JPS6414992A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPS6414992A JPS6414992A JP17070887A JP17070887A JPS6414992A JP S6414992 A JPS6414992 A JP S6414992A JP 17070887 A JP17070887 A JP 17070887A JP 17070887 A JP17070887 A JP 17070887A JP S6414992 A JPS6414992 A JP S6414992A
- Authority
- JP
- Japan
- Prior art keywords
- prescribed
- insulating layer
- paste
- points
- point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
PURPOSE:To make it possible to form a prescribed exposed point with a high positional accuracy and easily by a method wherein the whole surface of a printed substrate within a range that prescribed connecting points and the prescribed exposed point are excluded from the surface is covered with an insulating layer and a conductive paste is printed between prescribed connecting points to make the connecting points conductive to each other. CONSTITUTION:A protective film 8 consisting of an insulating layer is covered on the whole surface of a printed substrate 1 excepting prescribed connecting points 2a and 5b and a prescribed exposed point X0 to protect prescribed patterns and the surface of the substrate 1 and an oblong insulating layer 9 is coated on the film 8 on the peripheries of the point 2a and a prescribed connecting point 5a to fix the layer 9 on the film 8 on a heating condition of 90 deg.X30 minutes. Then, a conductive carbon paste 10 is printed on the layer 9 to conduct the points 2a and 5a to each other and an oblong insulating layer 11 is coated with an ink agent used in a first manufacturing process as an overcoat on the paste 10 to protect the points 2a and 5a and the paste 10.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62170708A JPH07105592B2 (en) | 1987-07-08 | 1987-07-08 | Method for manufacturing printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62170708A JPH07105592B2 (en) | 1987-07-08 | 1987-07-08 | Method for manufacturing printed wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6414992A true JPS6414992A (en) | 1989-01-19 |
JPH07105592B2 JPH07105592B2 (en) | 1995-11-13 |
Family
ID=15909926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62170708A Expired - Fee Related JPH07105592B2 (en) | 1987-07-08 | 1987-07-08 | Method for manufacturing printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07105592B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0465473U (en) * | 1990-10-15 | 1992-06-08 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61100168U (en) * | 1984-12-06 | 1986-06-26 |
-
1987
- 1987-07-08 JP JP62170708A patent/JPH07105592B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61100168U (en) * | 1984-12-06 | 1986-06-26 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0465473U (en) * | 1990-10-15 | 1992-06-08 |
Also Published As
Publication number | Publication date |
---|---|
JPH07105592B2 (en) | 1995-11-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |