JPS6444038A - Wafer setting device - Google Patents

Wafer setting device

Info

Publication number
JPS6444038A
JPS6444038A JP62201302A JP20130287A JPS6444038A JP S6444038 A JPS6444038 A JP S6444038A JP 62201302 A JP62201302 A JP 62201302A JP 20130287 A JP20130287 A JP 20130287A JP S6444038 A JPS6444038 A JP S6444038A
Authority
JP
Japan
Prior art keywords
wafers
flat positions
positions
flat
rotor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62201302A
Other languages
Japanese (ja)
Inventor
Shigeki Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62201302A priority Critical patent/JPS6444038A/en
Publication of JPS6444038A publication Critical patent/JPS6444038A/en
Pending legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To vary an orientation flat position and to improve the manufacturing yield of a semiconductor device by respectively rotating a plurality of wafers at different angles. CONSTITUTION:When wafers in which its orientation flat positions are displaced by a wafer setting device is set on electrodes in a processing chamber of a sheet type dry etching apparatus, the orientation flat positions are altered at the respective wafers to prevent an abnormal discharge due to the fact that the flat positions are disposed in a predetermined direction. Since the flat positions are aligned when the wafers 50 are set on a carrier 60, if a rotor 20 is rotated to vary the flat positions, the displaced amounts of the flat positions become uniform. The flat positions of the wafers 50 held by the carrier 60 can be varied only by rotating the rotor 20. Then, dusts are not adhered to the wafers 50, and the surfaces of the wafers 50 are not damaged. Thus, the manufacturing yield of a semiconductor device can be improved.
JP62201302A 1987-08-12 1987-08-12 Wafer setting device Pending JPS6444038A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62201302A JPS6444038A (en) 1987-08-12 1987-08-12 Wafer setting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62201302A JPS6444038A (en) 1987-08-12 1987-08-12 Wafer setting device

Publications (1)

Publication Number Publication Date
JPS6444038A true JPS6444038A (en) 1989-02-16

Family

ID=16438743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62201302A Pending JPS6444038A (en) 1987-08-12 1987-08-12 Wafer setting device

Country Status (1)

Country Link
JP (1) JPS6444038A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005061342A (en) * 2003-08-18 2005-03-10 Suzuki Motor Corp Air bypass passage structure for engine with turbo charger
US7093589B2 (en) * 2004-01-08 2006-08-22 Visteon Global Technologies, Inc. Apparatus for increasing induction air flow rate to a turbocharger
JP2010059834A (en) * 2008-09-02 2010-03-18 Yanmar Co Ltd Air intake structure for engine
US20110074067A1 (en) * 2009-09-30 2011-03-31 Ford Global Technologies, Llc Manufacture Of An Acoustic Silencer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005061342A (en) * 2003-08-18 2005-03-10 Suzuki Motor Corp Air bypass passage structure for engine with turbo charger
US7093589B2 (en) * 2004-01-08 2006-08-22 Visteon Global Technologies, Inc. Apparatus for increasing induction air flow rate to a turbocharger
JP2010059834A (en) * 2008-09-02 2010-03-18 Yanmar Co Ltd Air intake structure for engine
US20110074067A1 (en) * 2009-09-30 2011-03-31 Ford Global Technologies, Llc Manufacture Of An Acoustic Silencer

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