JPS638130Y2 - - Google Patents

Info

Publication number
JPS638130Y2
JPS638130Y2 JP1982095026U JP9502682U JPS638130Y2 JP S638130 Y2 JPS638130 Y2 JP S638130Y2 JP 1982095026 U JP1982095026 U JP 1982095026U JP 9502682 U JP9502682 U JP 9502682U JP S638130 Y2 JPS638130 Y2 JP S638130Y2
Authority
JP
Japan
Prior art keywords
resin
mold
cavity
gate
lower mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982095026U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58195434U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9502682U priority Critical patent/JPS58195434U/ja
Publication of JPS58195434U publication Critical patent/JPS58195434U/ja
Application granted granted Critical
Publication of JPS638130Y2 publication Critical patent/JPS638130Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP9502682U 1982-06-22 1982-06-22 半導体樹脂封止装置の金型 Granted JPS58195434U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9502682U JPS58195434U (ja) 1982-06-22 1982-06-22 半導体樹脂封止装置の金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9502682U JPS58195434U (ja) 1982-06-22 1982-06-22 半導体樹脂封止装置の金型

Publications (2)

Publication Number Publication Date
JPS58195434U JPS58195434U (ja) 1983-12-26
JPS638130Y2 true JPS638130Y2 (xx) 1988-03-10

Family

ID=30227141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9502682U Granted JPS58195434U (ja) 1982-06-22 1982-06-22 半導体樹脂封止装置の金型

Country Status (1)

Country Link
JP (1) JPS58195434U (xx)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004114696A (ja) * 2003-11-28 2004-04-15 Oki Electric Ind Co Ltd モールドパッケージ及びその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4866973A (xx) * 1971-12-16 1973-09-13
JPS5436835A (en) * 1977-08-25 1979-03-17 Susumu Hirai Quiet jump shoes by installation of coil spring
JPS638130U (xx) * 1986-07-03 1988-01-20

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4963850U (xx) * 1972-09-18 1974-06-04

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4866973A (xx) * 1971-12-16 1973-09-13
JPS5436835A (en) * 1977-08-25 1979-03-17 Susumu Hirai Quiet jump shoes by installation of coil spring
JPS638130U (xx) * 1986-07-03 1988-01-20

Also Published As

Publication number Publication date
JPS58195434U (ja) 1983-12-26

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