JPS6390870A - 金属ベ−ス配線板 - Google Patents

金属ベ−ス配線板

Info

Publication number
JPS6390870A
JPS6390870A JP61236585A JP23658586A JPS6390870A JP S6390870 A JPS6390870 A JP S6390870A JP 61236585 A JP61236585 A JP 61236585A JP 23658586 A JP23658586 A JP 23658586A JP S6390870 A JPS6390870 A JP S6390870A
Authority
JP
Japan
Prior art keywords
recess
light
circuit board
emitting element
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61236585A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0428152B2 (enExample
Inventor
Takeshi Kano
武司 加納
Munehiko Fukushima
福島　宗彦
Yoshiyuki Kuboi
窪井　良行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP61236585A priority Critical patent/JPS6390870A/ja
Publication of JPS6390870A publication Critical patent/JPS6390870A/ja
Publication of JPH0428152B2 publication Critical patent/JPH0428152B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Landscapes

  • Led Device Packages (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP61236585A 1986-10-03 1986-10-03 金属ベ−ス配線板 Granted JPS6390870A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61236585A JPS6390870A (ja) 1986-10-03 1986-10-03 金属ベ−ス配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61236585A JPS6390870A (ja) 1986-10-03 1986-10-03 金属ベ−ス配線板

Publications (2)

Publication Number Publication Date
JPS6390870A true JPS6390870A (ja) 1988-04-21
JPH0428152B2 JPH0428152B2 (enExample) 1992-05-13

Family

ID=17002812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61236585A Granted JPS6390870A (ja) 1986-10-03 1986-10-03 金属ベ−ス配線板

Country Status (1)

Country Link
JP (1) JPS6390870A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005029594A1 (fr) * 2003-09-22 2005-03-31 Fujian Joinluck Electronic Enterprise Co., Ltd. Structure de diode electroluminescente
JP2006237156A (ja) * 2005-02-23 2006-09-07 Lg Electronics Inc 光源装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005029594A1 (fr) * 2003-09-22 2005-03-31 Fujian Joinluck Electronic Enterprise Co., Ltd. Structure de diode electroluminescente
JP2006237156A (ja) * 2005-02-23 2006-09-07 Lg Electronics Inc 光源装置及びその製造方法

Also Published As

Publication number Publication date
JPH0428152B2 (enExample) 1992-05-13

Similar Documents

Publication Publication Date Title
JPS59198790A (ja) プリント配線基板
JPS6390870A (ja) 金属ベ−ス配線板
CN102117801B (zh) 高功率型发光二极管模块结构制作方法
CN102655715A (zh) 柔性印刷电路板及其制造方法
JPS6390873A (ja) 金属ベ−ス配線板の製造方法
JPS6390872A (ja) プリント配線板の製造方法
JPH04127497A (ja) 多層電子部品搭載用基板及びその製造法
JPS6390871A (ja) プリント配線板
JPS62132392A (ja) 金属ベ−ス配線基板
JPS63265494A (ja) 多層配線板
JP5066718B2 (ja) フレキシブルプリント配線板の製造方法
JPS6390899A (ja) 多層配線板の製造方法
JP2018082038A (ja) 支持板付き配線基板及びその製造方法
JPH01266790A (ja) 混成集積回路基板およびその製造方法
JPH0360191B2 (enExample)
JPH06342986A (ja) 多層回路基板構造およびその多層回路基板を用いてなる多層金属ベース基板
JPS6369633A (ja) 電気用積層板
JPS616848A (ja) 配線基板
JP2001267378A (ja) 集積ワイヤー・トレースでワイヤー・ボンディングを行うエッチング三重金属
JPH03244146A (ja) 金属ベース配線基板
JPS61239693A (ja) 多層配線板とその製法
JPS63265495A (ja) 多層配線板
JPS6168241A (ja) 金属ベ−ス金属箔張り積層板の製造方法
JPS58180084A (ja) 導電箔張り積層板の製造方法
JPH09186261A (ja) チップキャリア