JPWO2010074119A1 - 外部電極用導電性ペースト、及びそれを用いて形成した外部電極を有する積層セラミック電子部品 - Google Patents
外部電極用導電性ペースト、及びそれを用いて形成した外部電極を有する積層セラミック電子部品 Download PDFInfo
- Publication number
- JPWO2010074119A1 JPWO2010074119A1 JP2010544097A JP2010544097A JPWO2010074119A1 JP WO2010074119 A1 JPWO2010074119 A1 JP WO2010074119A1 JP 2010544097 A JP2010544097 A JP 2010544097A JP 2010544097 A JP2010544097 A JP 2010544097A JP WO2010074119 A1 JPWO2010074119 A1 JP WO2010074119A1
- Authority
- JP
- Japan
- Prior art keywords
- copper
- conductive paste
- external electrodes
- amino
- external electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000919 ceramic Substances 0.000 title claims abstract description 43
- 239000002245 particle Substances 0.000 claims abstract description 57
- 239000010949 copper Substances 0.000 claims abstract description 43
- -1 amino compound Chemical class 0.000 claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 claims abstract description 33
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 230000008018 melting Effects 0.000 claims abstract description 26
- 238000002844 melting Methods 0.000 claims abstract description 26
- 150000001875 compounds Chemical class 0.000 claims abstract description 21
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 claims abstract description 18
- 239000002923 metal particle Substances 0.000 claims abstract description 17
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical compound [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 claims abstract description 16
- YEOCHZFPBYUXMC-UHFFFAOYSA-L copper benzoate Chemical compound [Cu+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 YEOCHZFPBYUXMC-UHFFFAOYSA-L 0.000 claims abstract description 14
- 238000002156 mixing Methods 0.000 claims abstract description 14
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 10
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims abstract description 9
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 claims abstract description 7
- ZKXWKVVCCTZOLD-UHFFFAOYSA-N copper;4-hydroxypent-3-en-2-one Chemical compound [Cu].CC(O)=CC(C)=O.CC(O)=CC(C)=O ZKXWKVVCCTZOLD-UHFFFAOYSA-N 0.000 claims abstract description 7
- VNZQQAVATKSIBR-UHFFFAOYSA-L copper;octanoate Chemical compound [Cu+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O VNZQQAVATKSIBR-UHFFFAOYSA-L 0.000 claims abstract description 7
- QYCVHILLJSYYBD-UHFFFAOYSA-L copper;oxalate Chemical compound [Cu+2].[O-]C(=O)C([O-])=O QYCVHILLJSYYBD-UHFFFAOYSA-L 0.000 claims abstract description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 44
- 239000000956 alloy Substances 0.000 claims description 44
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 239000003822 epoxy resin Substances 0.000 claims description 18
- 229920000647 polyepoxide Polymers 0.000 claims description 18
- 239000002131 composite material Substances 0.000 claims description 16
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- 239000003990 capacitor Substances 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 12
- 229910052718 tin Inorganic materials 0.000 claims description 12
- 150000008064 anhydrides Chemical class 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- FAXDZWQIWUSWJH-UHFFFAOYSA-N 3-methoxypropan-1-amine Chemical compound COCCCN FAXDZWQIWUSWJH-UHFFFAOYSA-N 0.000 claims description 7
- 125000003277 amino group Chemical group 0.000 claims description 6
- 229910007637 SnAg Inorganic materials 0.000 claims description 5
- CBTVGIZVANVGBH-UHFFFAOYSA-N aminomethyl propanol Chemical compound CC(C)(N)CO CBTVGIZVANVGBH-UHFFFAOYSA-N 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 5
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 4
- 229940058020 2-amino-2-methyl-1-propanol Drugs 0.000 claims description 4
- OTBHHUPVCYLGQO-UHFFFAOYSA-N bis(3-aminopropyl)amine Chemical compound NCCCNCCCN OTBHHUPVCYLGQO-UHFFFAOYSA-N 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 150000004685 tetrahydrates Chemical class 0.000 claims description 4
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 2
- ASUDFOJKTJLAIK-UHFFFAOYSA-N 2-methoxyethanamine Chemical compound COCCN ASUDFOJKTJLAIK-UHFFFAOYSA-N 0.000 claims description 2
- SOYBEXQHNURCGE-UHFFFAOYSA-N 3-ethoxypropan-1-amine Chemical compound CCOCCCN SOYBEXQHNURCGE-UHFFFAOYSA-N 0.000 claims description 2
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 claims description 2
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 claims description 2
- 150000004683 dihydrates Chemical class 0.000 claims description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 2
- 150000004682 monohydrates Chemical class 0.000 claims description 2
- QHJABUZHRJTCAR-UHFFFAOYSA-N n'-methylpropane-1,3-diamine Chemical compound CNCCCN QHJABUZHRJTCAR-UHFFFAOYSA-N 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 abstract description 15
- 229910052751 metal Inorganic materials 0.000 abstract description 5
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- 238000000034 method Methods 0.000 description 12
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- 238000006243 chemical reaction Methods 0.000 description 10
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 10
- 229910052709 silver Inorganic materials 0.000 description 10
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 125000003710 aryl alkyl group Chemical group 0.000 description 8
- 238000007639 printing Methods 0.000 description 8
- 229920003987 resole Polymers 0.000 description 8
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 6
- 239000003985 ceramic capacitor Substances 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 229910052738 indium Inorganic materials 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000008096 xylene Substances 0.000 description 6
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 229910002056 binary alloy Inorganic materials 0.000 description 5
- 229910052797 bismuth Inorganic materials 0.000 description 5
- 239000003638 chemical reducing agent Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 235000019253 formic acid Nutrition 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- QIRNGVVZBINFMX-UHFFFAOYSA-N 2-allylphenol Chemical compound OC1=CC=CC=C1CC=C QIRNGVVZBINFMX-UHFFFAOYSA-N 0.000 description 4
- 229910001316 Ag alloy Inorganic materials 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- LSIWWRSSSOYIMS-UHFFFAOYSA-L copper;diformate;tetrahydrate Chemical compound O.O.O.O.[Cu+2].[O-]C=O.[O-]C=O LSIWWRSSSOYIMS-UHFFFAOYSA-L 0.000 description 4
- 150000002170 ethers Chemical class 0.000 description 4
