JPWO2011145317A1 - 硬化性粉体塗料組成物及びその硬化物 - Google Patents
硬化性粉体塗料組成物及びその硬化物 Download PDFInfo
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- JPWO2011145317A1 JPWO2011145317A1 JP2012515744A JP2012515744A JPWO2011145317A1 JP WO2011145317 A1 JPWO2011145317 A1 JP WO2011145317A1 JP 2012515744 A JP2012515744 A JP 2012515744A JP 2012515744 A JP2012515744 A JP 2012515744A JP WO2011145317 A1 JPWO2011145317 A1 JP WO2011145317A1
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- 125000003696 stearoyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 125000004523 tetrazol-1-yl group Chemical group N1(N=NN=C1)* 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 125000000437 thiazol-2-yl group Chemical group [H]C1=C([H])N=C(*)S1 0.000 description 1
- 125000004495 thiazol-4-yl group Chemical group S1C=NC(=C1)* 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 125000005000 thioaryl group Chemical group 0.000 description 1
- QERYCTSHXKAMIS-UHFFFAOYSA-N thiophene-2-carboxylic acid Chemical compound OC(=O)C1=CC=CS1 QERYCTSHXKAMIS-UHFFFAOYSA-N 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- RXJKFRMDXUJTEX-UHFFFAOYSA-N triethylphosphine Chemical compound CCP(CC)CC RXJKFRMDXUJTEX-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- CWMFRHBXRUITQE-UHFFFAOYSA-N trimethylsilylacetylene Chemical compound C[Si](C)(C)C#C CWMFRHBXRUITQE-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- NEXSABSTPUYVPE-UHFFFAOYSA-N tris(3,3,3-tribromopropyl) phosphate Chemical compound BrC(Br)(Br)CCOP(=O)(OCCC(Br)(Br)Br)OCCC(Br)(Br)Br NEXSABSTPUYVPE-UHFFFAOYSA-N 0.000 description 1
- BHYQWBKCXBXPKM-UHFFFAOYSA-N tris[3-bromo-2,2-bis(bromomethyl)propyl] phosphate Chemical compound BrCC(CBr)(CBr)COP(=O)(OCC(CBr)(CBr)CBr)OCC(CBr)(CBr)CBr BHYQWBKCXBXPKM-UHFFFAOYSA-N 0.000 description 1
- 125000000297 undecanoyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000003774 valeryl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WKOLLVMJNQIZCI-UHFFFAOYSA-N vanillic acid Chemical compound COC1=CC(C(O)=O)=CC=C1O WKOLLVMJNQIZCI-UHFFFAOYSA-N 0.000 description 1
- TUUBOHWZSQXCSW-UHFFFAOYSA-N vanillic acid Natural products COC1=CC(O)=CC(C(O)=O)=C1 TUUBOHWZSQXCSW-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
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Abstract
Description
本願は、2010年5月21日に出願された日本国特許出願第2010−116957号、2011年1月28日に出願された日本国特許出願第2011−016599号、2011年1月28日に出願された日本国特許出願第2011−016790号に対し優先権を主張し、その内容をここに援用する。
