JPWO2010001831A1 - 有機elパネルおよび有機elパネルの製造方法 - Google Patents
有機elパネルおよび有機elパネルの製造方法 Download PDFInfo
- Publication number
- JPWO2010001831A1 JPWO2010001831A1 JP2010519047A JP2010519047A JPWO2010001831A1 JP WO2010001831 A1 JPWO2010001831 A1 JP WO2010001831A1 JP 2010519047 A JP2010519047 A JP 2010519047A JP 2010519047 A JP2010519047 A JP 2010519047A JP WO2010001831 A1 JPWO2010001831 A1 JP WO2010001831A1
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- substrate
- sealing material
- organic
- sec
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title abstract description 37
- 239000003566 sealing material Substances 0.000 claims abstract description 159
- 239000000758 substrate Substances 0.000 claims abstract description 149
- 238000007789 sealing Methods 0.000 claims abstract description 116
- 239000007788 liquid Substances 0.000 claims abstract description 28
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 4
- 230000002093 peripheral effect Effects 0.000 claims description 46
- 229920005989 resin Polymers 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 27
- 229920001187 thermosetting polymer Polymers 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 abstract description 16
- 230000001070 adhesive effect Effects 0.000 abstract description 16
- 239000007787 solid Substances 0.000 abstract description 9
- 230000007547 defect Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 47
- 238000005401 electroluminescence Methods 0.000 description 44
- 239000010408 film Substances 0.000 description 35
- 238000001723 curing Methods 0.000 description 31
- 239000011888 foil Substances 0.000 description 20
- 239000000463 material Substances 0.000 description 19
- -1 etc. Substances 0.000 description 16
- 230000001681 protective effect Effects 0.000 description 14
- 238000003892 spreading Methods 0.000 description 13
- 230000007480 spreading Effects 0.000 description 13
- 230000008569 process Effects 0.000 description 11
- 239000011521 glass Substances 0.000 description 10
- 229910052814 silicon oxide Inorganic materials 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000009736 wetting Methods 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 5
- 239000012044 organic layer Substances 0.000 description 5
- 238000000016 photochemical curing Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000006837 decompression Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 4
- 239000011112 polyethylene naphthalate Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- VQGHOUODWALEFC-UHFFFAOYSA-N 2-phenylpyridine Chemical compound C1=CC=CC=C1C1=CC=CC=N1 VQGHOUODWALEFC-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000011417 postcuring Methods 0.000 description 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- FKASFBLJDCHBNZ-UHFFFAOYSA-N 1,3,4-oxadiazole Chemical compound C1=NN=CO1 FKASFBLJDCHBNZ-UHFFFAOYSA-N 0.000 description 1
- ZHFLRRPGAVPNMB-UHFFFAOYSA-N 1-[3-(9h-carbazol-1-yl)phenyl]-9h-carbazole Chemical compound C12=CC=CC=C2NC2=C1C=CC=C2C1=CC(C2=C3NC=4C(C3=CC=C2)=CC=CC=4)=CC=C1 ZHFLRRPGAVPNMB-UHFFFAOYSA-N 0.000 description 1
