JPS6448462A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6448462A JPS6448462A JP62204071A JP20407187A JPS6448462A JP S6448462 A JPS6448462 A JP S6448462A JP 62204071 A JP62204071 A JP 62204071A JP 20407187 A JP20407187 A JP 20407187A JP S6448462 A JPS6448462 A JP S6448462A
- Authority
- JP
- Japan
- Prior art keywords
- mosfet
- minimized
- semiconductor substrate
- disposed
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
Abstract
PURPOSE:To stabilize the current ratio of a MOSFET, by disposing each of the MOSFETs so that the direction from a source toward a drain is inclined at + or -45 deg. with the crystallographic axis of a semiconductor substrate. CONSTITUTION:Each unit MOSFET which comprises an insulating gate 2, source and drain diffusion layers 3, 4, and a contact hole 5 on a silicon semiconductor substrate 1 is so disposed that the current flow direction or the longitudinal direction of a channel is inclined at 45 deg. or 135 deg. with the base axis x or y. In such a manner, the device is so disposed as to be inclined at 45 deg. with the base crystallographic axis in the {100} plane of a wafer, which enables the piezoelectric effect in the resistance part thereof to be minimized. Therefore, the resistance change in the channel part thereof, resulting from the stresses during the MOSFET being assembled or molded, can be minimized. As a result, the current ratio indispensable to DAC can be stabilized.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62204071A JPS6448462A (en) | 1987-08-19 | 1987-08-19 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62204071A JPS6448462A (en) | 1987-08-19 | 1987-08-19 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6448462A true JPS6448462A (en) | 1989-02-22 |
Family
ID=16484282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62204071A Pending JPS6448462A (en) | 1987-08-19 | 1987-08-19 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6448462A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004087640A (en) * | 2002-08-26 | 2004-03-18 | Renesas Technology Corp | Semiconductor device |
WO2005064680A1 (en) * | 2003-12-25 | 2005-07-14 | Fujitsu Limited | Semiconductor device and semiconductor integrated circuit device |
JP2006060039A (en) * | 2004-08-20 | 2006-03-02 | Nec Electronics Corp | Field effect transistor, manufacturing method thereof and complementary field effect transistor |
JP2007329295A (en) * | 2006-06-08 | 2007-12-20 | Hitachi Ltd | Semiconductor, and its manufacturing method |
US8039836B2 (en) | 2005-09-06 | 2011-10-18 | Canon Kabushiki Kaisha | Semiconductor device |
-
1987
- 1987-08-19 JP JP62204071A patent/JPS6448462A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004087640A (en) * | 2002-08-26 | 2004-03-18 | Renesas Technology Corp | Semiconductor device |
WO2005064680A1 (en) * | 2003-12-25 | 2005-07-14 | Fujitsu Limited | Semiconductor device and semiconductor integrated circuit device |
JP2006060039A (en) * | 2004-08-20 | 2006-03-02 | Nec Electronics Corp | Field effect transistor, manufacturing method thereof and complementary field effect transistor |
US8039836B2 (en) | 2005-09-06 | 2011-10-18 | Canon Kabushiki Kaisha | Semiconductor device |
JP2007329295A (en) * | 2006-06-08 | 2007-12-20 | Hitachi Ltd | Semiconductor, and its manufacturing method |
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