そこで、低い硬化温度で良好な硬化塗膜を得ることができ、且つ貯蔵安定性に優れるエポキシ系又はエポキシ・ポリエステル系粉体塗料が要望され、硬化剤をゲスト化合物とする包接錯体を使用する方法が開発されてきた。
特許文献1及び2には、エポキシ樹脂に、テトラキスフェノール化合物をホスト化合物とし、硬化剤及び/又は触媒をゲスト化合物とする包接錯体を添加してなるエポキシ塗料について記載されている。しかし、特許文献1は有機溶剤型塗料であり、特許文献2は塗料としての評価はなく、塗料として使用可能であることは何ら記載されていなかった。
t−ブチルヒドロキノン、2,5−ジ−t−ブチルヒドロキノン等の、分子内に1つの芳香族基と2つのヒドロキシル基を有する化合物;
α,α,α’,α’−テトラフェニル−1,1’−ビフェニル−2,2’−ジメタノール、4,4’−シクロヘキシリデンビスフェノール、4,4’−メチレンビスフェノール、4,4’−エチリデンビスフェノール、5,5’−メチレンジサリチル酸、1,1,6,6−テトラフェニル−2,4−ヘキサジイン−1,6−ジオール、1,1,4,4−テトラフェニル−2−ブチン−1,4−ジオール、1,1,2,2−テトラフェニルエタン−1,2−ジオール、1,1,6,6−テトラキス(2,4−ジメチルフェニル)−2,4−へキサジイン−1,6−ジオール;
4,4’−ジヒドロキシベンゾフェノン、2,4’−ジヒドロキシベンゾフェノン、4,4’−ジヒドロキシ−2−メチルベンゾフェノン、4,4’,3,2’−テトラヒドロキシベンゾフェノン、2,3,4,4’−テトラヒドロキシベンゾフェノン、2,2’,4,4’−テトラヒドロキシ−3,3’−ジメチルベンゾフェノン、2,2’,4,4’−テトラヒドロキシ−3,3’−ジクロロベンゾフェノン、2,2’,4,4’−テトラヒドロキシ−3,3’−ジメトキシベンゾフェノン等のヒドロキシベンゾフェノン化合物;
テトラキスフェノール化合物;
並びに、1,4−ジアザビシクロ−[2.2.2]−オクタン、顆粒状コーンスターチ(ポーラスY−20)、5,5−ジメチルヒダントイン、N−フェニルマレイミド、9,9’−ビアントラセン等が例示されている。
特許文献4にはエポキシ樹脂、イミダゾール系硬化剤、酸を含有したエポキシ樹脂粉体塗料組成物が記載され、低温硬化性であることが記載されている。しかしながら、硬化物表面がどのようになるかは記載されておらず、単に低温で硬化することしか記載されていない。
特許文献5にはエポキシ樹脂、イミダゾール系硬化剤、無機充填材を含有するエポキシ樹脂粉体塗料が記載され、低温硬化性、保存安定性等の各特性を有することが記載され、また無機充填材の上限量を規定することで平滑性が低下しないことが記載されている。しかしながら、無機充填材によって平滑性が左右されていることから、エポキシ樹脂と硬化触媒の組成物に特徴があるものではなかった。
特許文献6にはエポキシ樹脂、イミダゾール、モノカルボン酸を含有したエポキシ樹脂粉体塗料が記載され、ポットライフが向上したことが記載されている。しかしながら、包接錯体ではないので、例えば、貯蔵安定性(40℃、10日後のゲルタイム変化率)は不十分な値であった。
(1)下記成分(A)及び成分(B)を含有することを特徴とする硬化性粉体塗料組成物、
(A)エポキシ樹脂又はエポキシ・ポリエステルハイブリッド樹脂、
(B)(b1)カルボン酸化合物及び下記式(I)
で表されるテトラキスフェノール化合物からなる群より選ばれる少なくとも1種と、
(b2)式(II)
とを含有する包接錯体、
(2)(b1)のカルボン酸化合物が芳香族カルボン酸化合物であることを特徴とする上記(1)に記載の硬化性粉体塗料組成物、
(3)前記芳香族カルボン酸化合物が、式(III)
(4)イソフタル酸化合物が、5−t−ブチルイソフタル酸、5−ニトロイソフタル酸又は5−ヒドロキシイソフタル酸であることを特徴とする上記(3)に記載の硬化性粉体塗料組成物、及び、
(5)式(II)で表されるイミダゾール化合物又はイミダゾリン化合物が、イミダゾール、2−エチル−4−メチルイミダゾール、1−メチルイミダゾール、2−メチルイミダゾール、4−メチルイミダゾール、1,2−ジメチルイミダゾール、1−ベンジル−2−メチルイミダゾール、2−ヘプタデシルイミダゾール、2−ウンデシルイミダゾール、2−フェニルイミダゾール、2−フェニル−4−メチル−5−ヒドロキシメチルイミダゾール、2−メチルイミダゾリン又は2−フェニルイミダゾリンであることを特徴とする上記(1)〜(4)のいずれかに記載の硬化性粉体塗料組成物、
そして、(6)上記(1)〜(5)のいずれかに記載の硬化性粉体塗料組成物の硬化物に関する。
本発明の硬化性粉体塗料組成物は、以下の成分を含有する。
(A)エポキシ樹脂、又はエポキシ・ポリエステルハイブリッド樹脂
(B)カルボン酸化合物及び下記式(I)
で表されるテトラキスフェノール化合物からなる群より選ばれる少なくとも1種と、以下の式(II)で表される化合物から選ばれる少なくとも1種とを含有する包接錯体
以下に、各成分などについて詳細に説明する。
本発明の包接錯体は、カルボン酸化合物又は式(I)で表されるテトラキスフェノール化合物をホスト化合物とし、式(II)で表される化合物をゲスト化合物とする包接錯体であれば特に制限されるものではなく、溶媒等の第3成分を含んでもよい。本発明において包接錯体とは、ホスト化合物が包接格子を形成し、ホスト化合物がゲスト化合物と共有結合以外の結合により結合している化合物を言い、好ましくは、結晶性化合物を言う。カルボン酸化合物又は式(I)で表されるテトラキスフェノール化合物と、式(II)で表される化合物とを含む本発明の包接錯体は、カルボン酸化合物又は式(I)で表されるテトラキスフェノール化合物と、式(II)で表される化合物とから形成される塩とも言うことができる。
本発明の硬化性粉体塗料用組成物における包接錯体の配合割合は、エポキシ樹脂のエポキシ環1モルに対して、包接錯体中の式(II)で表されるイミダゾール化合物又はイミダゾリン化合物として、好ましくは0.01〜1.0モルである。
本発明において使用されるカルボン酸化合物は、式(II)で表されるイミダゾール化合物又はイミダゾリン化合物を包接できるものである限り、特に制限されないが、式(IV)
R(COOH)n1 (IV)
で表すことができる。
式中Rは、置換基を有していても良い脂肪族炭化水素基、置換基を有していても良い脂環式炭化水素基、置換基を有していても良い芳香族炭化水素基、又は置換基を有していても良い複素環基を表し、n1は1〜4のいずれかの整数を表す。
「アルキル基」としては、メチル基、エチル基、n−プロピル基、i−プロピル基、n−ブチル基、s−ブチル基、i−ブチル基、t−ブチル基、n−ペンチル基、n−ヘキシル基、ノニル基、i−ノニル基、デシル基、ラウリル基、トリデシル基、ミリスチル基、ペンタデシル基、パルミチル基、ヘプタデシル基、ステアリル基等が挙げられる。好ましくは、C1〜C6のアルキル基である。
「アルケニル基」としては、ビニル基、1−プロペニル基、2−プロペニル基、1−ブテニル基、2−ブテニル基、3−ブテニル基、1−メチル−2−プロペニル基、2−メチル−2−プロペニル基、1−ペンテニル基、2−ペンテニル基、3−ペンテニル基、4−ペンテニル基、1−メチル−2−ブテニル基、2−メチル−2−ブテニル基、1−ヘキセニル基、2−ヘキセニル基、3−ヘキセニル基、4−ヘキセニル基、5−ヘキセニル基、ヘプテニル基、オクテニル基、デセニル基、ペンタデセニル基、エイコセニル基、トリコセニル基等が挙げられる。好ましくは、C2〜C6のアルケニル基である。
「アルキニル基」としては、エチニル基、1−プロピニル基、2−プロピニル基、1−ブチニル基、2−ブチニル基、3−ブチニル基、1−メチル−2−プロピニル基、2−メチル−2−プロピニル基、1−ペンチニル基、2−ペンチニル基、3−ペンチニル基、4−ペンチニル基、1−メチル−2−ブチニル基、2−メチル−2−ブチニル基、1−ヘキシニル基、2−ヘキシニル基、3−ヘキシニル基、4−ヘキシニル基、5−ヘキシニル基、1−ヘプチニル基、1−オクチニル基、1−デシニル基、1−ペンタデシニル基、1−エイコシニル基、1−トリコシニル基等が挙げられる。好ましくは、C2〜C6のアルキニル基である。
脂肪族カルボン酸としては、好ましくは脂肪族2〜4価カルボン酸、ヒドロキシ脂肪族多価カルボン酸である。代表的には、フマル酸、1,3−シクロヘキサンジカルボン酸、trans−1,4−シクロヘキサンジカルボン酸、コハク酸、マロン酸、酒石酸、マレイン酸、クエン酸、リンゴ酸、アジピン酸等を挙げることができる。これら脂肪族カルボン酸は1種単独で使用しても2種以上を併用しても良い。
安息香酸、2−メチル安息香酸、3−メチル安息香酸、4−メチル安息香酸、2−エチル安息香酸、3−エチル安息香酸、4−エチル安息香酸、2−n−プロピル安息香酸、3−n−プロピル安息香酸、4−n−プロピル安息香酸、2−ブチル安息香酸、3−ブチル安息香酸、4−ブチル安息香酸、2−i−プロピル安息香酸、3−i−プロピル安息香酸、4−i−プロピル安息香酸、2−i−ブチル安息香酸、3−i−ブチル安息香酸、4−i−ブチル安息香酸、2−ヒドロキシ安息香酸、3−ヒドロキシ安息香酸、4−ヒドロキシ安息香酸、4−イソプロピル安息香酸、2−ニトロ安息香酸、3−ニトロ安息香酸、4−ニトロ安息香酸、2−ニトロ安息香酸メチル、3−ニトロ安息香酸メチル、4−ニトロ安息香酸メチル、2−ニトロ安息香酸エチル、3−ニトロ安息香酸エチル、4−ニトロ安息香酸エチル、2−ニトロ安息香酸プロピル、3−ニトロ安息香酸プロピル、4−ニトロ安息香酸プロピル、2−ニトロ安息香酸ブチル、3−ニトロ安息香酸ブチル、4−ニトロ安息香酸ブチル、2,3−ジメチル安息香酸、2,4−ジメチル安息香酸、2,5−ジメチル安息香酸、2,6−ジメチル安息香酸、3,4−ジメチル安息香酸、3,5−ジメチル安息香酸、2,3,4−トリメチル安息香酸、2,3,5−トリメチル安息香酸、2,4,5−トリメチル安息香酸、2,4,6−トリメチル安息香酸、3,4,5−トリメチル安息香酸、3,6−ジメチル安息香酸、4,5−ジメチル安息香酸、4,6−ジメチル安息香酸、2,3−ジエチル安息香酸、2,4−ジエチル安息香酸、2,5−ジエチル安息香酸、2,6−ジエチル安息香酸、3,4−ジエチル安息香酸、3,5−ジエチル安息香酸、3,6−ジエチル安息香酸、4,5−ジエチル安息香酸、4,6−ジエチル安息香酸、2,3−ジヒドロキシ安息香酸、2,4−ジヒドロキシ安息香酸、2,5−ジヒドロキシ安息香酸、2,6−ジヒドロキシ安息香酸、3,4−ジヒドロキシ安息香酸、3,5−ジヒドロキシ安息香酸、3,6−ジヒドロキシ安息香酸、4,5−ジヒドロキシ安息香酸、4,6−ジヒドロキシ安息香酸、2−ヒドロキシ−3−メチル安息香酸、2−ヒドロキシ−4−メチル安息香酸、2−ヒドロキシ−5−メチル安息香酸、4−ヒドロキシ−3−メトキシ安息香酸、3−ヒドロキシ−4−メトキシ安息香酸、3,4−ジメトキシ安息香酸、2,4−ジメトキシ安息香酸、2,4−ジヒドロキシ−6−メチル安息香酸、3,4,5−トリヒドロキシ安息香酸、4−ヒドロキシ−3,5−ジメトキシ安息香酸、2,4,5−トリメトキシ安息香酸、2−(カルボキシメチル)安息香酸、3−(カルボキシメチル)安息香酸、4−(カルボキシメチル)安息香酸、2−(カルボキシカルボニル)安息香酸、3−(カルボキシカルボニル)安息香酸、4−(カルボキシカルボニル)安息香酸等の安息香酸化合物;