- IERDDDBDINUYCD-UHFFFAOYSA-N 1-[4-[4-(9h-carbazol-1-yl)phenyl]phenyl]-9h-carbazole Chemical group C12=CC=CC=C2NC2=C1C=CC=C2C(C=C1)=CC=C1C(C=C1)=CC=C1C1=C2NC3=CC=CC=C3C2=CC=C1 IERDDDBDINUYCD-UHFFFAOYSA-N 0.000 description 1
- YTQQIHUQLOZOJI-UHFFFAOYSA-N 2,3-dihydro-1,2-thiazole Chemical compound C1NSC=C1 YTQQIHUQLOZOJI-UHFFFAOYSA-N 0.000 description 1
- MUNFOTHAFHGRIM-UHFFFAOYSA-N 2,5-dinaphthalen-1-yl-1,3,4-oxadiazole Chemical compound C1=CC=C2C(C3=NN=C(O3)C=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 MUNFOTHAFHGRIM-UHFFFAOYSA-N 0.000 description 1
- PQYIVUDIIIJJDM-UHFFFAOYSA-N 2,5-dinaphthalen-1-yl-1,3,4-thiadiazole Chemical compound C1=CC=C2C(C3=NN=C(S3)C=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 PQYIVUDIIIJJDM-UHFFFAOYSA-N 0.000 description 1
- SSABEFIRGJISFH-UHFFFAOYSA-N 2-(2,4-difluorophenyl)pyridine Chemical compound FC1=CC(F)=CC=C1C1=CC=CC=N1 SSABEFIRGJISFH-UHFFFAOYSA-N 0.000 description 1
- MWKLOMOIKCPLOY-UHFFFAOYSA-N 3,5-dinaphthalen-1-yl-1h-1,2,4-triazole Chemical compound C1=CC=C2C(C3=NN=C(N3)C=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 MWKLOMOIKCPLOY-UHFFFAOYSA-N 0.000 description 1
- UAPNUNDZDVNTDQ-UHFFFAOYSA-N 4,5-diphenyl-1,2,3-triazole Chemical compound C1=CC=CC=C1C1=NNN=C1C1=CC=CC=C1 UAPNUNDZDVNTDQ-UHFFFAOYSA-N 0.000 description 1
- YOPJQOLALJLPBS-UHFFFAOYSA-N 4,5-diphenyloxadiazole Chemical compound C1=CC=CC=C1C1=C(C=2C=CC=CC=2)ON=N1 YOPJQOLALJLPBS-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 1
- 229920000144 PEDOT:PSS Polymers 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004541 SiN Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 125000005595 acetylacetonate group Chemical group 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 150000002503 iridium Chemical class 0.000 description 1
- UEEXRMUCXBPYOV-UHFFFAOYSA-N iridium;2-phenylpyridine Chemical compound [Ir].C1=CC=CC=C1C1=CC=CC=N1.C1=CC=CC=C1C1=CC=CC=N1.C1=CC=CC=C1C1=CC=CC=N1 UEEXRMUCXBPYOV-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- COLNWNFTWHPORY-UHFFFAOYSA-M lithium;8-hydroxyquinoline-2-carboxylate Chemical compound [Li+].C1=C(C([O-])=O)N=C2C(O)=CC=CC2=C1 COLNWNFTWHPORY-UHFFFAOYSA-M 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- WCPAKWJPBJAGKN-UHFFFAOYSA-N oxadiazole Chemical compound C1=CON=N1 WCPAKWJPBJAGKN-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical class N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- QCTJRYGLPAFRMS-UHFFFAOYSA-N prop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical class OC(=O)C=C.NC1=NC(N)=NC(N)=N1 QCTJRYGLPAFRMS-UHFFFAOYSA-N 0.000 description 1
- 150000003220 pyrenes Chemical class 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 229940042055 systemic antimycotics triazole derivative Drugs 0.000 description 1
- VLLMWSRANPNYQX-UHFFFAOYSA-N thiadiazole Chemical compound C1=CSN=N1.C1=CSN=N1 VLLMWSRANPNYQX-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- NVCBVYYESHBQKS-UHFFFAOYSA-L zinc;2-carboxyquinolin-8-olate Chemical compound [Zn+2].C1=C(C([O-])=O)N=C2C(O)=CC=CC2=C1.C1=C(C([O-])=O)N=C2C(O)=CC=CC2=C1 NVCBVYYESHBQKS-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8721—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8794—Arrangements for heating and cooling
Abstract
Description
