JPS6481337A - Installation of wiring structure of semiconductor integrated circuit device - Google Patents

Installation of wiring structure of semiconductor integrated circuit device

Info

Publication number
JPS6481337A
JPS6481337A JP23733087A JP23733087A JPS6481337A JP S6481337 A JPS6481337 A JP S6481337A JP 23733087 A JP23733087 A JP 23733087A JP 23733087 A JP23733087 A JP 23733087A JP S6481337 A JPS6481337 A JP S6481337A
Authority
JP
Japan
Prior art keywords
lattice
interval
wiring
bundle
wiring structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23733087A
Other languages
English (en)
Inventor
Toshiaki Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP23733087A priority Critical patent/JPS6481337A/ja
Publication of JPS6481337A publication Critical patent/JPS6481337A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP23733087A 1987-09-24 1987-09-24 Installation of wiring structure of semiconductor integrated circuit device Pending JPS6481337A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23733087A JPS6481337A (en) 1987-09-24 1987-09-24 Installation of wiring structure of semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23733087A JPS6481337A (en) 1987-09-24 1987-09-24 Installation of wiring structure of semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS6481337A true JPS6481337A (en) 1989-03-27

Family

ID=17013776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23733087A Pending JPS6481337A (en) 1987-09-24 1987-09-24 Installation of wiring structure of semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6481337A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2378815B (en) * 2001-04-04 2005-11-09 Nec Corp Semi-custom-made semiconductor integrated circuit device, method for customization and method for redesign

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2378815B (en) * 2001-04-04 2005-11-09 Nec Corp Semi-custom-made semiconductor integrated circuit device, method for customization and method for redesign
US7047514B2 (en) 2001-04-04 2006-05-16 Nec Electronics Corporation Semi-custom-made semiconductor integrated circuit device, method for customization and method for redesign
US7523436B2 (en) 2001-04-04 2009-04-21 Nec Electronics Corporation Semi-custom-made semiconductor integrated circuit device, method for customization and method for redesign

Similar Documents

Publication Publication Date Title
JPS56165371A (en) Semiconductor device
GB1513893A (en) Integrated circuit structure
KR890004879B1 (en) Master-slcie type semiconductor integrated circuit device
JPS6453440A (en) Three-dimensional semiconductor integrated circuit device
JPS57121250A (en) Semiconductor integrated circuit
GB1451175A (en) Power distribution systems
JPS57190343A (en) Semiconductor integrated circuit
KR900015349A (ko) 유니트 블록(unit block) 구조를 갖는 바이폴라 집적회로
JPS6481337A (en) Installation of wiring structure of semiconductor integrated circuit device
EP0166027A3 (en) C-mos basic cell
JPS5661151A (en) Package semiconductor integrated circuit
JPS54162981A (en) Semiconductor integrated circuit device
EP0338817A3 (en) Semiconductor integrated circuit device and method of producing the same using master slice approach
JPS57196557A (en) Semiconductor device
JPS5720448A (en) Semiconductor integrated circuit device
JPS57162360A (en) Complementary insulated gate field effect semiconductor device
JPS5561041A (en) Packaging device for semiconductor integrated circuit
JPS57162172A (en) Detector for magnetic bubble device
EP0346625A3 (en) Method of forming a semiconductor integrated circuit having isolation trenches
JPS5935448A (ja) マスタスライス集積回路装置
JPS6481338A (en) Method of laying out semiconductor logic integrated circuit
JPS53127285A (en) Semiconductor integrated circuit device
JPS57153461A (en) Input protective resistor for semiconductor device
JPS56129341A (en) Semiconductor integrated circuit device
JPS56126971A (en) Thin film field effect element