テレフタル酸、2−メチルテレフタル酸、2−エチルテレフタル酸、2−n−プロピルテレフタル酸、2−イソプロピルテレフタル酸、2−ブチルテレフタル酸、2−イソブチルテレフタル酸、2−ヒドロキシテレフタル酸、2,6−ジヒドロキシテレフタル酸、2,6−ジメチルテレフタル酸、2−ニトロテレフタル酸等のテレフタル酸化合物;
1,2,3−ベンゼントリカルボン酸、1,2,4−ベンゼントリカルボン酸(トリメット酸)、1,2,5−ベンゼントリカルボン酸、1,3,4−ベンゼントリカルボン酸、1,3,5−ベンゼントリカルボン酸(トリメシン酸)、4−ヒドロキシ−1,2,3−ベンゼントリカルボン酸、5−ヒドロキシ−1,2,3−ベンゼントリカルボン酸、3−ヒドロキシ−1,2,4−ベンゼントリカルボン酸、5−ヒドロキシ−1,2,4−ベンゼントリカルボン酸、6−ヒドロキシ−1,2,4−ベンゼントリカルボン酸等のベンゼントリカルボン酸化合物;
1,2,3,4−ベンゼンテトラカルボン酸、1,2,3,5−ベンゼンテトラカルボン酸、1,2,4,5−ベンゼンテトラカルボン酸(ピロメリット酸)等のテトラカルボン酸化合物;
ベンゼンヘキサカルボン酸;
シクロヘキサンカルボン酸、1,2−シクロヘキサンジカルボン酸、1,3−シクロヘキサンジカルボン酸、1,4−シクロヘキサンジカルボン酸、1,1−シクロヘキサンジカルボン酸等のシクロヘキサンカルボン酸化合物;
1,2−デカヒドロナフタレンジカルボン酸、1,3−デカヒドロナフタレンジカルボン酸、1,4−デカヒドロナフタレンジカルボン酸、1,5−デカヒドロナフタレンジカルボン酸、1,6−デカヒドロナフタレンジカルボン酸、1,7−デカヒドロナフタレンジカルボン酸、1,8−デカヒドロナフタレンジカルボン酸等のナフタレンジカルボン酸化合物等。
これらの芳香族カルボン酸化合物は1種単独で用いても2種以上を併用してもよい。
式中、R7は、C1〜C6のアルキル基、C1〜C6のアルコキシ基、ニトロ基又はヒドロキシ基を表す。
C1〜C6のアルキル基及びC1〜C6のアルコキシ基としては、式(IV−1)及び(IV−2)におけるR5,R6において例示されたものと同じものが挙げられる。
具体的に、(IV−3)で表されるイソフタル酸化合物としては、5−ヒドロキシイソフタル酸又は5−ニトロイソフタル酸が好ましい。
本発明において使用されるテトラキスフェノール化合物は一般式(I)で表される化合物である。
本発明において使用される式(II)で表される化合物は、以下の式で表されるイミダゾール化合物又はイミダゾリン化合物である。
式中、R1は、水素原子、C1〜C10のアルキル基、アリール基、アリールアルキル基又はシアノエチル基を表し、水素原子であることが好ましい。
アリール基は、単環又は多環のアリール基を意味する。ここで、多環アリール基の場合は、完全不飽和に加え、部分飽和の基も包含する。例えばフェニル基、ナフチル基、アズレニル基、インデニル基、インダニル基、テトラリニル基等が挙げられる。これらのうち、好ましくは、C6〜C10のアリール基である。また、アリール基は置換基を有していてもよい。
アリールアルキル基は、上記アリール基とアルキル基が結合した基であり、ベンジル基、フェネチル基、3−フェニル−n−プロピル基、1−フェニル−n−へキシル基、ナフタレン−1−イルメチル基、ナフタレン−2−イルエチル基、1−ナフタレン−2−イル−n−プロピル基、インデン−1−イルメチル基等が挙げられる。これらのうち、好ましくは、C6〜C10アリールC1〜C6アルキル基である。また、アリールアルキル基は置換基を有していてもよい。
C1〜C20のアルキル基としては、メチル基、エチル基、n−プロピル基、i−プロピル基、n−ブチル基、s−ブチル基、i−ブチル基、t−ブチル基、n−ペンチル基、n−ヘキシル基、ノニル基、i−ノニル基、デシル基、ラウリル基、トリデシル基、ミリスチル基、ペンタデシル基、パルミチル基、ヘプタデシル基、ステアリル基等が挙げられる。好ましくは、C1〜10のアルキル基である。
アリール基及びアリールアルキル基は、R1における基と同様の基が挙げられる。
C1〜C20のアシル基としては、水素原子、アルキル基、アルケニル基、アルキニル基、アリール基、又はへテロアリール基等がカルボニル基と結合した基を意味する。アシル基は、例えば、ホルミル基;アセチル基、プロピオニル基、ブチロイル基、ペンタノイル基、ヘキサノイル基、へプタノイル基、オクタノイル基、ノナノイル基、デカノイル基、3−メチルノナノイル基、8−メチルノナノイル基、3−エチルオクタノイル基、3,7−ジメチルオクタノイル基、ウンデカノイル基、ドデカノイル基、トリデカノイル基、テトラデカノイル基、ペンタデカノイル基、ヘキサデカノイル基、1−メチルペンタデカノイル基、14−メチルペンタデカノイル基、13,13−ジメチルテトラデカノイル基、ヘプタデカノイル基、15−メチルヘキサデカノイル基、オクタデカノイル基、1−メチルヘプタデカノイル基、ノナデカノイル基、アイコサノイル基及びヘナイコサノイル基等のアルキルカルボニル基;アクリロイル基、メタクリロイル基、アリルカルボニル基、シンナモイル基等のアルケニルカルボニル基;エチニルカルボニル基、プロピニルカルボニル基等のアルキニルカルボニル基;ベンゾイル基、ナフチルカルボニル基、ビフェニルカルボニル基、アントラニルカルボニル基等のアリールカルボニル基;2−ピリジルカルボニル基、チエニルカルボニル基等のヘテロアリールカルボニル基等が挙げられる。これらのうち、C1〜C20(カルボニル基を含む)のアシル基が好ましく、C1〜C6のアシル基が特に好ましい。
