JPS6423560A - Semiconductor device and method of mounting same - Google Patents

Semiconductor device and method of mounting same

Info

Publication number
JPS6423560A
JPS6423560A JP17910887A JP17910887A JPS6423560A JP S6423560 A JPS6423560 A JP S6423560A JP 17910887 A JP17910887 A JP 17910887A JP 17910887 A JP17910887 A JP 17910887A JP S6423560 A JPS6423560 A JP S6423560A
Authority
JP
Japan
Prior art keywords
outer leads
stage
package
drawn out
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17910887A
Other languages
English (en)
Inventor
Motoo Azuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Priority to JP17910887A priority Critical patent/JPS6423560A/ja
Publication of JPS6423560A publication Critical patent/JPS6423560A/ja
Pending legal-status Critical Current

Links

JP17910887A 1987-07-20 1987-07-20 Semiconductor device and method of mounting same Pending JPS6423560A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17910887A JPS6423560A (en) 1987-07-20 1987-07-20 Semiconductor device and method of mounting same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17910887A JPS6423560A (en) 1987-07-20 1987-07-20 Semiconductor device and method of mounting same

Publications (1)

Publication Number Publication Date
JPS6423560A true JPS6423560A (en) 1989-01-26

Family

ID=16060158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17910887A Pending JPS6423560A (en) 1987-07-20 1987-07-20 Semiconductor device and method of mounting same

Country Status (1)

Country Link
JP (1) JPS6423560A (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0323946U (ja) * 1989-07-17 1991-03-12
JPH04184967A (ja) * 1990-11-19 1992-07-01 Mitsubishi Electric Corp 半導体装置
US5413970A (en) * 1993-10-08 1995-05-09 Texas Instruments Incorporated Process for manufacturing a semiconductor package having two rows of interdigitated leads
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
US6339191B1 (en) * 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US6857173B1 (en) 1998-10-26 2005-02-22 Silicon Bandwidth, Inc. Apparatus for and method of manufacturing a semiconductor die carrier

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0323946U (ja) * 1989-07-17 1991-03-12
JPH04184967A (ja) * 1990-11-19 1992-07-01 Mitsubishi Electric Corp 半導体装置
US5413970A (en) * 1993-10-08 1995-05-09 Texas Instruments Incorporated Process for manufacturing a semiconductor package having two rows of interdigitated leads
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
US6339191B1 (en) * 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US6828511B2 (en) 1994-03-11 2004-12-07 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US6977432B2 (en) 1994-03-11 2005-12-20 Quantum Leap Packaging, Inc. Prefabricated semiconductor chip carrier
US6857173B1 (en) 1998-10-26 2005-02-22 Silicon Bandwidth, Inc. Apparatus for and method of manufacturing a semiconductor die carrier

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