前記基板および封止基板の少なくとも一方に液状のシール材を配置し、前記基板および封止基板の外周部のシール材のみを50Pa・sec〜5000Pa・secの粘度になるよう仮硬化したのち、前記基板と封止基板を貼合して、前記シール材を封止面全面についてさらに硬化させ密着封止構造を形成することを特徴とする有機ELパネルの製造方法。
図1に本発明の実施形態の一つを示した。
2 シール材
3 封止基板
4 電極領域
10 表示領域
Claims (7)
- 少なくとも第一電極層、発光層を含む有機化合物層、第二電極層からなる有機EL素子を形成した基板に、シール材を介して封止基板を貼合し面接着させて密着封止構造を形成する有機ELパネルの製造方法において、
前記基板および封止基板の少なくとも一方に液状のシール材を配置し、前記基板および封止基板の外周部のシール材のみを50Pa・sec〜5000Pa・secの粘度になるよう仮硬化したのち、前記基板と封止基板を貼合して、前記シール材を封止面全面についてさらに硬化させ密着封止構造を形成することを特徴とする有機ELパネルの製造方法。 - 前記基板および封止基板の少なくとも一方に液状の第1のシール材を配置する工程、前記第1のシール材と同様の液状の第2のシール材をその外周部に配置する工程、前記外周部に配置された第2のシール材のみを50Pa・sec〜5000Pa・secの粘度になるよう硬化する仮硬化工程を含み、該仮硬化工程後に前記基板と封止基板を貼合し、封止面全面についてシール材を硬化させる本硬化工程を有することを特徴とする請求項1に記載の有機ELパネルの製造方法。
- 前記基板と封止基板の貼合は真空・減圧環境下で行い、大気圧または大気圧より高い圧力環境下にてシール材を封止面全面について硬化させることを特徴とする請求項1または2に記載の有機ELパネルの製造方法。
- 硬化前の前記シール材の粘度が、0.05Pa・sec〜50Pa・secであることを特徴とする請求項1〜3のいずれか1項に記載の有機ELパネルの製造方法。
- 仮硬化したときのシール材粘度は、硬化前の粘度に比べ、10〜10000倍であることを特徴とする請求項1〜4のいずれか1項に記載の有機ELパネルの製造方法。
- 前記シール材が、熱硬化樹脂またはUV(紫外線)硬化樹脂であることを特徴とする請求項1〜5のいずれか1項に記載の有機ELパネルの製造方法。
- 請求項1〜6のいずれか1項に記載の有機ELパネルの製造方法を用いて作製されたことを特徴とする有機ELパネル。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008175478 | 2008-07-04 | ||
JP2008175478 | 2008-07-04 | ||
PCT/JP2009/061734 WO2010001831A1 (ja) | 2008-07-04 | 2009-06-26 | 有機elパネルおよび有機elパネルの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2010001831A1 true JPWO2010001831A1 (ja) | 2011-12-22 |
Family
ID=41465928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010519047A Pending JPWO2010001831A1 (ja) | 2008-07-04 | 2009-06-26 | 有機elパネルおよび有機elパネルの製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2010001831A1 (ja) |
WO (1) | WO2010001831A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9661718B2 (en) * | 2011-11-17 | 2017-05-23 | Mitsubishi Heavy Industries, Ltd. | Method for producing organic EL panel and device for sealing organic EL panel |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5550357B2 (ja) * | 2010-01-15 | 2014-07-16 | 株式会社ジャパンディスプレイ | フロントウインドウ付き表示装置 |
JP5623754B2 (ja) * | 2010-02-04 | 2014-11-12 | 株式会社ジャパンディスプレイ | 表示装置およびその製造方法 |
JP2011249021A (ja) * | 2010-05-24 | 2011-12-08 | Lumiotec Inc | 有機el照明パネル及び有機el照明パネルの製造方法 |
JP5657979B2 (ja) * | 2010-09-29 | 2015-01-21 | 芝浦メカトロニクス株式会社 | 貼合装置及び貼合方法 |
JP2012073533A (ja) * | 2010-09-29 | 2012-04-12 | Shibaura Mechatronics Corp | 貼合装置及び貼合方法 |
JP5752402B2 (ja) * | 2010-12-07 | 2015-07-22 | 芝浦メカトロニクス株式会社 | 接着剤供給装置及び接着剤供給方法 |
SG190467A1 (en) * | 2011-11-22 | 2013-06-28 | Trimech Technology Pte Ltd | A laminated product, an apparatus and a method for forming a laminated product |
US9966557B2 (en) | 2012-11-16 | 2018-05-08 | Konica Minolta, Inc. | Translucent electrode, and electronic device |
JP6203566B2 (ja) * | 2013-08-06 | 2017-09-27 | 常陽工学株式会社 | 封止装置および封止方法 |
JP5885279B2 (ja) * | 2014-11-26 | 2016-03-15 | 芝浦メカトロニクス株式会社 | 貼合ワークの製造装置及び貼合ワークの製造方法 |
JP5936747B2 (ja) * | 2015-05-19 | 2016-06-22 | 芝浦メカトロニクス株式会社 | 表示装置を構成する部材の製造装置および製造方法 |
JP6161759B2 (ja) * | 2016-04-05 | 2017-07-12 | 芝浦メカトロニクス株式会社 | 貼合ワークの製造装置及び貼合ワークの製造方法 |
US20220285701A1 (en) * | 2019-09-04 | 2022-09-08 | Nok Corporation | Gasket manufacturing method |
