JPWO2007108437A1 - シリカ粉末及びその用途 - Google Patents
シリカ粉末及びその用途 Download PDFInfo
- Publication number
- JPWO2007108437A1 JPWO2007108437A1 JP2008506292A JP2008506292A JPWO2007108437A1 JP WO2007108437 A1 JPWO2007108437 A1 JP WO2007108437A1 JP 2008506292 A JP2008506292 A JP 2008506292A JP 2008506292 A JP2008506292 A JP 2008506292A JP WO2007108437 A1 JPWO2007108437 A1 JP WO2007108437A1
- Authority
- JP
- Japan
- Prior art keywords
- maximum peak
- particle size
- particles
- silica powder
- maximum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B14/00—Use of inorganic materials as fillers, e.g. pigments, for mortars, concrete or artificial stone; Treatment of inorganic materials specially adapted to enhance their filling properties in mortars, concrete or artificial stone
- C04B14/02—Granular materials, e.g. microballoons
- C04B14/04—Silica-rich materials; Silicates
- C04B14/06—Quartz; Sand
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B20/00—Use of materials as fillers for mortars, concrete or artificial stone according to more than one of groups C04B14/00 - C04B18/00 and characterised by shape or grain distribution; Treatment of materials according to more than one of the groups C04B14/00 - C04B18/00 specially adapted to enhance their filling properties in mortars, concrete or artificial stone; Expanding or defibrillating materials
- C04B20/0076—Use of materials as fillers for mortars, concrete or artificial stone according to more than one of groups C04B14/00 - C04B18/00 and characterised by shape or grain distribution; Treatment of materials according to more than one of the groups C04B14/00 - C04B18/00 specially adapted to enhance their filling properties in mortars, concrete or artificial stone; Expanding or defibrillating materials characterised by the grain distribution
- C04B20/008—Micro- or nanosized fillers, e.g. micronised fillers with particle size smaller than that of the hydraulic binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Structural Engineering (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Civil Engineering (AREA)
- Nanotechnology (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
本発明のシリカ粉末においては、55μm超の粒子の含有率が5体積%以下(0を含む)、1μm未満の含有率が10体積%以下(0を含む)である。残部は4μmを超え15μm未満のシリカ粒子である。30μm以上の粒子の平均球形度を0.85以上、特に0.93以上とすることによって、バリ抑制作用が助長される。
天然珪石の粉砕物をLPGと酸素との燃焼により形成される火炎中に供給し、溶融・球状化処理を行って、球状非晶質シリカ粉末を得た。火炎形成条件、原料粒度、原料供給量、分級条件、混合条件などを適宜調整して、表1、表2に示される13種の粉末を製造した。粒度分布の調整は主として原料粒度の調整と球状化処理後の粉体の多段篩分け操作によって行った。また、球形度の制御は主として火炎形成条件、原料供給量を調整することにより行った。粉体名A〜Eが実施例に係るシリカ粉末であり、粉体名F〜Mが比較例に係るシリカ粉末である。粉体名A〜Mの非晶質率はいずれも99%以上、粉体全体の平均球形度は0.90以上であった。これらのシリカ粉末の粒度特性を上記方法に従い測定した。それらの結果を表1、表2に示す。
EMMI−I−66(Epoxy Molding Material Institute;Society of Plastic Industry)に準拠したスパイラルフロー測定用金型を取り付けたトランスファー成形機を用いて、上記エポキシ樹脂組成物のスパイラルフロー値を測定した。トランスファー成形条件は、金型温度175℃、成形圧力7.4MPa、保圧時間90秒とした。
この値が大きいほど、高流動性であり、成形性が良いことを示す。
32ピンLOC(Lead on Chip)構造TSOP(Thin Small Outline Package;10mm×21mm、厚さ1.0mm、模擬ICチップサイズ9mm×18mm、リードフレーム42アロイ製)の半導体パッケージをトランスファー成形機により48個作製し、平均バリ長さを測定した。トランスファー成形条件は、金型温度175℃、成形圧力7.4MPa、保圧時間90秒とした。
この値が大きいほど、バリ発生が少ないことを示す。
Claims (5)
- レーザー回折・散乱法による体積基準頻度粒度分布において、少なくとも、1〜4μmの粒度域に極大ピーク1の最大頻度値と、15〜55μmの粒度域に極大ピーク2の最大頻度値とを有するシリカ粉末であって、
前記極大ピーク2の最大頻度値が、前記極大ピーク1の最大頻度値よりも大きく、
前記極大ピーク2にショルダーがあり、
15〜55μmの粒度域の粒子の含有率が、1〜4μmの粒度域の粒子の含有率よりも多い、
ことを特徴とするシリカ粉末。 - 15〜55μmの粒度域の粒子の含有率が35〜55体積%、1〜4μmの粒度域の粒子の含有率が10〜30体積%、55μm超の粒子の含有率が5体積%以下(0を含む)、1μm未満の含有率が10体積%以下(0を含む)、残部が4μmを超え、15μm未満の粒子から構成されており、前記極大ピーク1の最大頻度値が、1.5〜3.5μmの間に、前記極大ピーク2の最大頻度値が、25〜40μmの間に存在し、しかも前記極大ピーク2の4〜20μmの粒径範囲にショルダーが存在している請求項1に記載のシリカ粉末。
- 30μm以上の粒子の平均球形度が、0.85以上である請求項1又は2に記載のシリカ粉末。
- 請求項1〜3のいずれかに記載のシリカ粉末をゴム及び樹脂の少なくとも一方に含有させてなることを特徴とする組成物。
- 請求項4に記載の組成物からなることを特徴とする半導体封止材料。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008506292A JP5351513B2 (ja) | 2006-03-17 | 2007-03-19 | シリカ粉末及びその用途 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006073626 | 2006-03-17 | ||
JP2006073626 | 2006-03-17 | ||
JP2008506292A JP5351513B2 (ja) | 2006-03-17 | 2007-03-19 | シリカ粉末及びその用途 |
PCT/JP2007/055503 WO2007108437A1 (ja) | 2006-03-17 | 2007-03-19 | シリカ粉末及びその用途 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2007108437A1 true JPWO2007108437A1 (ja) | 2009-08-06 |
JP5351513B2 JP5351513B2 (ja) | 2013-11-27 |
Family
ID=38522466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008506292A Expired - Fee Related JP5351513B2 (ja) | 2006-03-17 | 2007-03-19 | シリカ粉末及びその用途 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7820750B2 (ja) |
EP (1) | EP1997777B1 (ja) |
JP (1) | JP5351513B2 (ja) |
KR (1) | KR101027857B1 (ja) |
CN (1) | CN101405219B (ja) |
MY (1) | MY144171A (ja) |
WO (1) | WO2007108437A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2025644B1 (en) * | 2006-05-12 | 2013-10-23 | Denki Kagaku Kogyo Kabushiki Kaisha | Ceramic powder and method of using the same |
JP2008115381A (ja) * | 2006-10-13 | 2008-05-22 | Hitachi Chem Co Ltd | エポキシ樹脂組成物およびそれを用いた電子部品装置 |
JP5356669B2 (ja) * | 2007-10-25 | 2013-12-04 | パナソニック株式会社 | フェノール樹脂成形材料とそれを用いた成形品 |
US20120288716A1 (en) * | 2010-01-07 | 2012-11-15 | Mitsubishi Materials Corporation | Synthetic amorphous silica powder |
JP2012012563A (ja) * | 2010-06-02 | 2012-01-19 | Nitto Denko Corp | 熱硬化性シリコーン樹脂用組成物 |
US20130154058A1 (en) * | 2011-12-16 | 2013-06-20 | International Business Machines Corporation | High surface area filler for use in conformal coating compositions |
US8879275B2 (en) | 2012-02-21 | 2014-11-04 | International Business Machines Corporation | Anti-corrosion conformal coating comprising modified porous silica fillers for metal conductors electrically connecting an electronic component |
CN103360793A (zh) * | 2012-03-27 | 2013-10-23 | 重庆市锦艺硅材料开发有限公司苏州分公司 | 低介电常数的填料及其制备工艺 |
DE102012210294A1 (de) * | 2012-06-19 | 2013-12-19 | Evonik Industries Ag | Bewuchsmindernde-Additive, Verfahren zu deren Herstellung und deren Verwendung in Beschichtungen |
JP5617903B2 (ja) * | 2012-11-20 | 2014-11-05 | 日立金属株式会社 | 車両用電線、車両用ケーブル |
JP6493727B2 (ja) | 2014-09-19 | 2019-04-03 | パウダーテック株式会社 | 球状フェライト粉、該球状フェライト粉を含有する樹脂組成物、及び該樹脂組成物を用いた成型体 |
DE102015223415A1 (de) * | 2015-11-26 | 2017-06-01 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektrischen Vorrichtung mit einer Umhüllmasse |
WO2023153357A1 (ja) * | 2022-02-09 | 2023-08-17 | デンカ株式会社 | 球状シリカ粉末 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05239321A (ja) | 1992-02-28 | 1993-09-17 | Toshiba Chem Corp | エポキシ樹脂組成物および半導体封止装置 |
