JPS6363770A - 銅張積層板用接着剤 - Google Patents

銅張積層板用接着剤

Info

Publication number
JPS6363770A
JPS6363770A JP20835886A JP20835886A JPS6363770A JP S6363770 A JPS6363770 A JP S6363770A JP 20835886 A JP20835886 A JP 20835886A JP 20835886 A JP20835886 A JP 20835886A JP S6363770 A JPS6363770 A JP S6363770A
Authority
JP
Japan
Prior art keywords
adhesive
resin
copper
pyrogallol
gallic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20835886A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0340072B2 (enExample
Inventor
Yoshimune Matsuda
嘉宗 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RISHIYOU KOGYO KK
Risho Kogyo Co Ltd
Original Assignee
RISHIYOU KOGYO KK
Risho Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RISHIYOU KOGYO KK, Risho Kogyo Co Ltd filed Critical RISHIYOU KOGYO KK
Priority to JP20835886A priority Critical patent/JPS6363770A/ja
Publication of JPS6363770A publication Critical patent/JPS6363770A/ja
Publication of JPH0340072B2 publication Critical patent/JPH0340072B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP20835886A 1986-09-03 1986-09-03 銅張積層板用接着剤 Granted JPS6363770A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20835886A JPS6363770A (ja) 1986-09-03 1986-09-03 銅張積層板用接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20835886A JPS6363770A (ja) 1986-09-03 1986-09-03 銅張積層板用接着剤

Publications (2)

Publication Number Publication Date
JPS6363770A true JPS6363770A (ja) 1988-03-22
JPH0340072B2 JPH0340072B2 (enExample) 1991-06-17

Family

ID=16554968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20835886A Granted JPS6363770A (ja) 1986-09-03 1986-09-03 銅張積層板用接着剤

Country Status (1)

Country Link
JP (1) JPS6363770A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6872762B2 (en) * 2000-07-13 2005-03-29 Loctite (R&D) Limited Epoxy resin composition with solid organic acid
JP2008516064A (ja) * 2004-10-11 2008-05-15 ヘンケル コマンディットゲゼルシャフト アウフ アクチエン 耐老化性被覆剤および接着剤複合材料
JP2011190351A (ja) * 2010-03-15 2011-09-29 Cemedine Co Ltd フェノール樹脂・ポリビニルアセタール樹脂系接着剤

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4999637A (enExample) * 1973-01-29 1974-09-20
JPS6032875A (ja) * 1983-08-01 1985-02-20 Matsushita Electric Works Ltd 金属張積層板用接着剤

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4999637A (enExample) * 1973-01-29 1974-09-20
JPS6032875A (ja) * 1983-08-01 1985-02-20 Matsushita Electric Works Ltd 金属張積層板用接着剤

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6872762B2 (en) * 2000-07-13 2005-03-29 Loctite (R&D) Limited Epoxy resin composition with solid organic acid
JP2008516064A (ja) * 2004-10-11 2008-05-15 ヘンケル コマンディットゲゼルシャフト アウフ アクチエン 耐老化性被覆剤および接着剤複合材料
JP2011190351A (ja) * 2010-03-15 2011-09-29 Cemedine Co Ltd フェノール樹脂・ポリビニルアセタール樹脂系接着剤

Also Published As

Publication number Publication date
JPH0340072B2 (enExample) 1991-06-17

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