式(II)で表されるイミダゾリン化合物としては2−メチルイミダゾリン、2−フェニルイミダゾリン、2−ウンデシルイミダゾリン、2−ヘプタデシルイミダゾリン、2−エチルイミダゾリン、2−i−プロピルイミダゾリン、2,4−ジメチルイミダゾリン、2−フェニル−4−メチルイミダゾリン等が挙げられ、2−メチルイミダゾリン又は2−フェニルイミダゾリンが好ましい。
以上のような本発明の包接錯体は、たとえば、特開2007−39449号公報に記載の方法により製造することができるが、以下に、その概要を記載する。
カルボン酸化合物又は式(I)で表されるテトラキスフェノール化合物及び式(II)で表されるイミダゾール化合物又はイミダゾリン化合物を溶媒に添加後、必要に応じて攪拌しながら、加熱処理又は加熱還流処理を行い、析出させることにより得ることができる。
溶媒としては、本発明の化合物を得ることを妨げない限り特に制限はなく、水、メタノール、エタノール、酢酸エチル、酢酸メチル、ジエチルエーテル、ジメチルエーテル、アセトン、メチルエチルケトン、アセトニトリル等を用いることができる。本発明の包接錯体の製造時におけるカルボン酸化合物又は式(I)で表されるテトラキスフェノール化合物と式(II)で表されるイミダゾール化合物又はイミダゾリン化合物との添加割合としては、カルボン酸化合物又は式(I)で表されるテトラキスフェノール化合物(ホスト)1モルに対して、式(II)で表されるイミダゾール化合物又はイミダゾリン化合物(ゲスト)が、0.1〜5.0モルであることが好ましく、0.5〜3.0モルであることがより好ましい。
反応終了後は、通常の分離手段により目的とする包接錯体を単離することができる。
得られる包接錯体の構造は、NMR、固体NMRスペクトル、赤外吸収スペクトル(IR)、マススペクトル、X線回折(XRD)パターン等公知の分析手段により確認することができる。また、包接錯体の組成は、熱分析、1H−NMRスペクトル、高速液体クロマトグラフィー(HPLC)、TG−DTA、元素分析等により確認することができる。
エポキシ樹脂としては、従来公知の各種ポリエポキシ化合物が使用でき、粉体塗料として用いることができれば、特に限定するものではないが、例えば、以下のものが挙げられる。
ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、フェノールノボラック型又はクレゾールノボラック型エポキシ樹脂、脂環式エポキシ樹脂、水添ビスフェノールA型もしくはAD型エポキシ樹脂、プロピレングリコールジグリシジルエーテル、ペンタエリスリトールポリグリシジルエーテルなどの脂肪族系エポキシ樹脂、脂肪族若しくは芳香族カルボン酸とエピクロルヒドリンとから得られるエポキシ樹脂、脂肪族若しくは芳香族アミンとエピクロルヒドリンとから得られるエポキシ樹脂、複素環エポキシ樹脂、スピロ環含有エポキシ樹脂、エポキシ変性樹脂等が挙げられる。
また、エポキシ樹脂の軟化点は特に限定されるものではないが、軟化点が50〜160℃が好ましく、60〜150℃がさらに好ましい。
エポキシ・ポリエステルハイブリッド樹脂としては、エポキシ樹脂にポリエステル樹脂を配合したハイブリッドが使用でき、配合するポリエステル樹脂は構造の一部がエポキシ基や芳香族カルボン酸で置換したエポキシ変性ポリエステル樹脂、カルボン酸置換ポリエステル樹脂であってもよい。
また、エポキシ・ポリエステルハイブリッド樹脂の軟化点は特に限定されるものではないが、軟化点が50〜160℃が好ましく、60〜150℃がさらに好ましい。
本発明の硬化性粉体塗料組成物は、エポキシ樹脂、包接錯体、及び所望によりその他の添加剤の所定量からなる混合物を、例えば、ニーダーや押出し機等を使用して、増粘、ゲル化の起こらない温度、時間条件で溶融、混練し、冷却後、粉砕し、分級機にかけることにより製造することができる。
本発明の硬化性粉体塗料組成物においては、硬化剤又は硬化促進剤、例えば、アミン系化合物、イミダゾール系化合物、イミダゾリン系化合物、アミド系化合物、エステル系化合物、フェノール系化合物、アルコール系化合物、チオール系化合物、エーテル系化合物、チオエーテル系化合物、尿素系化合物、チオ尿素系化合物、ルイス酸系化合物、リン系化合物、酸無水物系化合物、オニウム塩系化合物、活性珪素化合物−アルミニウム錯体等をさらに添加してもよい。
脂肪族アミン類としては、エチレンジアミン、トリメチレンジアミン、テトラメチレンジアミン、ヘキサメチレンジアミン、ジエチレントリアミン、トリエチレンテトラミン、テトラエチレンペンタミン、ジプロピレンジアミン、ジメチルアミノプロピルアミン、ジエチルアミノプロピルアミン、トリメチルヘキサメチレンジアミン、ペンタンジアミン、ビス(2−ジメチルアミノエチル)エーテル、ペンタメチルジエチレントリアミン、アルキル−t−モノアミン、1,4−ジアザビシクロ(2,2,2)オクタン(トリエチレンジアミン)、N,N,N’,N’−テトラメチルヘキサメチレンジアミン、N,N,N’,N’−テトラメチルプロピレンジアミン、N,N,N’,N’−テトラメチルエチレンジアミン、N,N−ジメチルシクロヘキシルアミン、ジメチルアミノエトキシエトキシエタノール、ジメチルアミノヘキサノール等が挙げられる。
変性アミン類としては、エポキシ化合物付加ポリアミン、マイケル付加ポリアミン、マンニッヒ付加ポリアミン、チオ尿素付加ポリアミン、ケトン封鎖ポリアミン、ジシアンジアミド、グアニジン、有機酸ヒドラジド、ジアミノマレオニトリル、アミンイミド、三フッ化ホウ素−ピペリジン錯体、三フッ化ホウ素−モノエチルアミン錯体等が挙げられる。
アミド系化合物としては、例えばダイマー酸とポリアミンとの縮合により得られるポリアミド等が挙げられる。
エステル系化合物としては、例えばカルボン酸のアリール及びチオアリールエステルのような活性カルボニル化合物が挙げられる。
尿素系化合物、チオ尿素系化合物、ルイス酸系化合物としては、ブチル化尿素、ブチル化メラミン、ブチル化チオ尿素、三フッ化ホウ素等が挙げられる。
その他の添加剤としては、ビニルトリメトキシシラン、ビニルトリエトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、γ−グリシドキシプロピルトリエトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン、γ−メタクリロキシプロピルトリエトキシシラン、γ−アミノプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、N−β(アミノエチル)γ−アミノプロピルトリメトキシシラン、N−β(アミノエチル)γ−アミノプロピルトリエトキシシラン、N−フェニル−γ−アミノプロピルトリメトキシシラン、N−フェニル−γ−アミノプロピルトリエトキシシラン、γ−メルカプトプロピルトリメトキシシラン、γ−メルカプトプロピルトリエトキシシラン等のシランカップリング剤;重炭酸カルシウム、軽質炭酸カルシウム、天然シリカ、合成シリカ、溶融シリカ、カオリン、クレー、酸化チタン、硫酸バリウム、酸化亜鉛、水酸化アルミニウム、水酸化マグネシウム、タルク、マイカ、ウォラスナイト、チタン酸カリウム、ホウ酸アルミニウム、セピオライト、ゾノトライト等の充填剤;NBR、ポリブタジエン、クロロプレンゴム、シリコーン、架橋NBR、架橋BR、アクリル系、コアシェルアクリル、ウレタンゴム、ポリエステルエラストマー、官能基含有液状NBR、液状ポリブタジエン、液状ポリエステル、液状ポリサルファイド、変性シリコーン、ウレタンプレポリマー等のエラストマー変性剤;
本発明の硬化性粉体塗料組成物の硬化物は、たとえば当該組成物を基材に塗装やコーティングすることにより得られる硬化膜等がある。
塗装は、公知の塗装方法により行うことができる。
本発明の硬化性粉体塗料組成物は、長期にわたって保存する場合であっても殆ど硬化反応が進行しないものであり、貯蔵安定性に優れている。
得られる塗膜の厚みは特に限定されないが、通常、約20〜200μm、好ましくは40〜100μmの範囲である。
塗膜を加熱することで、包接錯体中に包接されている式(II)で表されるイミダゾール化合物又はイミダゾリン化合物が放出され、硬化反応が進行することで硬化膜を形成することができる。
本発明の粉体塗料組成物は、木、合板、プラスチック、金属、及びこれらの組み合わせ等の基材の表面塗装や、家電製品、建材、水道管、パイプライン、自動車部品等の分野における塗料として好適に使用することができる。
具体的には、携帯電話、電池、電気用部品、電化製品の装飾又は防蝕、スチール又は木製家具の装飾又は防蝕、水道又は下水等の配管又は接続部の塗装、ガードレール、信号機等の道路標識、建屋等の屋根又は外壁の装飾又は防蝕、玩具類の装飾又は防蝕、トロフィー又は表示板、椅子、架台、台車、自動車、バイク、自転車等の部品又はかご等の用途の塗料として好適に使用することができる。
なお、略語の定義は次の通りである。
(ホスト分子)
NIPA:5−ニトロイソフタル酸
HIPA:5−ヒドロキシイソフタル酸
TEP:1,1,2,2−テトラキス(4−ヒドロキシフェニル)エタン
TMLA:1, 2, 4−ベンゼントリカルボン酸(トリメリット酸)
TMSA:1, 3, 5−ベンゼントリカルボン酸(トリメシン酸)
TPTA:テレフタル酸
IPTA:イソフタル酸
SUCA:コハク酸
(ゲスト分子)
2E4MZ:2−エチル−4−メチルイミダゾール
1MZ:1−メチルイミダゾール
2MZ:2−メチルイミダゾール
4MZ:4−メチルイミダゾール
1,2DMZ:1,2−ジメチルイミダゾール
2MZL:2−メチルイミダゾリン
Im:イミダゾール
また、包接錯体の表記は、ホスト化合物−ゲスト化合物の順に記し、続く括弧内にホスト化合物とゲスト化合物の包接比(モル比)を記す。例えば、「TEP-2E4MZ(1:1)」は、ホスト化合物がTEP、ゲスト化合物が2E4MZであり、包接比が1:1である包接錯体を意味する。
第1表に示す量のエポキシ樹脂100重量部に対し、包接錯体(イミダゾールとして1.5重量部)、酸化チタン、表面調整剤をミルTML17(テスコム社製)でよく混合させた後に、ロール表面温度を100℃に加熱したミキシングロールミルMR−3 1/2×8(井上製作所社製)で溶融混練を5分間行った。その後、混練混合物を室温にまで冷却させた後に、高速スタンプミルANS−143PL(日陶科学社製)による粗粉砕を行い目開き1mmの篩をかけた。最後に、ウルマックス(登録商標、日曹エンジニアリング社製)を用いた気流粉砕を行い、目開き106μmの篩がけをして粉体塗料とした。
各実施例の硬化性粉体塗料組成物の適量を金属製ヘラで130℃の熱板に置き、金属製ヘラを使ってかき混ぜ、試料に粘着性がなくなり、粘着性がなくなった時間を計測した。同様に150℃の熱板を用いて測定したときと併せ、結果を第2表に示す。
実施例1〜24および比較例で得られた硬化性粉体塗料組成物を寸法0.8×70×150mmφ5−1(吊り下げ用 穴付き)のリン酸亜鉛処理鋼板品名SPCC−SB(PB−L3020)(パルテック社製)に、硬化膜厚が40〜60μmになるようにコロナ式手吹き塗装機(ワーグナー社製)にて静電噴霧塗装を行った。その後、130℃に設定された乾燥炉に15分間投入して加熱し塗膜を得た。このようにして得られた塗膜について、下記の性能を評価し、その結果を第3表に示す。
また、塗装した後に150℃に設定された乾燥炉に20分間投入し得られた塗膜についても、同様に試験を行った結果を第4表に示す。
