JPWO2009034641A1 - ウォータジャケット - Google Patents
ウォータジャケット Download PDFInfo
- Publication number
- JPWO2009034641A1 JPWO2009034641A1 JP2009532020A JP2009532020A JPWO2009034641A1 JP WO2009034641 A1 JPWO2009034641 A1 JP WO2009034641A1 JP 2009532020 A JP2009532020 A JP 2009532020A JP 2009532020 A JP2009532020 A JP 2009532020A JP WO2009034641 A1 JPWO2009034641 A1 JP WO2009034641A1
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- water jacket
- refrigerant
- passage
- jacket according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 57
- 239000003507 refrigerant Substances 0.000 claims abstract description 48
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 18
- 238000012360 testing method Methods 0.000 claims description 66
- 238000001816 cooling Methods 0.000 claims description 33
- 238000005192 partition Methods 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 20
- 239000002826 coolant Substances 0.000 claims description 13
- 230000020169 heat generation Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000011111 cardboard Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
Description
20…ピンエレクトロニクスカード
21…試験用デバイス
22A…MCM
24…カード基板
30…電子部品冷却装置
40…チラー
50…ウォータジャケット
51…通路
51d…段差部
52…隔壁
53…ブロック
54,541〜549…絞り部
55…整流板
56A,56B…バッフル
57…シール部材
60…半導体パッケージ
Claims (14)
- 基板に実装された電子部品を冷媒により冷却するために、前記基板に装着されるウォータジャケットであって、
前記電子部品を収容可能であると共に、前記冷媒が流通可能な通路を備えており、
前記通路は、流路断面積が他の部分よりも小さくなっている絞り部を、前記電子部品の上流に有するウォータジャケット。 - 前記絞り部は、前記電子部品よりも小さな開口幅を有する請求項1記載のウォータジャケット。
- 前記絞り部は、前記冷媒の流通方向に沿って、前記電子部品が有する半導体チップと同一直線上に設けられている請求項2記載のウォータジャケット。
- 前記電子部品が有する半導体チップに前記冷媒を方向付ける指向手段を備えた請求項2記載のウォータジャケット。
- 前記絞り部は、前記電子部品の下流にも設けられている請求項1〜4の何れかに記載のウォータジャケット。
- 前記通路は、複数の前記電子部品を並べた状態で収容することが可能であり、
複数の前記絞り部が、前記各電子部品の上流にそれぞれ設けられている請求項1〜5の何れかに記載のウォータジャケット。 - 前記複数の絞り部は、前記電子部品の発熱量に応じて相互に異なる開口幅を有する請求項6記載のウォータジャケット。
- 前記複数の絞り部の開口幅は、下流に向かうに従って小さくなっている請求項7記載のウォータジャケット。
- 前記通路は、前記各電子部品の間を仕切る隔壁を有しており、
前記絞り部は、前記隔壁に設けられている請求項6〜8の何れかに記載のウォータジャケット。 - 前記隔壁は、第1の隔壁と、前記第1の隔壁に隣接している第2の隔壁と、を含み、
前記第1の隔壁は、前記第2の隔壁から分岐している請求項9記載のウォータジャケット。 - 前記通路は、前記電子部品が有する第1の半導体チップと、前記電子部品が有する第2の半導体チップとの間に、上流から下流に向かって流路断面積を小さくする段差部を有する請求項1〜10の何れかに記載のウォータジャケット。
- 前記通路は、前記冷媒の乱流を生成する乱流生成手段を有する請求項1〜11の何れかに記載のウォータジャケット。
- 基板に実装された電子部品を冷媒により冷却する電子部品冷却装置であって、
請求項1〜12記載の何れかにウォータジャケットと、
前記ウォータジャケットの前記通路に冷媒を供給する冷媒供給手段と、を備えた電子部品冷却装置。 - 被試験電子部品の試験を行う電子部品試験装置であって、
前記被試験電子部品に電気的に接触するコンタクト部と、
試験用電子部品が実装されていると共に、前記コンタクト部に電気的に接続された基板と、
請求項13記載の電子部品冷却装置と、を備え、
前記電子部品冷却装置が有する前記ウォータジャケットは、前記試験用電子部品を冷媒により冷却するために前記基板に装着されている電子部品試験装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/067947 WO2009034641A1 (ja) | 2007-09-14 | 2007-09-14 | ウォータジャケット |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2009034641A1 true JPWO2009034641A1 (ja) | 2010-12-16 |
JP4934199B2 JP4934199B2 (ja) | 2012-05-16 |
Family