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- LMVLMHGTZULBRX-UHFFFAOYSA-N 2-[2,2,2-tris(2-hydroxyphenyl)ethyl]phenol Chemical compound OC1=CC=CC=C1CC(C=1C(=CC=CC=1)O)(C=1C(=CC=CC=1)O)C1=CC=CC=C1O LMVLMHGTZULBRX-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
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- 239000003085 diluting agent Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
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- 150000002576 ketones Chemical class 0.000 description 3
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- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- KRMMZNOTUOIFQX-UHFFFAOYSA-N c(cc1)ccc1N(c1ccccc1)N(c1ccccc1)c1ccccc1 Chemical compound c(cc1)ccc1N(c1ccccc1)N(c1ccccc1)c1ccccc1 KRMMZNOTUOIFQX-UHFFFAOYSA-N 0.000 description 1
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- 125000004494 ethyl ester group Chemical group 0.000 description 1
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- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 239000012860 organic pigment Substances 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
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- 229920002492 poly(sulfone) Polymers 0.000 description 1
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- 229920000642 polymer Polymers 0.000 description 1
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- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
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- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- JKOCEVIXVMBKJA-UHFFFAOYSA-M silver;butanoate Chemical compound [Ag+].CCCC([O-])=O JKOCEVIXVMBKJA-UHFFFAOYSA-M 0.000 description 1
- CYLMOXYXYHNGHZ-UHFFFAOYSA-M silver;propanoate Chemical compound [Ag+].CCC([O-])=O CYLMOXYXYHNGHZ-UHFFFAOYSA-M 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- 239000013008 thixotropic agent Substances 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H01C—RESISTORS
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- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
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Abstract
Description
NR1R2R3 (i)
(式中、R1は、水酸基、メトキシ基、エトキシ基又はアミノ基で一置換されている炭素数2〜4のアルキル基を表し、R2及びR3は、それぞれ独立して、水素であるか、又は水酸基もしくはアミノ基で置換されていてもよい炭素数1〜3のアルキル基を表す)で示されるアミノ化合物が好ましく、R2及びR3の少なくとも一方が水素である、式(i)のアミノ化合物がより好ましい。
下記表1の組成で各成分を混合し、実施例及び比較例の各ペーストを調製した(表中の数字は、断りのない限り重量部である)。
2)平均粒子径12μm、純度99%以上
3)球状、平均粒子径2.5μm、純度99%以上、融点410℃
4)球状、平均粒子径2.5μm、純度99%以上、融点590℃
5)平均粒子径3.0μm、純度99%以上、融点420℃
6)銅換算量
7)銅換算量
8)銀換算量
9)銅換算量
10)1,1,2,2−テトラキス(ヒドロキシフェニル)エタン型固形エポキシ樹脂、エポキシ当量:200(g/eq)
11)アラルキルノボラック型フェノール樹脂(フェノール・p−キシリレングリコールジメチルエーテル重縮合物)、OH当量169
12)2−フェニル−4−メチル−5−ヒドロキシメチルイミダゾール
13)粘度が約20Pa・Sになるように適量添加(粘度は、ブルックフィールドDV−1型粘度系で10rpmにて室温で測定した)。
Cu含有ペースト1:500cm3容フラスコに、ギ酸銅(四水和物)(日本化学産業(株)製)を0.3モル、2−アミノ−2−メチル−プロパノールを1.2モル投入し、室温で5時間撹拌して、ギ酸銅(四水和物)が可溶化したペーストを調製した。
Cu含有ペースト2:500cm3容フラスコに、酢酸銅(無水物)を0.3モル、3−メトキシプロピルアミンを1.2モル投入し、室温で5時間撹拌して、酢酸銅(無水物)が可溶化したペーストを調製した。
Ag微粒子含有ペースト:10Lのガラス製反応容器に3−メトキシプロピルアミン4.0kg(45.0モル)を入れた。撹拌しながら、反応温度を45℃以下に保持しつつ、酢酸銀5.0kg(30.0モル)を添加した。添加直後は、透明な溶液となり溶解していくが、添加が進むにつれ溶液が次第に濁り、全量を添加すると灰茶濁色の粘調溶液となった。そこへ95重量%のギ酸0.73kg(15.0モル)をゆっくり滴下した。滴下直後から激しい発熱が認められたが、その間、反応温度を30〜45℃に保持した。当初、灰濁色の粘調溶液が、茶色から黒色へ変化した。全量を滴下した後反応を終了させた。反応混合物を40℃で静置すると二層に分かれた。上層は黄色の透明な液であり、下層には黒色のAg微粒子が沈降した。上層の液には、Ag成分が含まれていなかった。上層の液をデカンテーションで除去し、メタノールを使用して層分離させてAg含有率89重量%の真球状のAg微粒子を得た。
