 2013-07-25 |
JP5870926B2 (ja) | 2016-03-01 |
CN103120022A (zh) | 2013-05-22 |
TWI539642B (zh) | 2016-06-21 |
TW201236235A (en) | 2012-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2007115465A (ja) | 有機エレクトロルミネッセンス素子 | |
JP5870926B2 (ja) | 印刷用凸版及びそれを用いた有機el素子の製造方法 | |
JP5569023B2 (ja) | 有機エレクトロルミネッセンス素子及びその製造方法 | |
JP2008046441A (ja) | 凸版製造方法 | |
JP5266643B2 (ja) | 印刷用凸版および印刷用凸版の製造方法 | |
JP5604857B2 (ja) | 印刷用凸版並びにそれを用いた有機エレクトロルミネッセンス素子の製造方法及び有機エレクトロルミネッセンス素子 | |
JP2008229947A (ja) | 高精細パターン形成用凸版および板状感光性樹脂積層体ならびに電子回路パターンならびに有機el素子の形成方法ならびに有機el素子ならびに有機elディスプレイ | |
JP2008006690A (ja) | 印刷用凸版、印刷物の製造方法、有機エレクトロルミネッセンス素子の製造方法および素子 | |
JP2008200925A (ja) | 凸版およびそれを用いた電子デバイスの製造方法並びにそれによる電子デバイス並びに有機el素子 | |
JP5023730B2 (ja) | 印刷用凸版及びエレクトロルミネセンス素子の製造方法 | |
JP5217133B2 (ja) | 印刷用凸版の製造方法 | |
JP2007250298A (ja) | 有機エレクトロルミネッセンス素子及びその製造方法 | |
JP5298489B2 (ja) | 有機el素子及びその製造方法 | |
JP2009078501A (ja) | 凸版印刷によるパターン形成方法、および有機機能性素子の製造方法 | |
JP2011181305A (ja) | 有機エレクトロルミネッセンス素子及びその製造方法 | |
JP5050518B2 (ja) | 樹脂凸版の製造方法及び現像装置並びに印刷物の製造方法及び有機el素子の製造方法 | |
JP2007253447A (ja) | 印刷用凸版及び印刷物 | |
JP5581919B2 (ja) | 凸版印刷法によるパターン形成方法 | |
JP4940831B2 (ja) | 有機el素子の製造方法および有機el素子 | |
JP5671784B2 (ja) | 印刷用凸版及びその印刷用凸版を用いた電子デバイスの製造方法並びに有機エレクトロルミネッセンス素子 | |
JP6079048B2 (ja) | 印刷用凸版及びそれを用いた有機el素子の製造方法 | |
JP6079049B2 (ja) | 印刷用凸版及びそれを用いた有機el素子の製造方法 | |
JP2009158585A (ja) | 有機エレクトロルミネッセンス表示装置及びその製造方法 | |
JP2012079486A (ja) | 有機el素子及びその製造方法 | |
JP5866750B2 (ja) | 印刷用凸版の版材及び印刷用凸版の製造方法と印刷用凸版、並びにそれを用いた有機エレクトロルミネッセンス素子の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140821 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150804 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150818 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150929 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151120 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20151215 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20151228 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5870926 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |