JPWO2006137199A1 - スパッタリングターゲット及び光情報記録媒体用薄膜 - Google Patents
スパッタリングターゲット及び光情報記録媒体用薄膜 Download PDFInfo
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- JPWO2006137199A1 JPWO2006137199A1 JP2007522199A JP2007522199A JPWO2006137199A1 JP WO2006137199 A1 JPWO2006137199 A1 JP WO2006137199A1 JP 2007522199 A JP2007522199 A JP 2007522199A JP 2007522199 A JP2007522199 A JP 2007522199A JP WO2006137199 A1 JPWO2006137199 A1 JP WO2006137199A1
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- sputtering
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- oxide
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- 230000003287 optical effect Effects 0.000 title claims abstract description 35
- 238000005477 sputtering target Methods 0.000 title claims abstract description 24
- 239000010409 thin film Substances 0.000 title claims abstract description 14
- 229910052984 zinc sulfide Inorganic materials 0.000 claims abstract description 45
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000011787 zinc oxide Substances 0.000 claims abstract description 19
- 239000005083 Zinc sulfide Substances 0.000 claims abstract description 10
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910003437 indium oxide Inorganic materials 0.000 claims abstract description 9
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000005259 measurement Methods 0.000 claims abstract description 6
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 5
- 239000011593 sulfur Substances 0.000 claims abstract description 5
- 239000013078 crystal Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 13
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 4
- 238000013001 point bending Methods 0.000 claims description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052746 lanthanum Inorganic materials 0.000 claims description 3
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 3
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 3
- 239000010408 film Substances 0.000 abstract description 37
- 238000004544 sputter deposition Methods 0.000 abstract description 36
- 230000001681 protective effect Effects 0.000 abstract description 11
- 238000005336 cracking Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000843 powder Substances 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 18
- 239000010410 layer Substances 0.000 description 14
- 229910004298 SiO 2 Inorganic materials 0.000 description 12
- 230000008859 change Effects 0.000 description 11
- 239000011241 protective layer Substances 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 238000005245 sintering Methods 0.000 description 8
- 238000002156 mixing Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000011701 zinc Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 238000007088 Archimedes method Methods 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009775 high-speed stirring Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- -1 zinc chalcogenide Chemical class 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- JAWMENYCRQKKJY-UHFFFAOYSA-N [3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-ylmethyl)-1-oxa-2,8-diazaspiro[4.5]dec-2-en-8-yl]-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]methanone Chemical compound N1N=NC=2CN(CCC=21)CC1=NOC2(C1)CCN(CC2)C(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F JAWMENYCRQKKJY-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000004770 chalcogenides Chemical class 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- TXKMVPPZCYKFAC-UHFFFAOYSA-N disulfur monoxide Inorganic materials O=S=S TXKMVPPZCYKFAC-UHFFFAOYSA-N 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052950 sphalerite Inorganic materials 0.000 description 1
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical compound S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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Abstract
Description
相変化型光ディスクは、基板上の記録薄膜をレーザー光の照射によって加熱昇温させ、その記録薄膜の構造に結晶学的な相変化(アモルファス⇔結晶)を起こさせて情報の記録・再生を行うものであり、より具体的にはその相間の光学定数の変化に起因する反射率の変化を検出して情報の再生を行うものである。
また、上記結晶学的な相変化すなわちアモルファスと結晶との相変化を実現する上で、記録層だけでなく周辺の誘電体保護層やアルミニウム合金の反射膜にも加熱と急冷が繰返されることになる。
このなかで反射層と保護層は、記録層のアモルファス部と結晶部との反射率の差を増大させる光学的機能が要求されるほか、記録薄膜の耐湿性や熱による変形の防止機能、さらには記録の際の熱的条件制御という機能が要求される(雑誌「光学」26巻1号頁9〜15参照)。
このように、高融点誘電体の保護層は昇温と冷却による熱の繰返しストレスに対して耐性をもち、さらにこれらの熱影響が反射膜や他の箇所に影響を及ぼさないようにし、かつそれ自体も薄く、低反射率でかつ変質しない強靭さが必要である。この意味において誘電体保護層は重要な役割を有する。
しかし、これらの材料は、ターゲットのバルク抵抗値が高いため、直流スパッタリング装置により成膜することができず、通常高周波スパッタリング(RF)装置が使用されている。ところが、この高周波スパッタリング(RF)装置は、装置自体が高価であるばかりでなく、スパッタリング効率が悪く、電力消費量が大きく、制御が複雑であり、成膜速度も遅いという多くの欠点がある。
また、成膜速度を上げるため、高電力を加えた場合、基板温度が上昇し、ポリカーボネート製基板の変形を生ずるという問題がある。また、ZnS-SiO2は膜厚が厚いためスループット低下やコスト増も問題となっていた。
それは、光情報記録媒体の書き換え回数等が劣化する原因の一つとして、ZnS-SiO2に挟まれるように配置された記録層材が加熱、冷却を繰返すうちに、記録層と保護層の間に隙間が生ずる。そのため反射率等への特性劣化を引き起こす要因となっていた。
上記の問題を解決するために、保護層材ZnS-SiO2よりも、さらに安定した非晶質性を確保することで記録層との密着性を向上さることが考えられた。
ZnOベースのホモロガス化合物(非特許文献1参照)は複雑な層状構造をとるため、成膜時の非晶質性を安定に保つという特徴があり、また使用波長領域において透明であり、屈折率もZnS-SiO2に近いという特性を持つ。
このZnOベースのホモロガス化合物をZnSへ添加することで、非晶質性を向上させ、さらに絶縁材のSiO2を除外することで、スパッタリング特性が安定化し、光情報記録媒体の特性改善及び生産性向上が期待された。
しかし、上記の透明導電膜を形成する材料は、必ずしも光情報記録媒体用薄膜(特に保護膜としての使用)には十分とは言えなかった。
一方、ZnOをベースとするホモロガス化合物を添加したZnSとの複合ターゲットは、ターゲット製造時あるいはスパッタリングにおいて高電力でスパッタした時に割れ易いという問題があった。
1)硫化亜鉛と酸化インジウム、酸化亜鉛及び他の3価の陽性元素Aで構成される酸化物を主要成分とし、構成成分全量に対する硫黄の比率が5〜30wt%であり、XRD測定による立方晶系ZnSの(111)ピーク強度I1と六方晶系ZnSの(100)ピーク強度I2が混在すると共にI1>I2を満たすことを特徴とするスパッタリングターゲット。
2)立方晶ZnSの(111)ピークの半価幅の平均値が0.25以下、半価幅の標準偏差が、0.06以下であることを特徴とする上記1)記載のスパッタリングターゲット。
3)3価の陽性元素Aがアルミニウム、ガリウム、イットリウム、ランタンから選択した1成分以上の材料であることを特徴とする上記1)又は2)記載のスパッタリングターゲット。
4)硫化物相の平均結晶粒径が酸化物相の平均結晶粒径よりも大きく、且つ10μm以下であることを特徴とする上記1)〜3)のいずれかに記載のスパッタリングターゲット。
5)相対密度が85%以上、3点曲げ強度(JIS R 1601)による強度平均値が50MPa以上、ワイブル係数が5以上であることを特徴とする上記1)〜4)のいずれかに記載のスパッタリングターゲット。
6)上記1)〜5)に記載するスパッタリングターゲットを使用して形成された光情報記録媒体用薄膜。
を提供する。
また、組成比を調整することによりDCスパッタが可能となり、成膜速度を上げ、スパッタリング効率を向上させることができるという著しい効果がある。さらにこれによって、成膜の際にスパッタ時に発生するパーティクル(発塵)やノジュールを低減し、品質のばらつきが少なく量産性を向上させることができ、光ディスク保護膜をもつ光記録媒体を低コストで安定して製造できるという著しい効果がある。
さらに、ターゲット内における硫化物相の平均結晶粒径が10μm以下であり、硫化亜鉛と酸化インジウム、酸化亜鉛及び他の3価の陽性元素Aで構成される酸化物を主要成分とし、これらが均一に分散している組織を備えていることによって、スパッタが安定し、均一な成膜が可能となり、また特性に優れた光情報記録媒体用薄膜(保護膜)を形成することができるという効果がある。
硫化亜鉛と酸化インジウム、酸化亜鉛及び他の3価の陽性元素Aで構成される酸化物を主要成分とする理由は、非晶質安定性を確保するためであり、また構成成分全量に対する硫黄の比率が5〜30wt%とする理由は、同様に非晶質安定性を確保し、かつ良好な光学特性と成膜速度を得るためである。
本発明の成分系では、通常の単相のZnSやZnS-SiO2では起こらない低い温度(約700〜900°C)でZnSの相転移が生じる。そのため従来のZnS-SiO2では相転移しない1000°C付近で焼結して急冷すると高温相の六方晶系がターゲット内で不均一に分布する。この不均一な分布がターゲット内に残留すると歪として蓄積され、割れ易くなることが判明した。そして、低温相と高温相が混在する場合、低温相のXRD回折における半価幅の平均値が0.25以下で、かつ該半価幅がターゲット内で均一であることが望ましいことが判った。
3価の陽性元素Aについては、特にアルミニウム、ガリウム、イットリウム、ランタンから選択した1成分以上の材料であることが望ましい。
さらに、本発明のスパッタリングターゲットは、硫化物相の平均結晶粒径が酸化物相の平均結晶粒径よりも大きく、且つ10μm以下、相対密度が85%以上であることが望ましい。これも、割れを防止するのにより効果がある。しかし、これらは必須の要件ではなく、好ましい条件である。したがって、上記数値範囲外でも適用できることを知るべきである。
本願発明のスパッタリングターゲットは各構成元素の酸化物粉末及びカルコゲン化物粉末を常圧焼結又は高温加圧焼結することによって高密度のスパッタリング用ターゲットを製造することができる。焼結に際しては、1050°C以下で焼結することが望ましい。これによって、ZnSの結晶相を所望の値に調整でき、割れ防止が可能となる。さらに冷却に際しては、500°C〜850°Cに保持するか、又は徐冷することが望ましい。
これにより、ZnS(111)の半価幅を所望の値に、より効果的に調整できる。これらの調整は、従来のZnS‐SiO2とは大きく異なる。
本発明のスパッタリングターゲットを使用することにより、生産性が向上し、品質の優れた材料を得ることができ、光ディスク保護膜をもつ光記録媒体を低コストで安定して製造できるという著しい効果がある。
本発明のスパッタリングターゲットの密度向上は、空孔を減少させ結晶粒を微細化し、ターゲットのスパッタ面を均一かつ平滑にすることができるので、スパッタリング時のパーティクルやノジュールを低減させ、さらにターゲットライフも長くすることができるという著しい効果を有し、品質のばらつきが少なく量産性を向上させることができる。
4N相当で5μm以下のIn2O3粉と4N相当で1μm以下のGa2O3 Al2O3粉、Y2O3粉、La2O3粉、4N相当で平均粒径5μm以下のZnO粉を用意し、表1に示すモル比率で調合して、湿式混合し、乾燥後、1100°Cで仮焼した。
次に、この複合酸化物粉と4N相当で平均粒径5μm以下のZnS粉を、表1に示すモル比率となるように混合した。混合は、湿式ボールミル混合又は乾式高速攪拌混合機を用いて各粉を均一に分散させた。次に、この混合粉をカーボン製の型に充填し、温度900°Cでホットプレスを行いターゲットとした。その際、700〜800°Cで2h以上保持した後、徐冷を行った。
さらに、ターゲット内より任意に3ケ所からサンプリングして密度(アルキメデス法)を測定した結果、相対密度は85〜97%であり、3点曲げ強度(JIS R 1601)による強度平均値は、55〜80MPaの範囲の範囲にあり、ワイブル係数は6〜12の範囲にあった。
さらに、6インチφサイズに加工したターゲットを使用して、スパッタリングを行った。スパッタ条件は、DCスパッタ、スパッタパワー1000W、Arガス圧0.5Paとし、目標膜厚1500Åで成膜した。表1に示す通り、この成膜サンプルの屈折率は2〜2.2(波長633nm)であり、良好な屈折率を示した。また、非晶質安定性は、1.1〜1.5の範囲であり、これも良好な値を示した。
4N相当で5μm以下のIn2O3粉と4N相当で1μm以下のGa2O3 Al2O3粉、Y2O3粉、(比較例4については無添加)、4N相当で平均粒径5μm以下のZnO粉を用意し、表2に示すモル比率で調合して、湿式混合し、乾燥後、1100°Cで仮焼した。
次に、この複合酸化物粉と4N相当で平均粒径5μm以下のZnS粉を、表2に示すモル比率となるように混合した。混合は、湿式ボールミル混合又は乾式高速攪拌混合機を用いて各粉を均一に分散させた。次に、この混合粉をカーボン製の型に充填し、温度900〜1100°Cでホットプレスを行いターゲットとした。そして、実施例に示すような、700〜800°Cで2h以上保持するという工程を経ずして、冷却を行った。
さらに、ターゲット内より任意に3ケ所からサンプリングして密度(アルキメデス法)を測定した結果、比較例5の相対密度は75%であり、密度の著しい低下があった。3点曲げ強度(JIS R 1601)による強度平均値については、比較例2と比較例4が、それぞれ42MPa、30MPaの範囲の範囲にあり、強度が低かった。ワイブル係数については、比較例2と比較例5が、それぞれ4であり低かった。
さらに、6インチφサイズに加工したターゲットを使用して、スパッタリングを行った。スパッタ条件は、DCスパッタ、スパッタパワー1000W、Arガス圧0.5Paとし、目標膜厚1500Åで成膜した。表2に示す通り、比較例1は製造中にターゲットの割れが発生したので、評価不能であった。残余の成膜サンプルについては、屈折率は2.2〜2.3(波長633nm)であり、良好な屈折率を示した。また、非晶質安定性は、比較例2が3.2、比較例4が4.5と劣化し、一部に結晶化が見られ、膜の平坦性が損なわれた。
また、組成比を調整することによりDCスパッタが可能となり、スパッタの制御性を容易にし、成膜速度を上げ、スパッタリング効率を向上させることができるという著しい効果がある。さらにこれによって、成膜の際にスパッタ時に発生するパーティクル(発塵)やノジュールを低減し、品質のばらつきが少なく量産性を向上させることができ、光ディスク保護膜をもつ光記録媒体を低コストで安定して製造できるという著しい効果がある。
さらに、ターゲット内における硫化物相の平均結晶粒径が10μm以下であり、硫化亜鉛と酸化インジウム、酸化亜鉛及び他の3価の陽性元素Aで構成される酸化物を主要成分とし、これらが均一に分散している組織を備えていることによって、スパッタが安定し、均一な成膜が可能であり、特性に優れた光情報記録媒体用薄膜(保護膜)を形成するスパッタリングターゲットとして有用である。
Claims (6)
- 硫化亜鉛と酸化インジウム、酸化亜鉛及び他の3価の陽性元素Aで構成される酸化物を主要成分とし、構成成分全量に対する硫黄の比率が5〜30wt%であり、XRD測定による立方晶系ZnSの(111)ピーク強度I1と六方晶系ZnSの(100)ピーク強度I2が混在すると共に、I1>I2を満たすことを特徴とするスパッタリングターゲット。
- 立方晶ZnSの(111)ピークの半価幅の平均値が0.25以下、半価幅の標準偏差が0.06以下であることを特徴とする請求の範囲1記載のスパッタリングターゲット。
- 3価の陽性元素Aがアルミニウム、ガリウム、イットリウム、ランタンから選択した1成分以上の材料であることを特徴とする請求の範囲1又は2記載のスパッタリングターゲット。
- 硫化物相の平均結晶粒径が酸化物相の平均結晶粒径よりも大きく、且つ10μm以下であることを特徴とする請求の範囲1〜3のいずれかに記載のスパッタリングターゲット。
- 相対密度が85%以上、3点曲げ強度(JIS R 1601)による強度平均値が50MPa以上、ワイブル係数が5以上であることを特徴とする請求の範囲1〜4のいずれかに記載のスパッタリングターゲット。
- 請求の範囲1〜5に記載するスパッタリングターゲットを使用して形成された光情報記録媒体用薄膜。
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