JPS638194B2 - - Google Patents
Info
- Publication number
- JPS638194B2 JPS638194B2 JP54101718A JP10171879A JPS638194B2 JP S638194 B2 JPS638194 B2 JP S638194B2 JP 54101718 A JP54101718 A JP 54101718A JP 10171879 A JP10171879 A JP 10171879A JP S638194 B2 JPS638194 B2 JP S638194B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- printed wiring
- plating
- wiring board
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 4
- 239000010970 precious metal Substances 0.000 description 6
- 229910000510 noble metal Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10171879A JPS5626490A (en) | 1979-08-09 | 1979-08-09 | Method of manufacturing printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10171879A JPS5626490A (en) | 1979-08-09 | 1979-08-09 | Method of manufacturing printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5626490A JPS5626490A (en) | 1981-03-14 |
JPS638194B2 true JPS638194B2 (ru) | 1988-02-22 |
Family
ID=14308077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10171879A Granted JPS5626490A (en) | 1979-08-09 | 1979-08-09 | Method of manufacturing printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5626490A (ru) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7844070B2 (en) | 2006-05-30 | 2010-11-30 | Sonitus Medical, Inc. | Methods and apparatus for processing audio signals |
US7682303B2 (en) * | 2007-10-02 | 2010-03-23 | Sonitus Medical, Inc. | Methods and apparatus for transmitting vibrations |
JP5649655B2 (ja) | 2009-10-02 | 2015-01-07 | ソニタス メディカル, インコーポレイテッド | 骨伝導を介して音を伝達するための口腔内装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54142637A (en) * | 1978-04-28 | 1979-11-07 | Sony Corp | Electronic-controlled cooking machine |
-
1979
- 1979-08-09 JP JP10171879A patent/JPS5626490A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54142637A (en) * | 1978-04-28 | 1979-11-07 | Sony Corp | Electronic-controlled cooking machine |
Also Published As
Publication number | Publication date |
---|---|
JPS5626490A (en) | 1981-03-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3666955B2 (ja) | 可撓性回路基板の製造法 | |
JPS638194B2 (ru) | ||
JPH08107263A (ja) | プリント配線板の製造方法 | |
KR20010065115A (ko) | 인쇄회로기판 제조방법 | |
JPH04291989A (ja) | スクリーン印刷の塗膜形成方法 | |
JPH04286389A (ja) | 回路基板の製造方法 | |
JPH02105597A (ja) | 印刷配線板およびその製造方法 | |
JPS5853890A (ja) | 電子部品のはんだ付け方法 | |
JPS592400B2 (ja) | プリント板の製造方法 | |
JPS5832798B2 (ja) | 印刷配線板の製造法 | |
JPH0563941B2 (ru) | ||
KR20030042873A (ko) | 순수금속의 레지스트 도금을 이용한 인쇄회로기판의회로형성방법 | |
JPH05251848A (ja) | プリント配線板の製造方法 | |
JPH0461396A (ja) | プリント配線板の製造方法 | |
JP2001105563A (ja) | スクリーン版およびそれを使用した配線基板の製造方法 | |
JPH01196196A (ja) | プリント配線板における半田層の形成方法 | |
JPS6464292A (en) | Manufacture of printed board | |
JPS59161672U (ja) | パタ−ンの溶接用リボン | |
JPH04106996A (ja) | 回路基板 | |
JPS639996A (ja) | ソルダレジスト層の形成方法 | |
GB2081515A (en) | Method of making printed circuit boards | |
JPH0366194A (ja) | プリント配線板の製造方法 | |
JPH02302090A (ja) | 印刷配線板およびその製造方法 | |
JPH0732309B2 (ja) | 面付け実装プリント板の製造方法 | |
JPH04279086A (ja) | プリント配線板およびその製造方法 |