JPS6481330A - Film carrier semiconductor device - Google Patents

Film carrier semiconductor device

Info

Publication number
JPS6481330A
JPS6481330A JP62240014A JP24001487A JPS6481330A JP S6481330 A JPS6481330 A JP S6481330A JP 62240014 A JP62240014 A JP 62240014A JP 24001487 A JP24001487 A JP 24001487A JP S6481330 A JPS6481330 A JP S6481330A
Authority
JP
Japan
Prior art keywords
lead
semiconductor chip
film carrier
bump
carrier tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62240014A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0558657B2 (pm
Inventor
Koichi Takegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62240014A priority Critical patent/JPS6481330A/ja
Publication of JPS6481330A publication Critical patent/JPS6481330A/ja
Publication of JPH0558657B2 publication Critical patent/JPH0558657B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP62240014A 1987-09-24 1987-09-24 Film carrier semiconductor device Granted JPS6481330A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62240014A JPS6481330A (en) 1987-09-24 1987-09-24 Film carrier semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62240014A JPS6481330A (en) 1987-09-24 1987-09-24 Film carrier semiconductor device

Publications (2)

Publication Number Publication Date
JPS6481330A true JPS6481330A (en) 1989-03-27
JPH0558657B2 JPH0558657B2 (pm) 1993-08-27

Family

ID=17053177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62240014A Granted JPS6481330A (en) 1987-09-24 1987-09-24 Film carrier semiconductor device

Country Status (1)

Country Link
JP (1) JPS6481330A (pm)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04264743A (ja) * 1990-10-24 1992-09-21 Internatl Business Mach Corp <Ibm> パッケージング
JPH07226418A (ja) * 1993-12-16 1995-08-22 Nec Corp チップキャリア半導体装置及びその製造方法
EP0703615A1 (en) * 1994-05-31 1996-03-27 Nec Corporation Tape carrier for increasing the number of terminals between the tape carrier and a substrate
JPH08148526A (ja) * 1994-09-22 1996-06-07 Nec Corp 半導体装置
JPH09252023A (ja) * 1996-03-15 1997-09-22 Nec Corp 半導体装置およびその製造方法
WO1998018163A1 (en) * 1996-10-22 1998-04-30 Seiko Epson Corporation Film carrier tape, tape carrier semiconductor device assembly, semiconductor device, its manufacturing method, package substrate, and electronic appliance
US7098078B2 (en) 1990-09-24 2006-08-29 Tessera, Inc. Microelectronic component and assembly having leads with offset portions
JP2006237633A (ja) * 1994-12-20 2006-09-07 Renesas Technology Corp 半導体装置の製造方法
JP2008277872A (ja) * 1994-12-20 2008-11-13 Renesas Technology Corp 半導体装置
USRE41478E1 (en) 1994-12-20 2010-08-10 Renesas Electronics Corporation Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6395639A (ja) * 1986-10-09 1988-04-26 Mitsubishi Electric Corp テ−プキヤリア

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6395639A (ja) * 1986-10-09 1988-04-26 Mitsubishi Electric Corp テ−プキヤリア

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7098078B2 (en) 1990-09-24 2006-08-29 Tessera, Inc. Microelectronic component and assembly having leads with offset portions
US7271481B2 (en) 1990-09-24 2007-09-18 Tessera, Inc. Microelectronic component and assembly having leads with offset portions
JPH04264743A (ja) * 1990-10-24 1992-09-21 Internatl Business Mach Corp <Ibm> パッケージング
JPH07226418A (ja) * 1993-12-16 1995-08-22 Nec Corp チップキャリア半導体装置及びその製造方法
EP0703615A1 (en) * 1994-05-31 1996-03-27 Nec Corporation Tape carrier for increasing the number of terminals between the tape carrier and a substrate
JPH08148526A (ja) * 1994-09-22 1996-06-07 Nec Corp 半導体装置
USRE41722E1 (en) 1994-12-20 2010-09-21 Renesas Electronics Corp. Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof
JP2006237633A (ja) * 1994-12-20 2006-09-07 Renesas Technology Corp 半導体装置の製造方法
JP2008277872A (ja) * 1994-12-20 2008-11-13 Renesas Technology Corp 半導体装置
USRE41478E1 (en) 1994-12-20 2010-08-10 Renesas Electronics Corporation Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof
USRE41721E1 (en) 1994-12-20 2010-09-21 Renesas Electronics Corporation Semiconductor device having an improved connected arrangement between a semiconductor pellet and base substrate electrodes
USRE42972E1 (en) 1994-12-20 2011-11-29 Renesas Electronics Corporation Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof
USRE43444E1 (en) 1994-12-20 2012-06-05 Renesas Electronics Corporation Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes
USRE44148E1 (en) 1994-12-20 2013-04-16 Renesas Electronics Corporation Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof
JPH09252023A (ja) * 1996-03-15 1997-09-22 Nec Corp 半導体装置およびその製造方法
US6130110A (en) * 1996-10-22 2000-10-10 Seiko Epson Corporation Film carrier tape, tape carrier semiconductor device assembly, semiconductor device, and method of making the same, mounted board, and electronic device
WO1998018163A1 (en) * 1996-10-22 1998-04-30 Seiko Epson Corporation Film carrier tape, tape carrier semiconductor device assembly, semiconductor device, its manufacturing method, package substrate, and electronic appliance

Also Published As

Publication number Publication date
JPH0558657B2 (pm) 1993-08-27

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