JPS6473739A - Table for wafer mounting - Google Patents

Table for wafer mounting

Info

Publication number
JPS6473739A
JPS6473739A JP23180287A JP23180287A JPS6473739A JP S6473739 A JPS6473739 A JP S6473739A JP 23180287 A JP23180287 A JP 23180287A JP 23180287 A JP23180287 A JP 23180287A JP S6473739 A JPS6473739 A JP S6473739A
Authority
JP
Japan
Prior art keywords
wafer
microcrack
contact
wafer mounting
comes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23180287A
Other languages
English (en)
Inventor
Kuhiro Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP23180287A priority Critical patent/JPS6473739A/ja
Publication of JPS6473739A publication Critical patent/JPS6473739A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP23180287A 1987-09-16 1987-09-16 Table for wafer mounting Pending JPS6473739A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23180287A JPS6473739A (en) 1987-09-16 1987-09-16 Table for wafer mounting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23180287A JPS6473739A (en) 1987-09-16 1987-09-16 Table for wafer mounting

Publications (1)

Publication Number Publication Date
JPS6473739A true JPS6473739A (en) 1989-03-20

Family

ID=16929251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23180287A Pending JPS6473739A (en) 1987-09-16 1987-09-16 Table for wafer mounting

Country Status (1)

Country Link
JP (1) JPS6473739A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0821403A2 (en) * 1996-07-24 1998-01-28 Applied Materials, Inc. Semiconductor wafer support with graded thermal mass
EP0840358A2 (en) * 1996-11-05 1998-05-06 Applied Materials, Inc. Sloped substrate support
US6730579B1 (en) 1999-02-05 2004-05-04 Sharp Kabushiki Kaisha Method of manufacturing a semiconductor dice by partially dicing the substrate and subsequent chemical etching
JP2011049287A (ja) * 2009-08-26 2011-03-10 Disco Abrasive Syst Ltd テープ貼り補助冶具

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5443461A (en) * 1977-09-12 1979-04-06 Sumitomo Electric Ind Ltd Packing method of semiconductor wafer
JPS5846437B2 (ja) * 1975-12-29 1983-10-17 株式会社クボタ ヨウジユウフレドメソウチ
JPS621242A (ja) * 1985-02-07 1987-01-07 Fujitsu Ltd 半導体ウエハにテ−プ又はシ−トを接着する方法及び装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5846437B2 (ja) * 1975-12-29 1983-10-17 株式会社クボタ ヨウジユウフレドメソウチ
JPS5443461A (en) * 1977-09-12 1979-04-06 Sumitomo Electric Ind Ltd Packing method of semiconductor wafer
JPS621242A (ja) * 1985-02-07 1987-01-07 Fujitsu Ltd 半導体ウエハにテ−プ又はシ−トを接着する方法及び装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0821403A2 (en) * 1996-07-24 1998-01-28 Applied Materials, Inc. Semiconductor wafer support with graded thermal mass
EP0821403A3 (en) * 1996-07-24 2004-01-21 Applied Materials, Inc. Semiconductor wafer support with graded thermal mass
EP0840358A2 (en) * 1996-11-05 1998-05-06 Applied Materials, Inc. Sloped substrate support
EP0840358A3 (en) * 1996-11-05 2004-01-14 Applied Materials, Inc. Sloped substrate support
US6730579B1 (en) 1999-02-05 2004-05-04 Sharp Kabushiki Kaisha Method of manufacturing a semiconductor dice by partially dicing the substrate and subsequent chemical etching
JP2011049287A (ja) * 2009-08-26 2011-03-10 Disco Abrasive Syst Ltd テープ貼り補助冶具

Similar Documents

Publication Publication Date Title
MY125036A (en) Techniques for dicing substrates during integrated circuit fabrication
JPS6473739A (en) Table for wafer mounting
JPS56126968A (en) Semiconductor device
JPS5230162A (en) Semiconductor device
JPS53144265A (en) Etching device
JPS6410643A (en) Bonding method for semiconductor substrate
JPS545674A (en) Semiconductor device
JPS51118180A (en) Chuck equipped with angle indexing device
JPS51134566A (en) Semiconductor unit manufacturing process
JPS5322373A (en) Solder d isc feeder to wafers
JPS55127029A (en) Semiconductor device
JPS5414672A (en) Bonding electrode structure of semiconductor device
JPS56120137A (en) Semiconductor pellet pickup device
JPS5437468A (en) Breaking device for semiconductor wafer
JPS5325350A (en) Dicing method of semiconductor substrates
FR2391503B1 (ja)
JPS54149470A (en) Washing jig of semiconductor chip
JPS6442155A (en) Semiconductor chip carrier package
JPS6428853A (en) Semiconductor device
JPS5630732A (en) Mounting method of semiconductor pellet
JPS55162242A (en) Semiconductor-wafer-pasted substrate
JPS5779646A (en) Semiconductor wafer
EP0326432A3 (en) Semiconductor device having a defect-containing zone in the substrate
JPS5218172A (en) Semiconductor device
JPS5687341A (en) Method of isolating chip of semiconductor wafer