JPS6482591A - Manufacture of semiconductor laser device - Google Patents

Manufacture of semiconductor laser device

Info

Publication number
JPS6482591A
JPS6482591A JP24181087A JP24181087A JPS6482591A JP S6482591 A JPS6482591 A JP S6482591A JP 24181087 A JP24181087 A JP 24181087A JP 24181087 A JP24181087 A JP 24181087A JP S6482591 A JPS6482591 A JP S6482591A
Authority
JP
Japan
Prior art keywords
layer
grown
melt
clad layer
clad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24181087A
Other languages
Japanese (ja)
Inventor
Shigeki Horiuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP24181087A priority Critical patent/JPS6482591A/en
Publication of JPS6482591A publication Critical patent/JPS6482591A/en
Pending legal-status Critical Current

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Landscapes

  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To eliminate the denatured surface of a second clad layer, with excellent controllability, and, at the same time, grow a guide layer and a contact layer, by a method wherein, after a very thin melt-back layer is grown on a second clad layer composed of A GaAs by MO-CVD method, growth is progressed while melt back is continued. CONSTITUTION:By using MO-CVD method, a first clad layer 2, an active layer 3, a second clad layer 4 and a current block layer 5 are grown in order, on a substrate 1. By using a stripe type etching mask 8, the current blocking layer 5 only is subjected to selective etching and a stripe type trench 5a is formed. After the etching mask 8 is eliminated, a melt back layer 9 composed of an extremely thin GaAs is grown on the whole surface by MO-CVD method. While the melt back layer 9 and a surface corresponding to the bottom of the stripe type trench 5a are subjected to melt-back by LPE method, a guide layer 6 and a contact layer 7 for ohmic contact are grown in order, and denatured parts of the second clad layer 4 are eliminated.
JP24181087A 1987-09-24 1987-09-24 Manufacture of semiconductor laser device Pending JPS6482591A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24181087A JPS6482591A (en) 1987-09-24 1987-09-24 Manufacture of semiconductor laser device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24181087A JPS6482591A (en) 1987-09-24 1987-09-24 Manufacture of semiconductor laser device

Publications (1)

Publication Number Publication Date
JPS6482591A true JPS6482591A (en) 1989-03-28

Family

ID=17079838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24181087A Pending JPS6482591A (en) 1987-09-24 1987-09-24 Manufacture of semiconductor laser device

Country Status (1)

Country Link
JP (1) JPS6482591A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11870132B2 (en) 2018-03-29 2024-01-09 Intel Corporation Antenna modules and communication devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11870132B2 (en) 2018-03-29 2024-01-09 Intel Corporation Antenna modules and communication devices

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