JPS6451169A - Method for coating cream solder - Google Patents

Method for coating cream solder

Info

Publication number
JPS6451169A
JPS6451169A JP62205179A JP20517987A JPS6451169A JP S6451169 A JPS6451169 A JP S6451169A JP 62205179 A JP62205179 A JP 62205179A JP 20517987 A JP20517987 A JP 20517987A JP S6451169 A JPS6451169 A JP S6451169A
Authority
JP
Japan
Prior art keywords
solder
holes
terminal
cream solder
squeezing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62205179A
Other languages
Japanese (ja)
Inventor
Hideaki Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62205179A priority Critical patent/JPS6451169A/en
Publication of JPS6451169A publication Critical patent/JPS6451169A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

PURPOSE:To uniformize the quantity of solder to be applied to a terminal, by filling a plurality of solder reservoir holes provided on a solder coating table with cream solder by squeezing, inserting the end of a terminal into each of the holes and then lifting it. CONSTITUTION:A plurality of solder reservoir holes 6 are provided over the surface of a solder coating table 5. Cream solder 4 is filled into each of the holes 6 by squeezing it. And then, the end 2a of each terminal 2 is inserted into each of the holes 6 and then lifted upward therefrom so that said end 2a is coated with solder 4. Consequently, each terminal can be coated with solder under the same conditions, causing uniform coating, resulting in a desirable soldering of terminals in the succeeding process.
JP62205179A 1987-08-20 1987-08-20 Method for coating cream solder Pending JPS6451169A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62205179A JPS6451169A (en) 1987-08-20 1987-08-20 Method for coating cream solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62205179A JPS6451169A (en) 1987-08-20 1987-08-20 Method for coating cream solder

Publications (1)

Publication Number Publication Date
JPS6451169A true JPS6451169A (en) 1989-02-27

Family

ID=16502727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62205179A Pending JPS6451169A (en) 1987-08-20 1987-08-20 Method for coating cream solder

Country Status (1)

Country Link
JP (1) JPS6451169A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112007003652T5 (en) 2007-09-14 2010-11-04 Advantest Corp. Cooling jacket for cooling an electronic component on a plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112007003652T5 (en) 2007-09-14 2010-11-04 Advantest Corp. Cooling jacket for cooling an electronic component on a plate

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