JPWO2006087775A1 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JPWO2006087775A1 JPWO2006087775A1 JP2007503515A JP2007503515A JPWO2006087775A1 JP WO2006087775 A1 JPWO2006087775 A1 JP WO2006087775A1 JP 2007503515 A JP2007503515 A JP 2007503515A JP 2007503515 A JP2007503515 A JP 2007503515A JP WO2006087775 A1 JPWO2006087775 A1 JP WO2006087775A1
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- semiconductor device
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- 239000004065 semiconductor Substances 0.000 title claims description 77
- 239000012535 impurity Substances 0.000 claims abstract description 65
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 210000000746 body region Anatomy 0.000 abstract description 58
- 238000009792 diffusion process Methods 0.000 abstract description 52
- 239000010410 layer Substances 0.000 description 88
- 238000004519 manufacturing process Methods 0.000 description 18
- 230000004888 barrier function Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- 229920005591 polysilicon Polymers 0.000 description 7
- 239000011229 interlayer Substances 0.000 description 6
- 230000003071 parasitic effect Effects 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910018594 Si-Cu Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910008465 Si—Cu Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000005380 borophosphosilicate glass Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000005036 potential barrier Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/66734—Vertical DMOS transistors, i.e. VDMOS transistors with a step of recessing the gate electrode, e.g. to form a trench gate electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7803—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
- H01L29/7804—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a pn-junction diode
- H01L29/7805—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a pn-junction diode in antiparallel, e.g. freewheel diode
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
(1)P型ボディ領域103の表面濃度Ns(p−body)>P−型拡散領域109の表面濃度Ns(Di)
(2)深さxj(p−body)>深さxj(Di)
(3)P型ボディ領域103の不純物総量Qp−body>P−型拡散領域109の不純物総量Qp−
(4)メサ幅M(p−body)>メサ幅M(Di)
Claims (9)
- 対向する第1および第2の主面を有し、第1導電型の半導体からなる第1の半導体層と、
前記第1の主面に露出する、前記第1の半導体層よりも不純物濃度の低い第1導電型の半導体からなる第2の半導体層と、
前記第2の半導体層の表面に形成された複数の溝と、
前記溝に形成されたゲート絶縁膜と、
前記ゲート絶縁膜に囲まれたゲート電極と、
前記第2の半導体層の表面において、2つの前記溝の間に形成された第2導電型の第1の領域と、
前記第1の領域の表面において、前記第2の半導体層よりも不純物濃度の高い第1導電型の第2の領域と、
前記第2の半導体層の表面において、前記第1の領域と接する前記溝と他の前記溝との間に形成された第2導電型の第3の領域と、
前記第2の領域および前記第3の領域の表面に接する第1の電極と、
前記第2の主面に接する第2の電極と、
を備え、
前記第1の領域において、第2導電型として寄与する不純物の総量は、前記第3の領域において、第2導電型として寄与する不純物の総量よりも大きい
ことを特徴とする半導体装置。 - 前記第1の領域の表面において、第2導電型として寄与する不純物の濃度は、前記第3の領域の表面において、第2導電型として寄与する不純物の濃度よりも高いことを特徴とする請求項1に記載の半導体装置。
- 前記第1の領域と前記第2の半導体層との境界面から前記第1の領域の表面までの距離は、前記第3の領域と前記第2の半導体層との境界面から前記第3の領域の表面までの距離よりも長いことを特徴とする請求項1に記載の半導体装置。
- 前記第1の領域を挟む2つの前記溝のうち、一方の前記溝と前記第1の領域との接触面から他方の前記溝と前記第1の領域との接触面までの距離は、前記第3の領域を挟む2つの前記溝のうち、一方の前記溝と前記第3の領域との接触面から他方の前記溝と前記第3の領域との接触面までの距離よりも長いことを特徴とする請求項1に記載の半導体装置。
- 前記第2の半導体層の表面において、前記第3の領域よりも不純物濃度の高い第2導電型の第4の領域と前記第3の領域とが、前記溝に沿って交互に複数形成されており、前記第4の領域と前記第2の半導体層との境界面から前記第4の領域の表面までの距離は、前記第3の領域と前記第2の半導体層との境界面から前記第3の領域の表面までの距離よりも長いことを特徴とする請求項1に記載の半導体装置。
- 前記第1の電極は前記第3の領域とオーミック接合を形成していることを特徴とする請求項1に記載の半導体装置。
- 前記第1の電極は三価の金属を含むことを特徴とする請求項1に記載の半導体装置。
- 前記第1の電極はAlを含むことを特徴とする請求項1に記載の半導体装置。
- 前記ゲート絶縁膜は、前記溝の底面上に形成された部分の厚さが、前記溝の側壁面上に形成された部分の厚さよりも大きいことを特徴とする請求項1に記載の半導体装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2005/002312 WO2006087775A1 (ja) | 2005-02-16 | 2005-02-16 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2006087775A1 true JPWO2006087775A1 (ja) | 2008-07-03 |
JP4896001B2 JP4896001B2 (ja) | 2012-03-14 |
Family
ID=36916191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007503515A Expired - Fee Related JP4896001B2 (ja) | 2005-02-16 | 2005-02-16 | 半導体装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7573096B2 (ja) |
JP (1) | JP4896001B2 (ja) |
WO (1) | WO2006087775A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112006001516T5 (de) * | 2005-06-10 | 2008-04-17 | Fairchild Semiconductor Corp. | Feldeffekttransistor mit Ladungsgleichgewicht |
TW200921912A (en) * | 2007-11-05 | 2009-05-16 | Anpec Electronics Corp | Power transistor capable of decreasing capacitance between gate and drain |
WO2012144147A1 (ja) * | 2011-04-20 | 2012-10-26 | パナソニック株式会社 | 縦型ゲート半導体装置およびその製造方法 |
JP5686033B2 (ja) * | 2011-04-27 | 2015-03-18 | トヨタ自動車株式会社 | 半導体装置の製造方法 |
JP2016058679A (ja) * | 2014-09-12 | 2016-04-21 | 株式会社東芝 | 半導体装置およびその製造方法 |
JP6309656B2 (ja) * | 2015-02-12 | 2018-04-11 | 株式会社日立製作所 | 半導体装置及びその製造方法、電力変換装置、3相モータシステム、自動車並びに鉄道車両 |
JP7075876B2 (ja) | 2018-12-25 | 2022-05-26 | 株式会社日立製作所 | 炭化ケイ素半導体装置、電力変換装置、3相モータシステム、自動車および鉄道車両 |
US20220320295A1 (en) * | 2020-06-18 | 2022-10-06 | Dynex Semiconductor Limited | Sic mosfet structures with asymmetric trench oxide |
CN113809181B (zh) * | 2021-11-19 | 2022-02-22 | 陕西亚成微电子股份有限公司 | 具有温度检测功能的mosfet结构及制造方法 |
CN113809180B (zh) * | 2021-11-19 | 2022-02-22 | 陕西亚成微电子股份有限公司 | 具有温度检测功能的mosfet结构及制造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2647884B2 (ja) * | 1988-01-27 | 1997-08-27 | 株式会社日立製作所 | 半導体装置の製造方法 |
JP2987328B2 (ja) | 1995-06-02 | 1999-12-06 | シリコニックス・インコーポレイテッド | 双方向電流阻止機能を備えたトレンチ型パワーmosfet |
US6049108A (en) * | 1995-06-02 | 2000-04-11 | Siliconix Incorporated | Trench-gated MOSFET with bidirectional voltage clamping |
JPH11307785A (ja) | 1998-04-21 | 1999-11-05 | Toshiba Corp | 電力用半導体装置 |
US6351018B1 (en) * | 1999-02-26 | 2002-02-26 | Fairchild Semiconductor Corporation | Monolithically integrated trench MOSFET and Schottky diode |
US6198127B1 (en) * | 1999-05-19 | 2001-03-06 | Intersil Corporation | MOS-gated power device having extended trench and doping zone and process for forming same |
JP2001274399A (ja) | 2000-03-23 | 2001-10-05 | Toyota Motor Corp | 半導体装置とその製造方法 |
US7465986B2 (en) * | 2004-08-27 | 2008-12-16 | International Rectifier Corporation | Power semiconductor device including insulated source electrodes inside trenches |
-
2005
- 2005-02-16 WO PCT/JP2005/002312 patent/WO2006087775A1/ja not_active Application Discontinuation
- 2005-02-16 US US11/883,939 patent/US7573096B2/en not_active Expired - Fee Related
- 2005-02-16 JP JP2007503515A patent/JP4896001B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2006087775A1 (ja) | 2006-08-24 |
US7573096B2 (en) | 2009-08-11 |
US20080135925A1 (en) | 2008-06-12 |
JP4896001B2 (ja) | 2012-03-14 |
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