JPS641077B2 - - Google Patents
Info
- Publication number
- JPS641077B2 JPS641077B2 JP19809482A JP19809482A JPS641077B2 JP S641077 B2 JPS641077 B2 JP S641077B2 JP 19809482 A JP19809482 A JP 19809482A JP 19809482 A JP19809482 A JP 19809482A JP S641077 B2 JPS641077 B2 JP S641077B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- thick film
- film pattern
- forming
- protruding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 239000000470 constituent Substances 0.000 description 11
- 230000006355 external stress Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19809482A JPS5989489A (ja) | 1982-11-11 | 1982-11-11 | 厚膜パタ−ンの形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19809482A JPS5989489A (ja) | 1982-11-11 | 1982-11-11 | 厚膜パタ−ンの形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5989489A JPS5989489A (ja) | 1984-05-23 |
JPS641077B2 true JPS641077B2 (th) | 1989-01-10 |
Family
ID=16385394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19809482A Granted JPS5989489A (ja) | 1982-11-11 | 1982-11-11 | 厚膜パタ−ンの形成方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5989489A (th) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH039988U (th) * | 1989-06-16 | 1991-01-30 | ||
JPH03148387A (ja) * | 1989-11-06 | 1991-06-25 | Yanmar Diesel Engine Co Ltd | クローラ式走行装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021256501A1 (ja) * | 2020-06-17 | 2021-12-23 | 株式会社村田製作所 | 電子部品及び電子部品の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49112162A (th) * | 1973-02-28 | 1974-10-25 | ||
JPS5081349U (th) * | 1973-11-27 | 1975-07-12 | ||
JPS54114758U (th) * | 1978-01-31 | 1979-08-11 |
-
1982
- 1982-11-11 JP JP19809482A patent/JPS5989489A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH039988U (th) * | 1989-06-16 | 1991-01-30 | ||
JPH03148387A (ja) * | 1989-11-06 | 1991-06-25 | Yanmar Diesel Engine Co Ltd | クローラ式走行装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS5989489A (ja) | 1984-05-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH035676B2 (th) | ||
JPS641077B2 (th) | ||
JPS59154054A (ja) | ワイヤおよびそれを用いた半導体装置 | |
JP3699271B2 (ja) | 半導体パッケージ及びその製造方法 | |
JP3208187B2 (ja) | 表示素子の端子引出部の製造方法 | |
JP2874184B2 (ja) | 半導体装置の製造方法 | |
JPH05136198A (ja) | 半導体装置 | |
JP2621186B2 (ja) | 転写用バンプの形成方法 | |
JPS61100981A (ja) | 半導体装置の製造方法 | |
JPH0586657B2 (th) | ||
JPH0624858Y2 (ja) | 表示パネル | |
JPS6059742B2 (ja) | 半導体装置およびその製造方法 | |
JPH037877Y2 (th) | ||
JPS6143876B2 (th) | ||
JPS6130418B2 (th) | ||
JPS63169746A (ja) | 半導体装置 | |
JPS58128869A (ja) | 薄膜感熱記録ヘツドの製造方法 | |
JPS5814746B2 (ja) | ハンドウタイソウチノセイゾウホウホウ | |
JPS60257550A (ja) | 半導体装置 | |
JPS59951A (ja) | チツプキヤリア搭載基板の2層配線構造 | |
JPS61202444A (ja) | 半導体装置の製造方法 | |
JPH0546708B2 (th) | ||
JPH09275163A (ja) | 回路基板装置及びその製造方法 | |
JPS63100751A (ja) | メタルキヤツプ封止のセラミツクパツケ−ジ | |
JPS63207156A (ja) | 半導体装置およびその製造方法 |