JPS6468478A - Metal plating method using silver hydrosol - Google Patents

Metal plating method using silver hydrosol

Info

Publication number
JPS6468478A
JPS6468478A JP22370887A JP22370887A JPS6468478A JP S6468478 A JPS6468478 A JP S6468478A JP 22370887 A JP22370887 A JP 22370887A JP 22370887 A JP22370887 A JP 22370887A JP S6468478 A JPS6468478 A JP S6468478A
Authority
JP
Japan
Prior art keywords
silver
plated
colloid
plating
hydrosol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22370887A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0553873B2 (enrdf_load_stackoverflow
Inventor
Yukimichi Nakao
Kyoji Kaeriyama
Aizo Yamauchi
Tomoyuki Imai
Nanao Horiishi
Hiroshi Igarashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Toda Kogyo Corp
Original Assignee
Agency of Industrial Science and Technology
Toda Kogyo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology, Toda Kogyo Corp filed Critical Agency of Industrial Science and Technology
Priority to JP22370887A priority Critical patent/JPS6468478A/ja
Publication of JPS6468478A publication Critical patent/JPS6468478A/ja
Publication of JPH0553873B2 publication Critical patent/JPH0553873B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP22370887A 1987-09-07 1987-09-07 Metal plating method using silver hydrosol Granted JPS6468478A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22370887A JPS6468478A (en) 1987-09-07 1987-09-07 Metal plating method using silver hydrosol

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22370887A JPS6468478A (en) 1987-09-07 1987-09-07 Metal plating method using silver hydrosol

Publications (2)

Publication Number Publication Date
JPS6468478A true JPS6468478A (en) 1989-03-14
JPH0553873B2 JPH0553873B2 (enrdf_load_stackoverflow) 1993-08-11

Family

ID=16802417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22370887A Granted JPS6468478A (en) 1987-09-07 1987-09-07 Metal plating method using silver hydrosol

Country Status (1)

Country Link
JP (1) JPS6468478A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03104873A (ja) * 1989-09-18 1991-05-01 Shizuoka Prefecture 電気絶縁体への無電解めっき法
JPH03219085A (ja) * 1989-05-04 1991-09-26 Ad Tech Holdings Ltd 不伝導基質上の銀層沈着
WO2001081652A1 (fr) * 2000-04-25 2001-11-01 Nikko Materials Co., Ltd. Agent de pretraitement pour revetement metallique
US7767009B2 (en) 2005-09-14 2010-08-03 OMG Electronic Chemicals, Inc. Solution and process for improving the solderability of a metal surface
WO2014203843A1 (ja) 2013-06-21 2014-12-24 Dic株式会社 無電解めっき用触媒、これを用いた金属皮膜及びその製造方法
JP2015021147A (ja) * 2013-07-17 2015-02-02 名古屋メッキ工業株式会社 有機繊維材料の無電解金属めっき処理方法及び無電解金属めっき繊維
KR20150058097A (ko) 2012-09-20 2015-05-28 디아이씨 가부시끼가이샤 도전성 재료 및 그 제조 방법
CN109440453A (zh) * 2018-10-22 2019-03-08 复旦大学 一种Cu-Ni-Gd-B-P电子织物的制备方法
JP2025074825A (ja) * 2023-10-30 2025-05-14 奥野製薬工業株式会社 無電解めっき用触媒付与液、触媒付与方法、及び、無電解めっき方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59120249A (ja) * 1982-12-27 1984-07-11 Agency Of Ind Science & Technol 貴金属触媒の製造方法
JPS6263676A (ja) * 1985-09-14 1987-03-20 Agency Of Ind Science & Technol ポリエチレンテレフタレ−トフイルムの強磁性金属めつき方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59120249A (ja) * 1982-12-27 1984-07-11 Agency Of Ind Science & Technol 貴金属触媒の製造方法
JPS6263676A (ja) * 1985-09-14 1987-03-20 Agency Of Ind Science & Technol ポリエチレンテレフタレ−トフイルムの強磁性金属めつき方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03219085A (ja) * 1989-05-04 1991-09-26 Ad Tech Holdings Ltd 不伝導基質上の銀層沈着
JPH03104873A (ja) * 1989-09-18 1991-05-01 Shizuoka Prefecture 電気絶縁体への無電解めっき法
WO2001081652A1 (fr) * 2000-04-25 2001-11-01 Nikko Materials Co., Ltd. Agent de pretraitement pour revetement metallique
US6780467B2 (en) 2000-04-25 2004-08-24 Nikko Materials Co., Ltd. Plating pretreatment agent and metal plating method using the same
US7767009B2 (en) 2005-09-14 2010-08-03 OMG Electronic Chemicals, Inc. Solution and process for improving the solderability of a metal surface
US8110252B2 (en) 2005-09-14 2012-02-07 Omg Electronic Chemicals, Llc Solution and process for improving the solderability of a metal surface
KR20150058097A (ko) 2012-09-20 2015-05-28 디아이씨 가부시끼가이샤 도전성 재료 및 그 제조 방법
WO2014203843A1 (ja) 2013-06-21 2014-12-24 Dic株式会社 無電解めっき用触媒、これを用いた金属皮膜及びその製造方法
KR20160045907A (ko) 2013-06-21 2016-04-27 디아이씨 가부시끼가이샤 무전해 도금용 촉매, 이것을 사용한 금속 피막 및 그 제조 방법
JP2015021147A (ja) * 2013-07-17 2015-02-02 名古屋メッキ工業株式会社 有機繊維材料の無電解金属めっき処理方法及び無電解金属めっき繊維
CN109440453A (zh) * 2018-10-22 2019-03-08 复旦大学 一种Cu-Ni-Gd-B-P电子织物的制备方法
JP2025074825A (ja) * 2023-10-30 2025-05-14 奥野製薬工業株式会社 無電解めっき用触媒付与液、触媒付与方法、及び、無電解めっき方法

Also Published As

Publication number Publication date
JPH0553873B2 (enrdf_load_stackoverflow) 1993-08-11

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