JPS64469B2 - - Google Patents
Info
- Publication number
- JPS64469B2 JPS64469B2 JP60110844A JP11084485A JPS64469B2 JP S64469 B2 JPS64469 B2 JP S64469B2 JP 60110844 A JP60110844 A JP 60110844A JP 11084485 A JP11084485 A JP 11084485A JP S64469 B2 JPS64469 B2 JP S64469B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- tin
- stripping solution
- base material
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11084485A JPS61266582A (ja) | 1985-05-22 | 1985-05-22 | 錫又は錫合金の剥離液 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11084485A JPS61266582A (ja) | 1985-05-22 | 1985-05-22 | 錫又は錫合金の剥離液 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61266582A JPS61266582A (ja) | 1986-11-26 |
JPS64469B2 true JPS64469B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-01-06 |
Family
ID=14546093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11084485A Granted JPS61266582A (ja) | 1985-05-22 | 1985-05-22 | 錫又は錫合金の剥離液 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61266582A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0353824A (ja) * | 1989-07-21 | 1991-03-07 | Toshiba Corp | 養液制御装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008106354A (ja) * | 2006-09-25 | 2008-05-08 | Mec Kk | 金属除去液及びこれを用いた金属除去方法 |
JP6429079B2 (ja) * | 2015-02-12 | 2018-11-28 | メック株式会社 | エッチング液及びエッチング方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5858280A (ja) * | 1981-09-30 | 1983-04-06 | Metsuku Kk | 錫又は錫合金の剥離液 |
-
1985
- 1985-05-22 JP JP11084485A patent/JPS61266582A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0353824A (ja) * | 1989-07-21 | 1991-03-07 | Toshiba Corp | 養液制御装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS61266582A (ja) | 1986-11-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |