JPS6457637A - Method and apparatus for handling wafer - Google Patents

Method and apparatus for handling wafer

Info

Publication number
JPS6457637A
JPS6457637A JP63118423A JP11842388A JPS6457637A JP S6457637 A JPS6457637 A JP S6457637A JP 63118423 A JP63118423 A JP 63118423A JP 11842388 A JP11842388 A JP 11842388A JP S6457637 A JPS6457637 A JP S6457637A
Authority
JP
Japan
Prior art keywords
wafer
handler
bump
ports
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63118423A
Other languages
English (en)
Other versions
JPH0322058B2 (ja
Inventor
Aaru Butsushiyu Donarudo
Jiei Reechiru Giyarii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Publication of JPS6457637A publication Critical patent/JPS6457637A/ja
Publication of JPH0322058B2 publication Critical patent/JPH0322058B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP63118423A 1987-05-22 1988-05-17 Method and apparatus for handling wafer Granted JPS6457637A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/053,980 US4773687A (en) 1987-05-22 1987-05-22 Wafer handler

Publications (2)

Publication Number Publication Date
JPS6457637A true JPS6457637A (en) 1989-03-03
JPH0322058B2 JPH0322058B2 (ja) 1991-03-26

Family

ID=21987890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63118423A Granted JPS6457637A (en) 1987-05-22 1988-05-17 Method and apparatus for handling wafer

Country Status (3)

Country Link
US (1) US4773687A (ja)
EP (1) EP0295785A1 (ja)
JP (1) JPS6457637A (ja)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2624778B1 (fr) * 1987-12-22 1994-09-23 Recif Sa Embout pour pipette a vide
JP2865690B2 (ja) * 1989-02-17 1999-03-08 株式会社日立製作所 嵌合挿入装置
US5292222A (en) * 1992-03-31 1994-03-08 International Business Machines Corporation Robotic load device for outer diameter pickup of a disk
USH1373H (en) * 1992-04-06 1994-11-01 American Telephone And Telegraph Company Wafer handling apparatus and method
DE4309092C2 (de) * 1993-03-22 1998-11-12 Joachim Dr Scheerer Verfahren und Vorrichtung zur Handhabung und zum Transport von Wafern in Reinst-Räumen
EP0634787B1 (en) * 1993-07-15 1997-05-02 Applied Materials, Inc. Subsrate tray and ceramic blade for semiconductor processing apparatus
US5697748A (en) * 1993-07-15 1997-12-16 Applied Materials, Inc. Wafer tray and ceramic blade for semiconductor processing apparatus
KR0175013B1 (ko) * 1995-09-13 1999-04-01 김광호 진공 트위저를 사용하는 반도체 제조장치
KR0163548B1 (ko) * 1995-12-18 1999-02-01 김광호 진공튀저
US5783754A (en) * 1996-02-28 1998-07-21 Integrated Device Technology, Inc. Apparatus and method for measuring the gripping strength of a vacuum wand
US5765890A (en) * 1996-10-03 1998-06-16 Memc Electronic Materials, Inc. Device for transferring a semiconductor wafer
JP3850951B2 (ja) * 1997-05-15 2006-11-29 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
US5915910A (en) * 1997-08-29 1999-06-29 Daitron, Inc. Semiconductor wafer transfer method and apparatus
US6183186B1 (en) 1997-08-29 2001-02-06 Daitron, Inc. Wafer handling system and method
US6168697B1 (en) 1998-03-10 2001-01-02 Trusi Technologies Llc Holders suitable to hold articles during processing and article processing methods
US6095582A (en) * 1998-03-11 2000-08-01 Trusi Technologies, Llc Article holders and holding methods
ATE305434T1 (de) * 1998-03-13 2005-10-15 Pronomic Ab Vakuum ejektor mit einer anzahl von saugnäpfen
WO2000078654A1 (en) * 1999-06-17 2000-12-28 Speedfam-Ipec Corporation Improved wafer handling apparatus
US6322116B1 (en) 1999-07-23 2001-11-27 Asm America, Inc. Non-contact end effector
US6517130B1 (en) * 2000-03-14 2003-02-11 Applied Materials, Inc. Self positioning vacuum chuck
US6474864B1 (en) * 2000-03-24 2002-11-05 Eastman Kodak Company Comfort-enhancing intraoral dental radiographic film packet and method for forming same
US6631935B1 (en) 2000-08-04 2003-10-14 Tru-Si Technologies, Inc. Detection and handling of semiconductor wafer and wafer-like objects
US6578893B2 (en) 2000-10-02 2003-06-17 Ajs Automation, Inc. Apparatus and methods for handling semiconductor wafers
US6612590B2 (en) * 2001-01-12 2003-09-02 Tokyo Electron Limited Apparatus and methods for manipulating semiconductor wafers
US6935830B2 (en) 2001-07-13 2005-08-30 Tru-Si Technologies, Inc. Alignment of semiconductor wafers and other articles
US6615113B2 (en) * 2001-07-13 2003-09-02 Tru-Si Technologies, Inc. Articles holders with sensors detecting a type of article held by the holder
US6638004B2 (en) 2001-07-13 2003-10-28 Tru-Si Technologies, Inc. Article holders and article positioning methods
US20030062734A1 (en) * 2001-10-02 2003-04-03 Faris Sadeg M. Device and method for handling fragile objects, and manufacturing method thereof
US7104578B2 (en) * 2002-03-15 2006-09-12 Asm International N.V. Two level end effector
KR20040001423A (ko) * 2002-06-28 2004-01-07 삼성전자주식회사 웨이퍼 이송장치의 로봇 암 청소장치
US6893070B2 (en) * 2002-10-17 2005-05-17 Delaware Capital Formation, Inc. Integrated end effector
US20040212205A1 (en) * 2003-01-30 2004-10-28 Linker Frank V. Method and apparatus for handling semiconductor wafers and interleafs
US7181132B2 (en) 2003-08-20 2007-02-20 Asm International N.V. Method and system for loading substrate supports into a substrate holder
CN101023011A (zh) * 2004-07-09 2007-08-22 Oc欧瑞康巴尔斯公司 气体支撑的基底承载机构
US8635784B2 (en) * 2005-10-04 2014-01-28 Applied Materials, Inc. Methods and apparatus for drying a substrate
JP4642787B2 (ja) * 2006-05-09 2011-03-02 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
JP4746003B2 (ja) * 2007-05-07 2011-08-10 リンテック株式会社 移載装置及び移載方法
ITUD20090214A1 (it) * 2009-11-24 2011-05-25 Applied Materials Inc Effettore d'estremita' per la manipolazione di substrati
US8905680B2 (en) 2011-10-31 2014-12-09 Masahiro Lee Ultrathin wafer transport systems
JP2013198960A (ja) * 2012-03-26 2013-10-03 Disco Corp ロボットハンド
DE102012111869A1 (de) 2012-12-06 2014-06-12 Aixtron Se Vakuumgreifvorrichtung
JP6128050B2 (ja) * 2014-04-25 2017-05-17 トヨタ自動車株式会社 非接触型搬送ハンド
JP6305272B2 (ja) * 2014-08-14 2018-04-04 株式会社ディスコ 搬送装置
CN107953093A (zh) * 2016-10-17 2018-04-24 重庆市钟表有限公司 真空吸附型E-Ring装配治具

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5525037U (ja) * 1978-08-05 1980-02-18
JPS56107896A (en) * 1980-01-23 1981-08-27 Hitachi Ltd Suction type vacuum tweezer
JPS6088548U (ja) * 1983-11-22 1985-06-18 三菱電機株式会社 半導体ウエ−ハの真空吸着具

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3200723A (en) * 1963-03-29 1965-08-17 Polaroid Corp Shutter timing apparatus
US3431009A (en) * 1967-01-06 1969-03-04 Western Electric Co Pickup device for supporting workpieces on a layer of fluid
US3523706A (en) * 1967-10-27 1970-08-11 Ibm Apparatus for supporting articles without structural contact and for positioning the supported articles
US3539216A (en) * 1968-01-11 1970-11-10 Sprague Electric Co Pickup device
US3517958A (en) * 1968-06-17 1970-06-30 Ibm Vacuum pick-up with air shield
GB1513444A (en) * 1974-09-06 1978-06-07 Chemical Reactor Equip As Pick-up devices for lifting and moving semiconductor wafers
DE2609754A1 (de) * 1976-03-09 1977-09-22 Wacker Chemitronic Halterung fuer das beidseitig beruehrungslose aufnehmen von scheiben
US4029351A (en) * 1976-06-02 1977-06-14 International Business Machines Corporation Bernoulli pickup head with self-restoring anti-tilt improvement
DE3036829A1 (de) * 1980-09-30 1982-05-13 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zum aufnehmen von kristallscheiben
FR2539373A1 (fr) * 1983-01-14 1984-07-20 Renault Vehicules Ind Dispositif de liaison d'un tracteur a une semi-remorque
US4566726A (en) * 1984-06-13 1986-01-28 At&T Technologies, Inc. Method and apparatus for handling semiconductor wafers
DE3686781D1 (de) * 1985-05-04 1992-10-29 Seibu Giken Kk Vorrichtung zum halten und/oder foerdern einer platte mittels eines fluids ohne koerperliche beruehrung.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5525037U (ja) * 1978-08-05 1980-02-18
JPS56107896A (en) * 1980-01-23 1981-08-27 Hitachi Ltd Suction type vacuum tweezer
JPS6088548U (ja) * 1983-11-22 1985-06-18 三菱電機株式会社 半導体ウエ−ハの真空吸着具

Also Published As

Publication number Publication date
JPH0322058B2 (ja) 1991-03-26
US4773687A (en) 1988-09-27
EP0295785A1 (en) 1988-12-21

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