ID=40451665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009532020A Expired - Fee Related JP4934199B2 (ja) | 2007-09-14 | 2007-09-14 | ウォータジャケット |
Country Status (7)
Country | Link |
---|---|
US (1) | US8391006B2 (ja) |
JP (1) | JP4934199B2 (ja) |
KR (1) | KR20100040979A (ja) |
CN (1) | CN101785375B (ja) |
DE (1) | DE112007003652T5 (ja) |
TW (1) | TWI403260B (ja) |
WO (1) | WO2009034641A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5722710B2 (ja) * | 2011-06-16 | 2015-05-27 | 株式会社アドバンテスト | 基板組立体及び電子部品試験装置 |
US9433132B2 (en) * | 2014-08-08 | 2016-08-30 | Intel Corporation | Recirculating dielectric fluid cooling |
CN112161847B (zh) * | 2020-09-28 | 2023-03-17 | 成都西核仪器有限公司 | 一种气溶胶和碘取样仪 |
JP2024014522A (ja) | 2022-07-22 | 2024-02-01 | 株式会社アドバンテスト | 自動試験装置およびそのインタフェース装置 |
JP2024014520A (ja) | 2022-07-22 | 2024-02-01 | 株式会社アドバンテスト | 自動試験装置およびそのインタフェース装置 |
JP2024014519A (ja) | 2022-07-22 | 2024-02-01 | 株式会社アドバンテスト | 自動試験装置およびそのインタフェース装置 |
JP2024014521A (ja) | 2022-07-22 | 2024-02-01 | 株式会社アドバンテスト | 自動試験装置およびそのインタフェース装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6451169A (en) | 1987-08-20 | 1989-02-27 | Nec Corp | Method for coating cream solder |
US4884168A (en) * | 1988-12-14 | 1989-11-28 | Cray Research, Inc. | Cooling plate with interboard connector apertures for circuit board assemblies |
JP3424717B2 (ja) | 1996-08-06 | 2003-07-07 | 株式会社アドバンテスト | 発熱素子実装半導体装置 |
JP3381898B2 (ja) | 1997-04-25 | 2003-03-04 | 株式会社アドバンテスト | 発熱体実装冷却装置 |
US6052284A (en) * | 1996-08-06 | 2000-04-18 | Advantest Corporation | Printed circuit board with electronic devices mounted thereon |
JPH11121666A (ja) * | 1997-10-20 | 1999-04-30 | Fujitsu Ltd | マルチチップモジュールの冷却装置 |
US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
JP2001168566A (ja) | 1999-12-09 | 2001-06-22 | Advantest Corp | 電子部品試験装置の冷却装置 |
JP3473540B2 (ja) * | 2000-02-23 | 2003-12-08 | 日本電気株式会社 | 半導体レーザの冷却装置 |
JP2002280507A (ja) | 2001-03-19 | 2002-09-27 | Advantest Corp | 発熱素子冷却装置および発熱素子実装装置 |
JP3780953B2 (ja) * | 2002-01-31 | 2006-05-31 | 株式会社日立製作所 | 冷却装置付き電子回路装置 |
US6775137B2 (en) * | 2002-11-25 | 2004-08-10 | International Business Machines Corporation | Method and apparatus for combined air and liquid cooling of stacked electronics components |
JP4228680B2 (ja) | 2002-12-12 | 2009-02-25 | 三菱電機株式会社 | 冷却部材 |
JP4165232B2 (ja) | 2003-01-15 | 2008-10-15 | 三菱電機株式会社 | 冷却部材 |
US7032651B2 (en) * | 2003-06-23 | 2006-04-25 | Raytheon Company | Heat exchanger |
WO2005004571A1 (ja) * | 2003-06-30 | 2005-01-13 | Advantest Corporation | 発熱素子冷却用カバー、発熱素子実装装置およびテストヘッド |
JP4041437B2 (ja) | 2003-07-22 | 2008-01-30 | 株式会社日本自動車部品総合研究所 | 半導体素子の冷却装置 |
DE102005025381A1 (de) * | 2005-05-31 | 2006-12-07 | Behr Industry Gmbh & Co. Kg | Vorrichtung zur Kühlung von elekronischen Bauelementen |
JP4770490B2 (ja) * | 2006-01-31 | 2011-09-14 | トヨタ自動車株式会社 | パワー半導体素子の冷却構造およびインバータ |
-
2007
