JPS6364079B2 - - Google Patents
Info
- Publication number
- JPS6364079B2 JPS6364079B2 JP5282080A JP5282080A JPS6364079B2 JP S6364079 B2 JPS6364079 B2 JP S6364079B2 JP 5282080 A JP5282080 A JP 5282080A JP 5282080 A JP5282080 A JP 5282080A JP S6364079 B2 JPS6364079 B2 JP S6364079B2
- Authority
- JP
- Japan
- Prior art keywords
- easily melted
- melted alloy
- holes
- patterns
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910045601 alloy Inorganic materials 0.000 claims description 33
- 239000000956 alloy Substances 0.000 claims description 33
- 238000002844 melting Methods 0.000 claims description 15
- 230000008018 melting Effects 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 230000004907 flux Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910000743 fusible alloy Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5282080A JPS56150897A (en) | 1980-04-23 | 1980-04-23 | Method of manufacturing multilayer printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5282080A JPS56150897A (en) | 1980-04-23 | 1980-04-23 | Method of manufacturing multilayer printed board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56150897A JPS56150897A (en) | 1981-11-21 |
JPS6364079B2 true JPS6364079B2 (zh) | 1988-12-09 |
Family
ID=12925475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5282080A Granted JPS56150897A (en) | 1980-04-23 | 1980-04-23 | Method of manufacturing multilayer printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56150897A (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS618996A (ja) * | 1984-06-25 | 1986-01-16 | 株式会社日立製作所 | 多層配線板の製造方法 |
JPS61252699A (ja) * | 1985-05-02 | 1986-11-10 | 株式会社日立製作所 | 多層配線板の製造方法 |
JPS62172795A (ja) * | 1986-01-24 | 1987-07-29 | 松下電器産業株式会社 | セラミツク多層基板 |
JPH01167079U (zh) * | 1989-05-02 | 1989-11-22 | ||
JPH0828583B2 (ja) * | 1992-12-23 | 1996-03-21 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 多層プリント回路基板およびその製作方法、およびボール・ディスペンサ |
-
1980
- 1980-04-23 JP JP5282080A patent/JPS56150897A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS56150897A (en) | 1981-11-21 |
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