JPS6366078B2 - - Google Patents
Info
- Publication number
- JPS6366078B2 JPS6366078B2 JP9453483A JP9453483A JPS6366078B2 JP S6366078 B2 JPS6366078 B2 JP S6366078B2 JP 9453483 A JP9453483 A JP 9453483A JP 9453483 A JP9453483 A JP 9453483A JP S6366078 B2 JPS6366078 B2 JP S6366078B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- nozzle
- circuit board
- printed circuit
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 42
- 230000001070 adhesive effect Effects 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 16
- 238000004140 cleaning Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000007664 blowing Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000006071 cream Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9453483A JPS59219983A (ja) | 1983-05-27 | 1983-05-27 | チツプ部品用の接着剤塗布装置の塗布部クリ−ニング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9453483A JPS59219983A (ja) | 1983-05-27 | 1983-05-27 | チツプ部品用の接着剤塗布装置の塗布部クリ−ニング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59219983A JPS59219983A (ja) | 1984-12-11 |
| JPS6366078B2 true JPS6366078B2 (enrdf_load_stackoverflow) | 1988-12-19 |
Family
ID=14112992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9453483A Granted JPS59219983A (ja) | 1983-05-27 | 1983-05-27 | チツプ部品用の接着剤塗布装置の塗布部クリ−ニング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59219983A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS603200A (ja) * | 1983-06-20 | 1985-01-09 | 松下電器産業株式会社 | 部品自動組立機 |
| JPS61159073U (enrdf_load_stackoverflow) * | 1985-03-23 | 1986-10-02 | ||
| JPH01317567A (ja) * | 1988-06-20 | 1989-12-22 | Miura Kogyo Kk | 気密剤の塗布方法 |
| JP2595493B2 (ja) * | 1993-03-04 | 1997-04-02 | セイコープレシジョン株式会社 | 液状物吐出装置 |
-
1983
- 1983-05-27 JP JP9453483A patent/JPS59219983A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59219983A (ja) | 1984-12-11 |
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