JP3294803B2 (ja) | 1997-08-18 | 2002-06-24 | 株式会社日本触媒 | 熱硬化性樹脂封止材 |
JP2001151866A (ja) | 1999-11-30 | 2001-06-05 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP3868272B2 (ja) | 2001-11-15 | 2007-01-17 | 電気化学工業株式会社 | 球状無機質粉末およびこれを充填した樹脂組成物 |
JP3868347B2 (ja) * | 2002-07-25 | 2007-01-17 | 電気化学工業株式会社 | 無機質粉末およびこれを充填した樹脂組成物 |
JP4017953B2 (ja) | 2002-09-30 | 2007-12-05 | 住友ベークライト株式会社 | エポキシ樹脂組成物及びそれを用いた半導体装置、精密部品 |
JP4112470B2 (ja) * | 2003-10-20 | 2008-07-02 | 電気化学工業株式会社 | 球状無機質粉末および液状封止材 |
DE602004010717T2 (de) * | 2003-12-22 | 2008-04-30 | Denki Kagaku Kogyo K.K. | Härtbare harzzusammensetzung |
JP2005306923A (ja) | 2004-04-19 | 2005-11-04 | Denki Kagaku Kogyo Kk | 無機質粉末及びこれを含有した組成物 |
-
2007
- 2007-03-19 WO PCT/JP2007/055503 patent/WO2007108437A1/ja active Application Filing
- 2007-03-19 EP EP20070738948 patent/EP1997777B1/en not_active Expired - Fee Related
- 2007-03-19 KR KR20087022606A patent/KR101027857B1/ko active IP Right Grant
- 2007-03-19 CN CN2007800094806A patent/CN101405219B/zh not_active Expired - Fee Related
- 2007-03-19 JP JP2008506292A patent/JP5351513B2/ja not_active Expired - Fee Related
- 2007-03-19 MY MYPI20083562 patent/MY144171A/en unknown
- 2007-03-19 US US12/091,998 patent/US7820750B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101405219A (zh) | 2009-04-08 |
KR20080093162A (ko) | 2008-10-20 |
CN101405219B (zh) | 2012-09-05 |
JP5351513B2 (ja) | 2013-11-27 |
EP1997777A1 (en) | 2008-12-03 |
EP1997777A4 (en) | 2010-08-11 |
US20080255293A1 (en) | 2008-10-16 |
MY144171A (en) | 2011-08-15 |
US7820750B2 (en) | 2010-10-26 |
KR101027857B1 (ko) | 2011-04-07 |
EP1997777B1 (en) | 2011-10-19 |
WO2007108437A1 (ja) | 2007-09-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5351513B2 (ja) | シリカ粉末及びその用途 | |
JP5380290B2 (ja) | シリカ粉末の製造方法 | |
JP5294015B2 (ja) | セラミックス粉末及びその用途 | |
JP5354724B2 (ja) | セラミックス粉末及びその用途 | |
JP4155729B2 (ja) | 球状無機質粉末およびその用途 | |
JP3868347B2 (ja) | 無機質粉末およびこれを充填した樹脂組成物 | |
JP2005306923A (ja) | 無機質粉末及びこれを含有した組成物 | |
JP5526027B2 (ja) | 非晶質シリカ質粉末、その製造方法、樹脂組成物、及び半導体封止材 | |
JP2005139295A (ja) | 金属酸化物粉末、その製造方法、用途 | |
JP2010285307A (ja) | 非晶質シリカ質粉末およびその製造方法、用途 | |
JP3868272B2 (ja) | 球状無機質粉末およびこれを充填した樹脂組成物 | |
JP2001158614A (ja) | 球状無機質粉末及びその用途 | |
JP4155719B2 (ja) | 球状無機質粉末及びその用途 | |
JP2019182715A (ja) | 非晶質シリカ粉末、樹脂組成物、及び半導体封止材 | |
JP3434029B2 (ja) | エポキシ樹脂組成物 | |
JP3571009B2 (ja) | 球状無機質粉末およびこれを充填した樹脂組成物 | |
JP5345787B2 (ja) | 半導体封止材用シリカ・アルミナ複合酸化物超微粉末の製造方法 | |
JP2010195659A (ja) | シリカ質粉末およびその製造方法、用途 | |
WO2022071131A1 (ja) | 球状アルミナ粉末、樹脂組成物、半導体封止材料 | |
TWI411594B (zh) | 陶瓷粉末及其用途 | |
WO2022202584A1 (ja) | 無機酸化物粉末、樹脂組成物及び圧縮成形品 | |
WO2022202583A1 (ja) | 無機酸化物粉末、樹脂組成物及び圧縮成形品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100223 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121225 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130225 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130805 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130823 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5351513 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |