JPS6366444B2 - - Google Patents
Info
- Publication number
- JPS6366444B2 JPS6366444B2 JP16248781A JP16248781A JPS6366444B2 JP S6366444 B2 JPS6366444 B2 JP S6366444B2 JP 16248781 A JP16248781 A JP 16248781A JP 16248781 A JP16248781 A JP 16248781A JP S6366444 B2 JPS6366444 B2 JP S6366444B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric
- oscillator
- piece
- sealing
- circumferential frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 claims description 33
- 230000001105 regulatory effect Effects 0.000 claims 1
- 230000010355 oscillation Effects 0.000 description 18
- 239000011521 glass Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000013078 crystal Substances 0.000 description 9
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16248781A JPS5863210A (ja) | 1981-10-12 | 1981-10-12 | 圧電振動子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16248781A JPS5863210A (ja) | 1981-10-12 | 1981-10-12 | 圧電振動子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5863210A JPS5863210A (ja) | 1983-04-15 |
JPS6366444B2 true JPS6366444B2 (enrdf_load_stackoverflow) | 1988-12-20 |
Family
ID=15755543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16248781A Granted JPS5863210A (ja) | 1981-10-12 | 1981-10-12 | 圧電振動子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5863210A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6070811A (ja) * | 1983-09-27 | 1985-04-22 | Matsushima Kogyo Co Ltd | 縦振動型圧電振動子と製造方法 |
JP4776554B2 (ja) * | 2007-01-22 | 2011-09-21 | 株式会社川金コアテック | すべりプレート及びそれを組み込んだすべり支承 |
-
1981
- 1981-10-12 JP JP16248781A patent/JPS5863210A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5863210A (ja) | 1983-04-15 |
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