JPS6450528A - Wafer alignment mark and manufacture thereof - Google Patents
Wafer alignment mark and manufacture thereofInfo
- Publication number
- JPS6450528A JPS6450528A JP62207761A JP20776187A JPS6450528A JP S6450528 A JPS6450528 A JP S6450528A JP 62207761 A JP62207761 A JP 62207761A JP 20776187 A JP20776187 A JP 20776187A JP S6450528 A JPS6450528 A JP S6450528A
- Authority
- JP
- Japan
- Prior art keywords
- alignment mark
- wafer alignment
- film
- wafer
- periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To provide sufficient contrast at the boundary between a wafer alignment mark and the periphery thereof to accurately detect the position of the wafer alignment mark at an edge thereof, by forming fine undulations on the surface or periphery of the wafer alignment mark. CONSTITUTION:In order to register a mask with a wafer by means of applied and reflected light, the surface or periphery of a wafer alignment mark 32 formed on the wafer is provided with fine undulations. According to an embodiment, an insulating film 31 of an oxide or nitride is formed on a silicon substrate 30 and a projecting wafer alignment mark 32 is selectively formed at a predetermined position on the film 31. The wafer alignment mark 32 formed of polysilicon or polysilicide has edges 32a and 32b approximately vertical to the surface of the film 31 and also has fine undulations on the surface 32c thereof. A film to be etched 33 is formed all over the surface of the insulating film 31 including the wafer alignment mark 32 and a resist film 34 is deposited thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62207761A JPS6450528A (en) | 1987-08-21 | 1987-08-21 | Wafer alignment mark and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62207761A JPS6450528A (en) | 1987-08-21 | 1987-08-21 | Wafer alignment mark and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6450528A true JPS6450528A (en) | 1989-02-27 |
Family
ID=16545111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62207761A Pending JPS6450528A (en) | 1987-08-21 | 1987-08-21 | Wafer alignment mark and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6450528A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5528372A (en) * | 1990-03-12 | 1996-06-18 | Fujitsu Limited | Alignment mark, laser trimmer and semiconductor device manufacturing process |
| US5876819A (en) * | 1995-02-17 | 1999-03-02 | Mitsubishi Denki Kabushiki Kaisha | Crystal orientation detectable semiconductor substrate, and methods of manufacturing and using the same |
| JP2012064967A (en) * | 2011-11-28 | 2012-03-29 | Fuji Electric Co Ltd | Semiconductor device and method of manufacturing the same |
-
1987
- 1987-08-21 JP JP62207761A patent/JPS6450528A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5528372A (en) * | 1990-03-12 | 1996-06-18 | Fujitsu Limited | Alignment mark, laser trimmer and semiconductor device manufacturing process |
| US5876819A (en) * | 1995-02-17 | 1999-03-02 | Mitsubishi Denki Kabushiki Kaisha | Crystal orientation detectable semiconductor substrate, and methods of manufacturing and using the same |
| JP2012064967A (en) * | 2011-11-28 | 2012-03-29 | Fuji Electric Co Ltd | Semiconductor device and method of manufacturing the same |
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