JPS6423560A - Semiconductor device and method of mounting same - Google Patents
Semiconductor device and method of mounting sameInfo
- Publication number
- JPS6423560A JPS6423560A JP17910887A JP17910887A JPS6423560A JP S6423560 A JPS6423560 A JP S6423560A JP 17910887 A JP17910887 A JP 17910887A JP 17910887 A JP17910887 A JP 17910887A JP S6423560 A JPS6423560 A JP S6423560A
- Authority
- JP
- Japan
- Prior art keywords
- outer leads
- stage
- package
- drawn out
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17910887A JPS6423560A (en) | 1987-07-20 | 1987-07-20 | Semiconductor device and method of mounting same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17910887A JPS6423560A (en) | 1987-07-20 | 1987-07-20 | Semiconductor device and method of mounting same |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6423560A true JPS6423560A (en) | 1989-01-26 |
Family
ID=16060158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17910887A Pending JPS6423560A (en) | 1987-07-20 | 1987-07-20 | Semiconductor device and method of mounting same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6423560A (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0323946U (ja) * | 1989-07-17 | 1991-03-12 | ||
JPH04184967A (ja) * | 1990-11-19 | 1992-07-01 | Mitsubishi Electric Corp | 半導体装置 |
US5413970A (en) * | 1993-10-08 | 1995-05-09 | Texas Instruments Incorporated | Process for manufacturing a semiconductor package having two rows of interdigitated leads |
US5824950A (en) * | 1994-03-11 | 1998-10-20 | The Panda Project | Low profile semiconductor die carrier |
US6339191B1 (en) * | 1994-03-11 | 2002-01-15 | Silicon Bandwidth Inc. | Prefabricated semiconductor chip carrier |
US6857173B1 (en) | 1998-10-26 | 2005-02-22 | Silicon Bandwidth, Inc. | Apparatus for and method of manufacturing a semiconductor die carrier |
-
1987
- 1987-07-20 JP JP17910887A patent/JPS6423560A/ja active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0323946U (ja) * | 1989-07-17 | 1991-03-12 | ||
JPH04184967A (ja) * | 1990-11-19 | 1992-07-01 | Mitsubishi Electric Corp | 半導体装置 |
US5413970A (en) * | 1993-10-08 | 1995-05-09 | Texas Instruments Incorporated | Process for manufacturing a semiconductor package having two rows of interdigitated leads |
US5824950A (en) * | 1994-03-11 | 1998-10-20 | The Panda Project | Low profile semiconductor die carrier |
US6339191B1 (en) * | 1994-03-11 | 2002-01-15 | Silicon Bandwidth Inc. | Prefabricated semiconductor chip carrier |
US6828511B2 (en) | 1994-03-11 | 2004-12-07 | Silicon Bandwidth Inc. | Prefabricated semiconductor chip carrier |
US6977432B2 (en) | 1994-03-11 | 2005-12-20 | Quantum Leap Packaging, Inc. | Prefabricated semiconductor chip carrier |
US6857173B1 (en) | 1998-10-26 | 2005-02-22 | Silicon Bandwidth, Inc. | Apparatus for and method of manufacturing a semiconductor die carrier |
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