JP2020167174A (ja) * | 2020-06-29 | 2020-10-08 | 株式会社半導体エネルギー研究所 | 発光装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005209631A (ja) * | 2003-12-26 | 2005-08-04 | Semiconductor Energy Lab Co Ltd | 発光装置、電子機器、および発光装置の作製方法 |
JP2006244978A (ja) * | 2005-02-04 | 2006-09-14 | Sekisui Chem Co Ltd | 光デバイスの製造方法及び光デバイス |
JP2007035322A (ja) * | 2005-07-22 | 2007-02-08 | Optrex Corp | 有機ledディスプレイの製造方法および有機ledディスプレイ |
JP2008059867A (ja) * | 2006-08-30 | 2008-03-13 | Seiko Epson Corp | 有機エレクトロルミネッセンス装置とその製造方法及び電子機器 |
JP2008066216A (ja) * | 2006-09-11 | 2008-03-21 | Seiko Epson Corp | 有機エレクトロルミネッセンス装置とその製造方法及び電子機器 |
-
2009
- 2009-06-26 JP JP2010519047A patent/JPWO2010001831A1/ja active Pending
- 2009-06-26 WO PCT/JP2009/061734 patent/WO2010001831A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005209631A (ja) * | 2003-12-26 | 2005-08-04 | Semiconductor Energy Lab Co Ltd | 発光装置、電子機器、および発光装置の作製方法 |
JP2006244978A (ja) * | 2005-02-04 | 2006-09-14 | Sekisui Chem Co Ltd | 光デバイスの製造方法及び光デバイス |
JP2007035322A (ja) * | 2005-07-22 | 2007-02-08 | Optrex Corp | 有機ledディスプレイの製造方法および有機ledディスプレイ |
JP2008059867A (ja) * | 2006-08-30 | 2008-03-13 | Seiko Epson Corp | 有機エレクトロルミネッセンス装置とその製造方法及び電子機器 |
JP2008066216A (ja) * | 2006-09-11 | 2008-03-21 | Seiko Epson Corp | 有機エレクトロルミネッセンス装置とその製造方法及び電子機器 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9661718B2 (en) * | 2011-11-17 | 2017-05-23 | Mitsubishi Heavy Industries, Ltd. | Method for producing organic EL panel and device for sealing organic EL panel |
Also Published As
Publication number | Publication date |
---|---|
WO2010001831A1 (ja) | 2010-01-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2010001831A1 (ja) | 有機elパネルおよび有機elパネルの製造方法 | |
JP6577069B2 (ja) | フレキシブル有機電子デバイスの製造 | |
US6717052B2 (en) | Housing structure with multiple sealing layers | |
JP4699676B2 (ja) | カプセル化された有機電子装置とその製造方法 | |
TWI408755B (zh) | 封入環境敏感裝置的方法 | |
TWI423723B (zh) | 自發光面板之製造方法 | |
JP6070558B2 (ja) | 有機エレクトロルミネッセンス発光装置及びその製造方法 | |
WO2018219270A1 (zh) | Oled显示器件的封装结构、封装方法、显示装置 | |
JP2010027599A (ja) | 有機発光ディスプレイ装置及びその製造方法 | |
JP2007066775A (ja) | 有機el素子の製造方法及び有機el素子 | |
JP2003187963A (ja) | エレクトロルミネッセント素子 | |
US20140339516A1 (en) | Structure and Method for Packaging Organic Optoelectronic Device | |
KR101658822B1 (ko) | 광전자 컴포넌트를 위한 캡슐화 구조 및 광전자 컴포넌트를 캡슐화시키기 위한 방법 | |
JP2014523614A (ja) | オプトエレクトロニクス素子のためのカプセル化構造及びオプトエレクトロニクス素子をカプセル化するための方法 | |
JP2010027596A (ja) | 有機発光ディスプレイ装置及びその製造方法 | |
JP6160107B2 (ja) | 有機エレクトロルミネッセンス発光装置、有機el表示装置及び有機el照明 | |
JP4708360B2 (ja) | 有機エレクトロルミネセンス表示装置及びその製造方法 | |
JP2011009076A (ja) | 有機エレクトロルミネッセンス素子 | |
JP4745181B2 (ja) | 有機el発光装置、及び有機el発光装置の製造方法 | |
JP4736602B2 (ja) | 有機el素子の封止方法及び封止装置 | |
JPWO2008023626A1 (ja) | 有機エレクトロルミネッセンス素子およびその製造方法 | |
WO2011132631A1 (ja) | 有機エレクトロルミネッセンスパネルの製造方法及びその製造方法で製造された有機エレクトロルミネッセンスパネル | |
JP2009295601A (ja) | 封止構造 | |
KR20140048441A (ko) | 유기발광 표시장치 및 그 제조방법 | |
JP2007080711A (ja) | 有機el素子の封止方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120112 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120710 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20120717 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120828 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121106 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20130305 |