JPS638130Y2 - - Google Patents
Info
- Publication number
- JPS638130Y2 JPS638130Y2 JP1982095026U JP9502682U JPS638130Y2 JP S638130 Y2 JPS638130 Y2 JP S638130Y2 JP 1982095026 U JP1982095026 U JP 1982095026U JP 9502682 U JP9502682 U JP 9502682U JP S638130 Y2 JPS638130 Y2 JP S638130Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- cavity
- gate
- lower mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 38
- 229920005989 resin Polymers 0.000 claims description 38
- 239000004065 semiconductor Substances 0.000 claims description 17
- 239000000725 suspension Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 7
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9502682U JPS58195434U (ja) | 1982-06-22 | 1982-06-22 | 半導体樹脂封止装置の金型 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9502682U JPS58195434U (ja) | 1982-06-22 | 1982-06-22 | 半導体樹脂封止装置の金型 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58195434U JPS58195434U (ja) | 1983-12-26 |
| JPS638130Y2 true JPS638130Y2 (US07655688-20100202-C00086.png) | 1988-03-10 |
Family
ID=30227141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9502682U Granted JPS58195434U (ja) | 1982-06-22 | 1982-06-22 | 半導体樹脂封止装置の金型 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58195434U (US07655688-20100202-C00086.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004114696A (ja) * | 2003-11-28 | 2004-04-15 | Oki Electric Ind Co Ltd | モールドパッケージ及びその製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4866973A (US07655688-20100202-C00086.png) * | 1971-12-16 | 1973-09-13 | ||
| JPS5436835A (en) * | 1977-08-25 | 1979-03-17 | Susumu Hirai | Quiet jump shoes by installation of coil spring |
| JPS638130U (US07655688-20100202-C00086.png) * | 1986-07-03 | 1988-01-20 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4963850U (US07655688-20100202-C00086.png) * | 1972-09-18 | 1974-06-04 |
-
1982
- 1982-06-22 JP JP9502682U patent/JPS58195434U/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4866973A (US07655688-20100202-C00086.png) * | 1971-12-16 | 1973-09-13 | ||
| JPS5436835A (en) * | 1977-08-25 | 1979-03-17 | Susumu Hirai | Quiet jump shoes by installation of coil spring |
| JPS638130U (US07655688-20100202-C00086.png) * | 1986-07-03 | 1988-01-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58195434U (ja) | 1983-12-26 |
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