- 2007-09-14 DE DE112007003652T patent/DE112007003652T5/de not_active Withdrawn
- 2007-09-14 JP JP2009532020A patent/JP4934199B2/ja not_active Expired - Fee Related
- 2007-09-14 US US12/676,224 patent/US8391006B2/en active Active
- 2007-09-14 KR KR1020107005676A patent/KR20100040979A/ko not_active Application Discontinuation
- 2007-09-14 CN CN2007801004582A patent/CN101785375B/zh active Active
- 2007-09-14 WO PCT/JP2007/067947 patent/WO2009034641A1/ja active Application Filing
-
2008
- 2008-08-19 TW TW097131550A patent/TWI403260B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN101785375A (zh) | 2010-07-21 |
WO2009034641A1 (ja) | 2009-03-19 |
US8391006B2 (en) | 2013-03-05 |
KR20100040979A (ko) | 2010-04-21 |
TWI403260B (zh) | 2013-07-21 |
DE112007003652T5 (de) | 2010-11-04 |
CN101785375B (zh) | 2013-05-08 |
JP4934199B2 (ja) | 2012-05-16 |
TW200917945A (en) | 2009-04-16 |
US20100271779A1 (en) | 2010-10-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4934199B2 (ja) | ウォータジャケット | |
US7285851B1 (en) | Liquid immersion cooled multichip module | |
KR101119349B1 (ko) | 집적 회로 스택 및 집적 회로 스택의 열 관리 | |
KR101641399B1 (ko) | 고성능, 저가의 자동화된 테스트 장비용 핀 일렉트로닉스 액체 냉각식 멀티모듈 | |
WO2005081947A3 (en) | Miniature fluid-cooled heat sink with integral heater | |
KR20090062384A (ko) | 테스트 장치 | |
JP5722710B2 (ja) | 基板組立体及び電子部品試験装置 | |
KR100813125B1 (ko) | 기체 회수 장치, 테스트 헤드 및 ic 디바이스 시험 장치 | |
TW200302042A (en) | Cooling assembly with direct cooling of active electronic components | |
Uhlemann et al. | Directly cooled HybridPACK power modules with ribbon bonded cooling structures | |
US7541824B2 (en) | Forced air cooling of components on a probecard | |
JP2012059741A (ja) | 電子部品の冷却装置 | |
WO2010137138A1 (ja) | 配管継手、及びそれを備えたテストヘッド | |
TW202036012A (zh) | 電子元件測試裝置 | |
KR102659795B1 (ko) | 검사 시스템 및 검사 방법 | |
KR20080097688A (ko) | 반도체 패키지의 검사 장치 및 이를 이용한 반도체패키지의 검사 방법 | |
TWI854852B (zh) | 探針卡及其導熱裝置 | |
US20240107706A1 (en) | Variable flow liquid-cooled cooling module | |
KR100863585B1 (ko) | 발열체의 냉각 장치 | |
Trivedi | Thermo-mechanical solutions in electronic packaging: component to system level | |
JP2009186351A (ja) | Dut基板冷却装置 | |
TW201701384A (zh) | 用於半導體裝置測試之在溫度控制致動器中增進流體流動的技術 | |
Yue et al. | Fluidic interconnects in integrated liquid cooling systems for 3-D stacked TSV modules | |
JP2023143954A (ja) | プローバの冷却システム | |
Campo et al. | Prediction of component temperatures on circuit cards cooled by natural convection |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111101 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111222 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120207 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120217 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150224 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150224 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |