JPS6386462A - ソリツド・ステ−ト・リレ−の製造方法 - Google Patents

ソリツド・ステ−ト・リレ−の製造方法

Info

Publication number
JPS6386462A
JPS6386462A JP61232883A JP23288386A JPS6386462A JP S6386462 A JPS6386462 A JP S6386462A JP 61232883 A JP61232883 A JP 61232883A JP 23288386 A JP23288386 A JP 23288386A JP S6386462 A JPS6386462 A JP S6386462A
Authority
JP
Japan
Prior art keywords
frame
circuit board
printed circuit
heat spreader
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61232883A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0579176B2 (enrdf_load_stackoverflow
Inventor
Susumu Fujiwara
藤原　享
Hiroyuki Yamamoto
弘之 山本
Hajime Deguchi
出口　肇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP61232883A priority Critical patent/JPS6386462A/ja
Publication of JPS6386462A publication Critical patent/JPS6386462A/ja
Publication of JPH0579176B2 publication Critical patent/JPH0579176B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP61232883A 1986-09-29 1986-09-29 ソリツド・ステ−ト・リレ−の製造方法 Granted JPS6386462A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61232883A JPS6386462A (ja) 1986-09-29 1986-09-29 ソリツド・ステ−ト・リレ−の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61232883A JPS6386462A (ja) 1986-09-29 1986-09-29 ソリツド・ステ−ト・リレ−の製造方法

Publications (2)

Publication Number Publication Date
JPS6386462A true JPS6386462A (ja) 1988-04-16
JPH0579176B2 JPH0579176B2 (enrdf_load_stackoverflow) 1993-11-01

Family

ID=16946333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61232883A Granted JPS6386462A (ja) 1986-09-29 1986-09-29 ソリツド・ステ−ト・リレ−の製造方法

Country Status (1)

Country Link
JP (1) JPS6386462A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2078171A2 (es) * 1993-12-28 1995-12-01 Smartpack Tecnologia S A Procedimiento de fabricacion de modulos de potencia con elementos semiconductores.
US11688823B2 (en) 2018-11-21 2023-06-27 Kabushiki Kaisha Toshiba Photocoupler

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2078171A2 (es) * 1993-12-28 1995-12-01 Smartpack Tecnologia S A Procedimiento de fabricacion de modulos de potencia con elementos semiconductores.
US11688823B2 (en) 2018-11-21 2023-06-27 Kabushiki Kaisha Toshiba Photocoupler

Also Published As

Publication number Publication date
JPH0579176B2 (enrdf_load_stackoverflow) 1993-11-01

Similar Documents

Publication Publication Date Title
JPH0922963A (ja) 半導体回路素子搭載基板フレームの製造方法
JPS6386462A (ja) ソリツド・ステ−ト・リレ−の製造方法
JPH04148553A (ja) チップ型電子部品の製造方法
JPS617692A (ja) 導体ピンの固着方法および導体ピン固着のプリント配線板
JPH0278265A (ja) リードフレームおよびそのリードフレームを使用した複合半導体装置
JPH0749804Y2 (ja) 半導体装置
JPH02122556A (ja) 半導体装置の実装方法
JPS5996759A (ja) 半導体装置
JPH0974149A (ja) 小型パッケージ及びその製造方法
JP2822446B2 (ja) 混成集積回路装置
JPS61225827A (ja) 半導体素子の実装構造
JPH0299394A (ja) メモリーカードモジュール
JPH03200393A (ja) 印刷配線板及びその製造方法
JP3175336B2 (ja) ハイブリッドｉｃのリード形成方法
JPH0513011Y2 (enrdf_load_stackoverflow)
JPH09232505A (ja) マルチチップモジュールの製造方法及びマルチチップモジュール
JP2599290Y2 (ja) ハイブリッドｉｃ
JPH0758234A (ja) 半導体装置の製造方法
JPH0231794Y2 (enrdf_load_stackoverflow)
JP3810155B2 (ja) ワイヤボンディング方法
JPS6199359A (ja) 混成集積回路装置
JPS62222644A (ja) テ−プキヤリヤ
JP2000022021A (ja) ベアチップ基板分離構造半導体モジュール
JPH02216891A (ja) 回路基板の接続方法
JPH07297363A (ja) 混成集積回路実装基板及びその部品実装方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term