JPS6489444A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS6489444A
JPS6489444A JP24415487A JP24415487A JPS6489444A JP S6489444 A JPS6489444 A JP S6489444A JP 24415487 A JP24415487 A JP 24415487A JP 24415487 A JP24415487 A JP 24415487A JP S6489444 A JPS6489444 A JP S6489444A
Authority
JP
Japan
Prior art keywords
film
oxidation
region
polysilicon
grown
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24415487A
Other languages
Japanese (ja)
Inventor
Ichiro Moriyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JFE Steel Corp
Original Assignee
Kawasaki Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Steel Corp filed Critical Kawasaki Steel Corp
Priority to JP24415487A priority Critical patent/JPS6489444A/en
Publication of JPS6489444A publication Critical patent/JPS6489444A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To simplify the manufacturing process and to improve the yield rate, by performing thermal oxidation of a semiconductor film, which is grown on the surface of a semiconductor substrate and in which specifed impurities are added, and forming a thick oxide film constituting an element isolating region and a channel stopper region at the same time. CONSTITUTION:A polysilicon film 15, which includes phosphorus, i.e., p-type impurities, is grown on the surface of a silicon substrate 11, which is exposed through a hole 14. Then thermal oxidation is performed and the polysilicon film 15 is oxidized. A thick SiO2 film 16 is formed. The oxidizing speed of the SiO2 film 16 is very fast. The oxidation can be performed in a short time without increasing the oxidation temperature. After an element isolating region is formed, an Si3N4 film 13 is removed. A gate electrode 18 comprising polysilicon, into which phosphorus is diffused, is formed. With the gate electrode and the thick SiO2 film 16 as masks, a source region 19 and a drain region 20 are formed. Therefore, the oxidation can be carried out in a short time at a low temperature. The manufacturing process becomes simple, and the yield rate of the products can be improved.
JP24415487A 1987-09-30 1987-09-30 Manufacture of semiconductor device Pending JPS6489444A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24415487A JPS6489444A (en) 1987-09-30 1987-09-30 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24415487A JPS6489444A (en) 1987-09-30 1987-09-30 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6489444A true JPS6489444A (en) 1989-04-03

Family

ID=17114564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24415487A Pending JPS6489444A (en) 1987-09-30 1987-09-30 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6489444A (en)

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