JPS64810B2 - - Google Patents

Info

Publication number
JPS64810B2
JPS64810B2 JP8557581A JP8557581A JPS64810B2 JP S64810 B2 JPS64810 B2 JP S64810B2 JP 8557581 A JP8557581 A JP 8557581A JP 8557581 A JP8557581 A JP 8557581A JP S64810 B2 JPS64810 B2 JP S64810B2
Authority
JP
Japan
Prior art keywords
endless
wafer
stretched
arm
liquid tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8557581A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57201028A (en
Inventor
Masaaki Minami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP8557581A priority Critical patent/JPS57201028A/ja
Publication of JPS57201028A publication Critical patent/JPS57201028A/ja
Publication of JPS64810B2 publication Critical patent/JPS64810B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP8557581A 1981-06-05 1981-06-05 Wafer conveying device Granted JPS57201028A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8557581A JPS57201028A (en) 1981-06-05 1981-06-05 Wafer conveying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8557581A JPS57201028A (en) 1981-06-05 1981-06-05 Wafer conveying device

Publications (2)

Publication Number Publication Date
JPS57201028A JPS57201028A (en) 1982-12-09
JPS64810B2 true JPS64810B2 (ru) 1989-01-09

Family

ID=13862607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8557581A Granted JPS57201028A (en) 1981-06-05 1981-06-05 Wafer conveying device

Country Status (1)

Country Link
JP (1) JPS57201028A (ru)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59127838A (ja) * 1983-01-11 1984-07-23 Sumitomo Electric Ind Ltd ミラ−ウエハの連続エツチング装置
JPH058675Y2 (ru) * 1985-03-13 1993-03-04
JPS63260037A (ja) * 1987-04-16 1988-10-27 Nec Kyushu Ltd 半導体基板自動薬液処理装置
US4902608A (en) * 1987-12-17 1990-02-20 Texas Instruments Incorporated Immersion development and rinse machine and process

Also Published As

Publication number Publication date
JPS57201028A (en) 1982-12-09

Similar Documents

Publication Publication Date Title
KR940002914B1 (ko) 반도체 제조장치
KR100280947B1 (ko) 판 형상체 반송장치
JP2889657B2 (ja) 板状体搬送装置
JPS64810B2 (ru)
WO1987007078A1 (en) Article transfer apparatus
US4699556A (en) Object handling apparatus
JPH07106402A (ja) 板状体搬送装置
TWI811554B (zh) 將物品移動至處理站之裝置及方法、輸送系統及處理設備
JP2825616B2 (ja) 板状体搬送装置
KR920003793B1 (ko) 디스크 필름 이송장치
JPH04361551A (ja) 半導体ウエハの搬送装置
JP4515649B2 (ja) 基板の角度変換装置
JP3442116B2 (ja) 板状体搬送装置
JP4746227B2 (ja) メッキ装置における製品ガイド機構
SU1046177A1 (ru) Устройство дл транспортировани и подачи на рабочую позицию плоских деталей
JPH04286519A (ja) 矩形板搬送装置
CN220963269U (zh) 一种晶圆倒料装置
JPS5819564B2 (ja) 搬送装置のセット方法
JP2005012081A (ja) ウエハの把持装置および搬送装置
JP3580646B2 (ja) 基板処理装置
JP3447455B2 (ja) 昇降台付搬送装置
JP3235862B2 (ja) 板状体の配列ピッチ変換装置
JPS63102238A (ja) ウエハ移送装置
KR200160893Y1 (ko) 물체 이송용 로봇
SU1166048A1 (ru) Про вочное устройство дл обработки форматного фотоматериала