光沢度計(GMX−202 村上色彩技術研究所社製)を用いて、JIS K 5600−4−7に準拠し、20度及び60度鏡面光沢度を測定した。
JIS K 5600−1−1の4.4に準じて目視により観察し、ピンホール、膨れ、はがれ、割れ、しわ、色むらなどが見られなく正常であるものを◎、極めて小さい異常が見られるものを○、異常があるものを×とした。
JIS K 5600−5−6に記載された方法(クロスカット法)に準拠して行った。試験結果の分類はJIS記載の碁盤目試験評価点に従い表記した。
JIS K 5600−5−4に記載された方法(引っかき硬度(鉛筆法))に準拠して測定した。表示は鉛筆硬度記号で示した。
キムワイプS200(日本製紙クレシア(株)社製)にメチルエチルケトン(MEK)又は酢酸エチル(AcOEt)をしみ込ませて、粉体塗料を焼き付けたガラス面を10往復こすり外観観察した。変化がないものをA、キムワイプへ若干塗料の移りが見られるものをB、キムワイプへの塗料の移りが多く見られるものをC、表面が変形するものをD、溶剤に溶解するものをEとした。
日本電色工業製、型式SD5000で測定した白色度(WB値, JIS P8123)及び色彩値(L*、a*、b*)を示した。白色度(WB値)は、数値が大きいほど白色度が高いことを表している。
JIS K 5600−5−3の6.デュポン式衝撃試験に準じて、おもり500g、撃芯1/2インチの条件で塗膜表面の上に落下させ、塗膜に割れ、剥がれのない重りの高さ(cm)を示した。
(平滑性)
硬化物の表面を指で触った感触、並びに目視にて評価した。×:塗膜にムラがあり著しく凹凸があることが認められる表面、○:ほとんど凹凸を感じない表面、◎:全く凹凸を感じない表面
実施例1〜24および比較例の硬化性粉体塗料組成物を40℃で40日間保存したものを用い、上記2と同様にゲルタイムを測定した。結果を第5表に、保存前の組成物の結果と共に示す。
また、実施例1〜24および比較例の硬化性粉体塗料組成物を40℃で40日間保存したものを用い、上記3と同条件で塗装、焼き付けたサンプルについて同様の試験を行った。130℃で15分焼き付けた結果を第6表、150℃で20分焼き付けた結果を第7表に、それぞれ保存前の組成物を焼き付けた結果と共に示す。
第5表の保存安定性の結果より、比較例と比較してゲルタイムが長いことから本発明の硬化性粉体塗料組成物は、加熱硬化時での流動性が保たれ、その結果、得られる塗膜の均一性、平滑性が優ることがわかった。また、比較例と比較して40℃40日間保管後のゲルタイムの変化が小さいことから、保存性の良い組成物であることがわかった。特にHIPAやNIPA等の芳香族カルボン酸を含有する包接錯体を用いた場合はその効果は顕著であった。
第6表の光沢度及び白色度の結果より、本発明の硬化性粉体塗料組成物の硬化物は、その光沢度及び白色度の値が高く、硬化物の表面は良好であることがわかった。特にHIPAやNIPA等の芳香族カルボン酸やコハク酸等の脂肪族カルボン酸を含有する包接錯体を用いた場合はその硬化は顕著であった。また、有機溶剤型塗料であれば有機溶媒種やその濃度を調整する事で、平滑性を有する膜を製作する事はできるが、無溶媒の組成物でこのような光沢度、白色度または平滑性を有する膜を作製できたことは本発明の組成物の優位性を表している。なお、本発明の組成物に有機溶媒を含有しても特に問題は生じない。
第3表および第4表の耐衝撃性の結果から、TEP等のテトラキスフェノール化合物および無置換イミダゾール(Im)を含有する包接錯体を用いた硬化性粉体塗料組成物の硬化物は、TEPおよび2E4MZを含有する包接錯体を用いた場合よりも基板金属との密着性や機械的な衝撃に強い良好な結果であった。
また、表4の結果より、本発明の硬化性粉体塗料組成物の硬化物は、光沢度が低く、外観及び平滑性の結果が良好なことから、艶消し効果があることが分かった。特に、実施例24が優れている。
従来の低温硬化型粉体塗料は、加熱硬化とともに溶融樹脂粘度が上昇し、流動性が喪失する。そのため、塗料粉末を噴霧などで吹き付けた状態で硬化するので、得られる硬化膜の塗装面の平滑性は乏しくなる。しかしながら、本発明の硬化性粉体塗料組成物では、加熱により硬化がすぐには開始せずに一旦流動性だけが増し、その後、硬化が始まるため、均一で平滑な硬化膜の塗装面が得られる。
また、塗料製造時の樹脂溶融混練において、エポキシ樹脂の溶融温度以上かつ包接触媒の硬化開始温度以下の温度範囲であれば、混練時の硬化や高粘度化を伴うことなく樹脂混練操作が可能になる。よって、得られる混練組成物の樹脂分散性が良くなるとともに、ハンドリングや生産性の向上が期待できる。
高温硬化型塗料でも高温で硬化させれば同様の効果を期待できるが、温度に弱い基材、熱伝導性が高く、高温にすることができない基材、又は、熱伝導性が悪く均一に高温にすることができない基材には使用することができない。このように、本発明の硬化性粉体塗料組成物は、低温で硬化でき、保存性が良く、塗装面が平滑であるため、非常に有用である。
なお、有機溶剤型塗料や熱可塑粉体塗料を用いることにより、平滑な塗膜面を作製することができるが、有機溶剤型塗料は有機溶媒を使用するため加熱硬化時に有機溶媒を回収する必要が生じ、熱可塑粉体塗料は再加熱で再溶融したり、塗装硬度がやや軟らかい欠点を有している。
さらに、本発明の硬化性粉体塗料組成物は、ホスト化合物とゲスト化合物を適宜組合わせることにより、平滑な塗装面ありながら、微少な凹凸を有する面とすることができるため、塗装面をアンチグレア性、ノングレア性又は艶消し効果を有する表面にすることができる。
本発明の硬化性粉体塗料組成物の硬化物は、低温硬化性でありながら、基板付着性等の物理的特性に優れた良好な硬化塗膜であり、また高い白色度を有する硬化物といった特徴をも有しているため、目的に応じて、好適な特性を持った硬化物を適宜選択することができる。
Claims (6)
- 下記成分(A)及び成分(B)を含有することを特徴とする硬化性粉体塗料組成物。
(A)エポキシ樹脂又はエポキシ・ポリエステルハイブリッド樹脂、
(B)(b1)カルボン酸化合物及び下記式(I)
で表されるテトラキスフェノール化合物からなる群より選ばれる少なくとも1種と、
(b2)式(II)
とを含有する包接錯体。 - (b1)のカルボン酸化合物が芳香族カルボン酸化合物であることを特徴とする請求項1に記載の硬化性粉体塗料組成物。
- イソフタル酸化合物が、5−t−ブチルイソフタル酸、5−ニトロイソフタル酸又は5−ヒドロキシイソフタル酸であることを特徴とする請求項3に記載の硬化性粉体塗料組成物。
- 式(II)で表されるイミダゾ−ル化合物又はイミダゾリン化合物が、イミダゾール、2−エチル−4−メチルイミダゾール、1−メチルイミダゾール、2−メチルイミダゾール、4−メチルイミダゾール、1,2−ジメチルイミダゾール、1−ベンジル−2−メチルイミダゾール、2−ヘプタデシルイミダゾール、2−ウンデシルイミダゾール、2−フェニルイミダゾール、2−フェニル−4−メチル−5−ヒドロキシメチルイミダゾール、2−メチルイミダゾリン又は2−フェニルイミダゾリンであることを特徴とする請求項1〜4のいずれかに記載の硬化性粉体塗料組成物。
- 請求項1〜5のいずれかに記載の硬化性粉体塗料組成物の硬化物。
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US20100022744A1 (en) * | 2006-12-21 | 2010-01-28 | Nippon Soda Co., Ltd. | Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin |
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WO2010103809A1 (ja) * | 2009-03-11 | 2010-09-16 | 日本曹達株式会社 | エポキシ樹脂組成物、硬化剤及び硬化促進剤 |
CN103936676A (zh) * | 2009-03-17 | 2014-07-23 | 日本曹达株式会社 | 包合配合物、固化剂、固化促进剂、环氧树脂组合物及半导体封装用环氧树脂组合物 |
KR101400473B1 (ko) * | 2009-10-16 | 2014-05-28 | 가부시키가이샤 닛소 분세키 센타 | 에폭시 경화 수지 형성용 조성물 및 그 경화물 |
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2011
- 2011-05-16 KR KR1020127029790A patent/KR20130008611A/ko not_active Application Discontinuation
- 2011-05-16 CN CN201180024225.5A patent/CN102892849B/zh not_active Expired - Fee Related
- 2011-05-16 EP EP11783254.3A patent/EP2573148A4/en not_active Withdrawn
- 2011-05-16 WO PCT/JP2011/002698 patent/WO2011145317A1/ja active Application Filing
- 2011-05-16 JP JP2012515744A patent/JP5721705B2/ja not_active Expired - Fee Related
- 2011-05-16 US US13/697,975 patent/US20130059942A1/en not_active Abandoned
- 2011-05-20 TW TW100117849A patent/TWI512059B/zh not_active IP Right Cessation
- 2011-05-20 TW TW102138134A patent/TWI537350B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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EP2573148A4 (en) | 2014-02-19 |
EP2573148A1 (en) | 2013-03-27 |
CN102892849A (zh) | 2013-01-23 |
WO2011145317A1 (ja) | 2011-11-24 |
TW201406886A (zh) | 2014-02-16 |
TWI537350B (zh) | 2016-06-11 |
JP5721705B2 (ja) | 2015-05-20 |
CN102892849B (zh) | 2016-01-20 |
TW201209112A (en) | 2012-03-01 |
TWI512059B (zh) | 2015-12-11 |
US20130059942A1 (en) | 2013-03-07 |
KR20130008611A (ko) | 2013-01-22 |
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