得られたAg微粒子は次のとおり。平均粒子径130nm、結晶子径40nm、平均粒子径/結晶子径=3.25。ここで、平均粒子径は、走査型電子顕微鏡(SEM)で観察して画像解析により求めたヘイウッド径の平均値であり、結晶子径は、マックサイエンス社製X線回折測定装置(M18XHF22)による測定によって、CuのKα線を線源とした面指数(1,1,1)面ピークの半値幅を求め、Scherrerの式より計算した値である。
表1に示した各ペーストを、チップ積層コンデンサのセラミック複合体(3216タイプ、B特性、ニッケル内部電極、理論容量10μF)の内部電極取り出し面に、硬化後の厚さが20μm程度になるようにesi社製パロマ印刷機(型番:MODEL2001)で均一に浸漬塗布し、150℃で30分間乾燥した後、リフロー炉で大気中、300℃、40分間硬化を行い外部電極を形成した。続いてワット浴でニッケルメッキを行い、次いで電解メッキによりスズメッキを行い、チップ積層コンデンサを得た。
幅20mm、長さ20mm、厚さ1mmのアルミナ基板上に、250メッシュのステンレス製スクリーンを用い、長さ71mm、幅1mm、厚さ20μmのジグザグパターン印刷を行い、150℃で10分乾燥後、大気中で300℃、40分間硬化させ、外部電極を形成した。ジグザグパターンの厚さは、東京精密製表面粗さ形状測定機(製品名:サーフコム1400)にて、パターンと交差するように測定した6点の数値の平均より求めた。硬化後に、LCRメーターを用い、4端子法で比抵抗を測定した。結果を表2に示す。実施例1〜13は、0.3〜2.7×10-4Ω・cmであった。比較例7は、3.7×10-4Ω・cmであった。
上記で得られたチップ積層コンデンサ素子の初期の静電容量、誘電正接(tanδ)をAgilent製4278Aを用い、室温にて周波数1kHzで測定した。次に、−55℃で30分、耐ヒートサイクル試験(−55℃/125℃(30分/30分);750サイクル)、及び耐湿性試験(プレッシャークッカーテスト:2気圧で121℃(20時間))後の電気特性を初期の特性と同様に測定した。
2 セラミック誘電体
3 内部電極
4 外部電極
5 メッキ処理層
Claims (14)
- (A)平均粒子径が0.2〜30μmである、融点が700℃以上の金属粒子と、
(B)平均粒子径が0.2〜18μmである、融点が200℃以上700℃未満の金属粒子と、
(C)硝酸銅、シアン化銅、オクタン酸銅、ギ酸銅、酢酸銅、シュウ酸銅、安息香酸銅及び銅アセチルアセトナートからなる群より選択される銅含有化合物;アミノ化合物;並びに場合により有機溶媒を混合してなるペーストと、
(D)熱硬化性樹脂と
を含有する、外部電極用導電性ペースト。 - (C)における銅含有化合物が、ギ酸銅(無水物)、ギ酸銅(二水和物)、ギ酸銅(四水和物)、酢酸銅(無水物)及び酢酸銅(一水和物)からなる群より選択される1種以上である、請求項1記載の外部電極用導電性ペースト。
- (C)におけるアミノ化合物が、式(i):NR1R2R3 (i)
式中、R1は、水酸基、メトキシ基、エトキシ基又はアミノ基で一置換されている炭素数2〜4のアルキル基を表し、R2及びR3は、それぞれ独立して、水素であるか、又は水酸基もしくはアミノ基で置換されていてもよい炭素数1〜3のアルキル基を表す
で示されるアミノ化合物の1種以上である、請求項1又は2記載の外部電極用導電性ペースト。 - (C)における式(i)のアミノ化合物が、3−メトキシプロピルアミン、3−エトキシプロピルアミン、1−アミノ−2−プロパノール、3−アミノ−1−プロパノール、2−アミノエタノール、N−メチルエタノールアミン、2−アミノ−2−メチル−1−プロパノール、N−メチル−1,3−ジアミノプロパン、3,3’−ジアミノジプロピルアミン、2−メトキシエチルアミン、1,3−ジアミノプロパン、2,2’−イミノジエタノール、2−ジメチルアミノエタノール及び2−(2−アミノエチルアミノ)エタノールからなる群より選択される1種以上である、請求項3記載の外部電極用導電性ペースト。
- (A)と(B)と(C)の銅換算量との合計100重量部に対して、(A)が55〜85重量部であり、(B)が10〜45重量部であり、(C)の銅換算量が0.05〜5重量部であり、(D)が5〜20重量部である、請求項1〜4のいずれか1項記載の外部電極用導電性ペースト。
- (A)が、(A1)平均粒子径0.2〜5μmの球状のAg粒子及び(A2)平均粒子径5〜30μmのフレーク状のAg粒子からなり、(A1)と(A2)の重量比が99:1〜75:25である、請求項1〜5のいずれか1項記載の外部電極用導電性ペースト。
- (B)が、SnとAgの重量比が、89:11〜25.5:74.5であるSnAg合金の粒子である、請求項1〜6のいずれか1項記載の外部電極用導電性ペースト。
- (D)が、エポキシ樹脂を含む、請求項1〜7のいずれか1項記載の外部電極用導電性ペースト。
- (E)平均粒子径が15〜150nmである、融点が700℃以上の金属粒子をさらに含む、請求項1〜9のいずれか1項記載の外部電極用導電性ペースト。
- セラミック複合体上に、請求項1〜10のいずれか1項記載の外部電極用導電性ペーストを用いて形成した外部電極を有する積層セラミック電子部品。
- セラミック複合体の内部電極がNiを主成分とする、請求項11記載の積層セラミック電子部品。
- 外部電極の表面に、更にニッケルメッキ層を形成し、次いでスズメッキ層を形成した、請求項11又は12に記載の積層セラミック電子部品。
- 積層セラミック電子部品が、コンデンサ、コンデンサアレイ、サーミスタ、バリスター、インダクタ並びにLC、CR、LR及びLCR複合部品のいずれかである、請求項11〜13のいずれかに1項記載の積層セラミック電子部品。
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JP2012126814A (ja) * | 2010-12-15 | 2012-07-05 | Tosoh Corp | 導電性インク組成物、及び電気的導通部位の製造方法 |
JP2012126815A (ja) * | 2010-12-15 | 2012-07-05 | Tosoh Corp | 導電性インク組成物及びその製造方法 |
JP2012131894A (ja) * | 2010-12-21 | 2012-07-12 | Tosoh Corp | 導電性インク組成物、及びそれを用いて製造された電気的導通部位 |
JP5769340B2 (ja) * | 2011-09-14 | 2015-08-26 | ナミックス株式会社 | 導電性組成物及び導電膜 |
US9490055B2 (en) * | 2011-10-31 | 2016-11-08 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and manufacturing method thereof |
US8988855B2 (en) * | 2011-10-31 | 2015-03-24 | Murata Manufacturing Co., Ltd. | Method of manufacturing ceramic electronic component including heating an electrode layer to form a conductive layer including an alloy particle |
US9202640B2 (en) * | 2011-10-31 | 2015-12-01 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and manufacturing method thereof |
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