JPS6412503A - Electronic component and manufacture thereof - Google Patents

Electronic component and manufacture thereof

Info

Publication number
JPS6412503A
JPS6412503A JP62169031A JP16903187A JPS6412503A JP S6412503 A JPS6412503 A JP S6412503A JP 62169031 A JP62169031 A JP 62169031A JP 16903187 A JP16903187 A JP 16903187A JP S6412503 A JPS6412503 A JP S6412503A
Authority
JP
Japan
Prior art keywords
film
substrate
etching
conducted
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62169031A
Other languages
Japanese (ja)
Inventor
Masanori Samejima
Kazuhisa Matsumoto
Hideyuki Tanigawa
Hiroshi Takeuchi
Kazuo Ogata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62169031A priority Critical patent/JPS6412503A/en
Publication of JPS6412503A publication Critical patent/JPS6412503A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Thermistors And Varistors (AREA)

Abstract

PURPOSE:To improve the dimensional accuracy of a film pattern by a method wherein a surface-roughing treatment is conducted only on the part where a grown film will be adhered on the surface of a substrate. CONSTITUTION:For example, a resist film 2 is formed on the region other than the film-forming part on the surface of the glass substrate 1 which is polished to the degree of approximate to mirror face by conducting a lithographic method, and the exposed part of the substrate is roughened by etching using fluoric acid. Then, a plating process is conducted in the state wherein the film 2 is left, a prescribed platinum film 3 is coated on the roughened region, and another prescribed film 3' is coated on the film 2 while the latter is being separated from the former. Subsequently, said film 3 is removed together with the film 3', and the required film 3 only is left on the substrate 1. Through these procedures, the required film pattern of a temperature sensor, for example, is obtained, the linearity of the etching for the remaining pattern becomes excellent in this case, the dimensional accuracy of the electronic part can be improved, and the generation of irregularity end the like of the value of resistance can also be prevented.
JP62169031A 1987-07-07 1987-07-07 Electronic component and manufacture thereof Pending JPS6412503A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62169031A JPS6412503A (en) 1987-07-07 1987-07-07 Electronic component and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62169031A JPS6412503A (en) 1987-07-07 1987-07-07 Electronic component and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS6412503A true JPS6412503A (en) 1989-01-17

Family

ID=15879038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62169031A Pending JPS6412503A (en) 1987-07-07 1987-07-07 Electronic component and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6412503A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009014264A1 (en) 2007-07-25 2009-01-29 Nippon Shokubai Co., Ltd. Light-shielding film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009014264A1 (en) 2007-07-25 2009-01-29 Nippon Shokubai Co., Ltd. Light-shielding film

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