JPS6384130A - ワイヤボンディング方法 - Google Patents

ワイヤボンディング方法

Info

Publication number
JPS6384130A
JPS6384130A JP61230844A JP23084486A JPS6384130A JP S6384130 A JPS6384130 A JP S6384130A JP 61230844 A JP61230844 A JP 61230844A JP 23084486 A JP23084486 A JP 23084486A JP S6384130 A JPS6384130 A JP S6384130A
Authority
JP
Japan
Prior art keywords
semiconductor chip
bonding
wire
package
stand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61230844A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0455527B2 (enExample
Inventor
Yasuhiko Shimizu
清水　靖彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP61230844A priority Critical patent/JPS6384130A/ja
Priority to US07/101,424 priority patent/US4762267A/en
Publication of JPS6384130A publication Critical patent/JPS6384130A/ja
Publication of JPH0455527B2 publication Critical patent/JPH0455527B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07533—
    • H10W72/5522—
    • H10W72/5524—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP61230844A 1986-09-29 1986-09-29 ワイヤボンディング方法 Granted JPS6384130A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP61230844A JPS6384130A (ja) 1986-09-29 1986-09-29 ワイヤボンディング方法
US07/101,424 US4762267A (en) 1986-09-29 1987-09-28 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61230844A JPS6384130A (ja) 1986-09-29 1986-09-29 ワイヤボンディング方法

Publications (2)

Publication Number Publication Date
JPS6384130A true JPS6384130A (ja) 1988-04-14
JPH0455527B2 JPH0455527B2 (enExample) 1992-09-03

Family

ID=16914172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61230844A Granted JPS6384130A (ja) 1986-09-29 1986-09-29 ワイヤボンディング方法

Country Status (2)

Country Link
US (1) US4762267A (enExample)
JP (1) JPS6384130A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5260514A (en) * 1992-02-28 1993-11-09 Lsi Logic Corporation Wire bonder and vacuum pedestal workholder for same
CN104471593B (zh) * 2012-07-12 2018-02-02 爱莎·艾伯莱有限公司 功能嵌体的制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3909933A (en) * 1973-03-30 1975-10-07 Western Electric Co Method for transferring and bonding articles
JPS5366167A (en) * 1976-11-26 1978-06-13 Hitachi Ltd Positioning method
US4583676A (en) * 1982-05-03 1986-04-22 Motorola, Inc. Method of wire bonding a semiconductor die and apparatus therefor
US4597522A (en) * 1983-12-26 1986-07-01 Kabushiki Kaisha Toshiba Wire bonding method and device

Also Published As

Publication number Publication date
JPH0455527B2 (enExample) 1992-09-03
US4762267A (en) 1988-08-09

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees