ES489809A1 - Procedimiento para la activacion de superficies de materia- les sinteticos - Google Patents
Procedimiento para la activacion de superficies de materia- les sinteticosInfo
- Publication number
- ES489809A1 ES489809A1 ES489809A ES489809A ES489809A1 ES 489809 A1 ES489809 A1 ES 489809A1 ES 489809 A ES489809 A ES 489809A ES 489809 A ES489809 A ES 489809A ES 489809 A1 ES489809 A1 ES 489809A1
- Authority
- ES
- Spain
- Prior art keywords
- noble
- metal
- plastic
- immersed
- complexes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title abstract 4
- 230000003213 activating effect Effects 0.000 title 1
- 229910000510 noble metal Inorganic materials 0.000 abstract 4
- 239000008139 complexing agent Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000001465 metallisation Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
Abstract
Procedimiento para la activación de superficies de materiales sintéticos para una formación de núcleos o siembra química con un metal noble, de manera tal que después de ello se pueda realizar una metalización, caracterizado por las siguientes etapas de procedimiento. 1.1 la superficie de material sintético es asperizada mecánicamente; 1.2 el material sintético es sumergido en una solución de un agente formador de complejos; 1.3 el material sintético es sumergido a continuación en una solución de una sal compleja de metal noble, por lo que en la superficie de material sintético se efectúa un intercambio de los complejos depositados en la etapa de procedimiento 1.2 por complejos de metales; 1.4 los complejos de metales nobles son reducidos para rormar núcleos de metales.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19792930784 DE2930784A1 (de) | 1979-07-28 | 1979-07-28 | Verfahren zur aktivierung von kunststoffoberflaechen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES489809A1 true ES489809A1 (es) | 1980-09-16 |
Family
ID=6077095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES489809A Expired ES489809A1 (es) | 1979-07-28 | 1980-03-21 | Procedimiento para la activacion de superficies de materia- les sinteticos |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0023240A1 (es) |
| JP (1) | JPS5620034A (es) |
| DE (1) | DE2930784A1 (es) |
| ES (1) | ES489809A1 (es) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5178914A (en) * | 1990-10-30 | 1993-01-12 | International Business Machines Corp. | Means of seeding and metallizing polymide |
| DE19729891B4 (de) * | 1997-07-12 | 2006-12-21 | AHC-Oberflächentechnik GmbH & Co. OHG | Verfahren zur gezielten Aufrauhung von Kunststoffoberflächen und Vorrichtung zur Ausführung des Verfahrens |
| US8784952B2 (en) * | 2011-08-19 | 2014-07-22 | Earthone Circuit Technologies Corporation | Method of forming a conductive image on a non-conductive surface |
| DE102020110808A1 (de) | 2020-04-21 | 2021-10-21 | Hochschule Zittau/Görlitz | Verfahren zur Vorbehandlung, Metallisierung und Lackbeschichtung eines Kunststoffsubstrats sowie beschichtetes Kunststoffsubstrat |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1769778A1 (de) * | 1968-07-11 | 1971-12-30 | Degussa | Verfahren zur Vorbehandlung von Kunststoffen zum Zwecke der haftfesten Metallisierung |
| US3962496A (en) * | 1974-11-07 | 1976-06-08 | Photocircuits Division Of Kollmorgen | Composition and method for neutralizing and sensitizing resinous surfaces and improved sensitized resinous surfaces for adherent metallization |
-
1979
- 1979-07-28 DE DE19792930784 patent/DE2930784A1/de not_active Ceased
-
1980
- 1980-03-03 EP EP19800101060 patent/EP0023240A1/de not_active Ceased
- 1980-03-21 ES ES489809A patent/ES489809A1/es not_active Expired
- 1980-03-29 JP JP3967880A patent/JPS5620034A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5620034A (en) | 1981-02-25 |
| EP0023240A1 (de) | 1981-02-04 |
| DE2930784A1 (de) | 1981-02-12 |
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