JPS6428854A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6428854A
JPS6428854A JP62184220A JP18422087A JPS6428854A JP S6428854 A JPS6428854 A JP S6428854A JP 62184220 A JP62184220 A JP 62184220A JP 18422087 A JP18422087 A JP 18422087A JP S6428854 A JPS6428854 A JP S6428854A
Authority
JP
Japan
Prior art keywords
pins
package
wise
yield
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62184220A
Other languages
Japanese (ja)
Inventor
Satoshi Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Japan Radio Co Ltd
Original Assignee
New Japan Radio Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New Japan Radio Co Ltd filed Critical New Japan Radio Co Ltd
Priority to JP62184220A priority Critical patent/JPS6428854A/en
Publication of JPS6428854A publication Critical patent/JPS6428854A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve the yield of production of semiconductor devices, and enable the high density mounting on a printed wiring board, by constituting a chip in a plurality of divided small scale ones, and assembling them step-wise in a package. CONSTITUTION:Lead frames 3, 3' are sealed in a package 2, and arranged step-wise. Chips 4, 4' are bonded to die islands of the frames 3, 3'. A package 2 has the respective step-parts on the outer side surfaces from which the respective pins 31, 31' protrude. The pins 31, 31' are bent downward from the surfaces of the respective step-parts. That is, inside the arrangement group of pins 31, the arrangement group of pins 31' are aligned. Thereby, the yield of production of semiconductor devices are increased, and the high density mounting on a printed wiring board is enabled.
JP62184220A 1987-07-23 1987-07-23 Semiconductor device Pending JPS6428854A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62184220A JPS6428854A (en) 1987-07-23 1987-07-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62184220A JPS6428854A (en) 1987-07-23 1987-07-23 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6428854A true JPS6428854A (en) 1989-01-31

Family

ID=16149469

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62184220A Pending JPS6428854A (en) 1987-07-23 1987-07-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6428854A (en)

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