JPWO2011152423A1 - 金属の接合方法 - Google Patents

金属の接合方法 Download PDF

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Publication number
JPWO2011152423A1
JPWO2011152423A1 JP2011552259A JP2011552259A JPWO2011152423A1 JP WO2011152423 A1 JPWO2011152423 A1 JP WO2011152423A1 JP 2011552259 A JP2011552259 A JP 2011552259A JP 2011552259 A JP2011552259 A JP 2011552259A JP WO2011152423 A1 JPWO2011152423 A1 JP WO2011152423A1
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JP
Japan
Prior art keywords
copper
bonded portion
bonded
solution
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011552259A
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English (en)
Japanese (ja)
Inventor
齋藤　浩一
浩一 齋藤
芳央 岡山
芳央 岡山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Publication of JPWO2011152423A1 publication Critical patent/JPWO2011152423A1/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01371—Cleaning, e.g. oxide removal or de-smearing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Die Bonding (AREA)
JP2011552259A 2010-05-31 2011-05-31 金属の接合方法 Pending JPWO2011152423A1 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2010125303 2010-05-31
JP2010125303 2010-05-31
JP2011017981 2011-01-31
JP2011017981 2011-01-31
JP2011040076 2011-02-25
JP2011040076 2011-02-25
PCT/JP2011/062535 WO2011152423A1 (ja) 2010-05-31 2011-05-31 金属の接合方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011289127A Division JP2012187633A (ja) 2010-05-31 2011-12-28 金属の接合方法

Publications (1)

Publication Number Publication Date
JPWO2011152423A1 true JPWO2011152423A1 (ja) 2013-08-01

Family

ID=45066783

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2011552259A Pending JPWO2011152423A1 (ja) 2010-05-31 2011-05-31 金属の接合方法
JP2011289127A Pending JP2012187633A (ja) 2010-05-31 2011-12-28 金属の接合方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011289127A Pending JP2012187633A (ja) 2010-05-31 2011-12-28 金属の接合方法

Country Status (4)

Country Link
US (1) US20120160903A1 (https=)
JP (2) JPWO2011152423A1 (https=)
CN (1) CN102665997A (https=)
WO (1) WO2011152423A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014100711A (ja) * 2011-02-28 2014-06-05 Sanyo Electric Co Ltd 金属接合構造および金属接合方法
WO2013021567A1 (ja) * 2011-08-11 2013-02-14 三洋電機株式会社 金属の接合方法および金属接合構造
JP2014210267A (ja) * 2011-08-31 2014-11-13 三洋電機株式会社 金属接合装置
JP5984044B2 (ja) * 2012-04-16 2016-09-06 須賀　唯知 金属触媒下及び不活性ガス雰囲気下で有機酸ガスを用いた表面酸化物除去方法及び接合装置
CN104661786B (zh) * 2012-09-28 2017-05-24 Ev 集团 E·索尔纳有限责任公司 涂覆及接合衬底的方法
EP2994935A1 (de) 2013-07-05 2016-03-16 EV Group E. Thallner GmbH Verfahren zum bonden von metallischen kontaktflächen unter lösen einer auf einer der kontaktflächen aufgebrachten opferschicht in mindestens einer der kontaktflächen
JP6332942B2 (ja) * 2013-10-18 2018-05-30 小林　博 部品同士ないしは基材同士からなる被接合体の接合方法
TWI686518B (zh) * 2019-07-19 2020-03-01 國立交通大學 具有奈米雙晶銅之電連接結構及其形成方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006334652A (ja) * 2005-06-03 2006-12-14 Ebara Corp 金属接合方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1535492A (en) * 1923-12-21 1925-04-28 Passalacqua Augusto Process for facing sheets or objects of aluminum and the like with sheets of heavy metal
JP3345961B2 (ja) * 1992-06-05 2002-11-18 松下電器産業株式会社 銅または銅合金の低温拡散接合方法およびそれを用いた導電ペーストおよび多層配線基板の製造方法
JPH0615462A (ja) * 1992-07-02 1994-01-25 Ishikawajima Harima Heavy Ind Co Ltd 銅製部材の接合方法
JPH1190620A (ja) * 1997-09-16 1999-04-06 Mazda Motor Corp 金属部材の接合方法及び接合装置
JP4283567B2 (ja) * 2003-03-07 2009-06-24 株式会社オクテック 金属薄膜の接合方法
CN100471608C (zh) * 2004-08-04 2009-03-25 株式会社电装 金属接合方法
JP2006095534A (ja) * 2004-09-28 2006-04-13 Ebara Corp 接合方法及び装置
JP2007019360A (ja) * 2005-07-11 2007-01-25 Fuji Electric Holdings Co Ltd 電子部品の実装方法
JP4728845B2 (ja) * 2005-09-14 2011-07-20 古河電気工業株式会社 圧接接合式ヒートパイプおよびその製造方法
JP4728755B2 (ja) * 2005-09-22 2011-07-20 ハリマ化成株式会社 導電性接合の形成方法
JP2007090394A (ja) * 2005-09-29 2007-04-12 Tokyo Institute Of Technology 金属の接合方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006334652A (ja) * 2005-06-03 2006-12-14 Ebara Corp 金属接合方法

Also Published As

Publication number Publication date
CN102665997A (zh) 2012-09-12
US20120160903A1 (en) 2012-06-28
JP2012187633A (ja) 2012-10-04
WO2011152423A1 (ja) 2011-12-08

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